A challenge for x-ray photoelectron spectroscopy characterization of Cu(In,Ga)Se2 absorbers: The accurate quantification of Ga/(Ga + In) ratio

International audienceCIGS (Cu(In,Ga)Se2) layers are among the more efficient photovoltaic absorbers for thin film solar cells and remain competitive in the worldwide landscape of solar cells devices and modules with also new emerging markets (flexible or metallic substrates, tandem, low or high band gap CIGS…). Their properties are governed by different key composition parameters, and among them the GGI ratio ([Ga]/[Ga]+[In])) which controls the gap value. Indeed, the GGI determination is an important metrological challenge at the surface of the CIGS layer, particularly before the buffer deposition. Using X-Ray Photoelectron Spectroscopy (XPS), we propose here a specific methodology to determine this ratio at the surface. In order to, a surface preparation of the CIGS by chemical treatments, combining an initial flattening by HBr:Br2:H2O etching with a finishing step performed in KCN:H2O, is implemented. This chemical engineering leads to a quasi "perfect" surface, flattened and cleared from surface oxide and selenide phase on which our XPS methodology for GGI determination is tested. The photopeaks choice to obtain the most coherent GGI ratio quantification is discussed. In particular we focus on the Ga3d-In4d region, situated in narrow binding energy domain, and discuss why this photopeak combination can be considered as the most adapted for a representative GGI determination. Quantitative fitting procedure of the Ga3d-In4d region is qualified on a reference epitaxial InxGa1-xAs layer and its implementation in the CIGS case is shown

Heterostructures multicouches pour photodetecteurs dans la gamme 1,3 a 1,6 microns

SIGLECNRS AR 10654 / INIST-CNRS - Institut de l'Information Scientifique et TechniqueFRFranc

An introduction to InP-based generic integration technology

Photonic integrated circuits (PICs) are considered as the way to make photonic systems or subsystems cheap and ubiquitous. PICs still are several orders of magnitude more expensive than their microelectronic counterparts, which has restricted their application to a few niche markets. Recently, a novel approach in photonic integration is emerging which will reduce the R&D and prototyping costs and the throughput time of PICs by more than an order of magnitude. It will bring the application of PICs that integrate complex and advanced photonic functionality on a single chip within reach for a large number of small and larger companies and initiate a breakthrough in the application of Photonic ICs. The paper explains the concept of generic photonic integration technology using the technology developed by the COBRA research institute of TU Eindhoven as an example, and it describes the current status and prospects of generic InP-based integration technology