Summary of the 4th Workshop on Metallization for Crystalline Silicon Solar Cells

AbstractThe 4th Metallization Workshop held in May 2013 in Constance, Germany, enabled experts in metallization for crystalline silicon solar cells to obtain a clear view on the status of the technology, as well as to exchange and generate new ideas and insights. From the contributions on the workshop, it was clear that the traditional metallization technique of screenprinting Ag paste has been improved in a dramatic way over the last two years, accelerating the decrease of Ag consumption per cell while improving solar cell efficiency. This was achieved through enhanced understanding of screenprinted contacts, improving Ag pastes and evolutionary modifications to the screenprinting technique. Alternatives to screenprinting, including electroplating of Ni and Cu contacts, also continue to progress, though not quite at the same impressive rate of improvement as Ag printing

Passivation of a Metal Contact with a Tunneling Layer

AbstractThe potential of contact passivation for increasing cell performance is indicated by several results reported in the literature. However, scant characterization of the tunneling layers used for that purpose has been reported. In this paper, contact passivation is investigated by insertion of an ultra-thin AlOx layer between an n-type emitter and a Ti/Pd/Ag contact. By using a 1.5nm thick layer, an increase of the minority carrier lifetime by a factor of 2.7 is achieved. Since current-voltage measurements indicate that an ohmic behavior is conserved for AlOx layers as thick as 1.5nm, a 1.5nm AlOx layer is found to be a candidate of choice for contact passivation

Proceedings of the 8th Workshop on Metallization and Interconnection for Crystalline Silicon Solar Cells, May 13-14, 2019, Konstanz, Germany

Some 165 global experts and specialists from industry and academic institutes met at the 8th Metallization & Interconnection Workshop (MIW2019) that took place from 13 to 14 May 2019 in Konstanz, Germany. Participants from 19 countries debated results of 28 oral and 11 poster presentations. All presentations are available on www.metallizationworkshop.info as pdf documents. As in previous editions, lots of room was available for discussions and networking during the two-days program which included panel and market-place discussions as well as social events (reception, workshop dinner). These proceedings contain: a summary of the oral and poster presentations, the results of the survey conducted during the workshop, and peer-reviewed papers based on workshop contributions

Summary of the 8th Workshop on Metallization and Interconnection for Crystalline Silicon Solar Cells

This article gives a summary of the 8th Metallization and Interconnection workshop and attempts to place each contribution in the appropriate context. The field of metallization and interconnection continues to progress at a very fast pace. Several printing techniques can now achieve linewidths below 20 μm. Screen printing is more than ever the dominating metallization technology in the industry, with finger widths of 45 μm in routine mass production and values below 20 μm in the lab. Plating technology is also being improved, particularly through the development of lower cost patterning techniques. Interconnection technology is changing fast, with introduction in mass production of multiwire and shingled cells technologies. New models and characterization techniques are being introduced to study and understand in detail these new interconnection technologies

Trends in metallization and interconnection – Results of the survey conducted during the 8th Metallization and Interconnection Workshop

This paper summarizes the trends in metallization and interconnection technology in the eyes of the participants of the 8th Metallization and Interconnection Workshop. Participants were asked in a questionnaire to share their view on the future development of metallization technology, the kind of metal used for front side metallization and the future development of interconnection technology. The continuous improvement of the screen-printing technology is reflected in the high expected percentage share decreasing from 88% in three years to still 70% in ten years. The dominating front side metal in the view of the participants will be silver with an expected percentage share of nearly 70% in 2029. Regarding interconnection technologies, the experts of the workshop expect new technologies to gain significant technology shares faster. Whereas in three years soldering on busbars is expected to dominate with a percentage share of 71% it will drop in ten years to 35% in the eyes of the participants. Multiwire and shingling technologies are seen to have the highest potential with expected percentage shares of 33% (multiwire) and 16% (shingling) in ten years