Characteristics of 24 SARS-CoV-2-Sequenced Reinfection Cases in a Tertiary Hospital in Spain

SARS-CoV-2; Clinical features; ReinfectionSARS-CoV-2; Características clínicas; ReinfecciónSARS-CoV-2; Característiques clíniques; ReinfeccióBackground: Since the emergence of severe acute respiratory syndrome coronavirus 2 (SARS-CoV-2), the main concern is whether reinfections are possible, and which are the associated risk factors. This study aims to describe the clinical and molecular characteristics of 24 sequence-confirmed reinfection SARS-CoV-2 cases over 1 year in Barcelona (Catalonia, Spain). Methods: Patients with > 45 days between two positive PCR tests regardless of symptoms and negative tests between episodes were initially considered as suspected reinfection cases from November 2020 to May 2021. Whole-genome sequencing (WGS) was performed to confirm genetic differences between consensus sequences and for phylogenetic studies based on PANGOLIN nomenclature. Reinfections were confirmed by the number of mutations, change in lineage, or epidemiological criteria. Results: From 39 reported suspected reinfection cases, complete viral genomes could be sequenced from both episodes of 24 patients, all were confirmed as true reinfections. With a median age of 44 years (interquartile range [IQR] 32–65), 66% were women and 58% were healthcare workers (HCWs). The median days between episodes were 122 (IQR 72–199), occurring one-third within 3 months. Reinfection episodes were frequently asymptomatic and less severe than primary infections. The absence of seroconversion was associated with symptomatic reinfections. Only one case was reinfected with a variant of concern (VOC). Conclusion: Severe acute respiratory syndrome coronavirus 2 reinfections can occur in a shorter time than previously reported and are mainly found in immunocompetent patients. Surveillance through WGS is useful to identify viral mutations associated with immune evasion.This research was supported by CIBER -Consorcio Centro de Investigación Biomédica en Red- (CB 2021), Instituto de Salud Carlos III, Ministerio de Ciencia e Innovación and Unión Europea – NextGenerationEU

The SuperCam Instrument Suite on the Mars 2020 Rover: Science Objectives and Mast-Unit Description

On the NASA 2020 rover mission to Jezero crater, the remote determination of the texture, mineralogy and chemistry of rocks is essential to quickly and thoroughly characterize an area and to optimize the selection of samples for return to Earth. As part of the Perseverance payload, SuperCam is a suite of five techniques that provide critical and complementary observations via Laser-Induced Breakdown Spectroscopy (LIBS), Time-Resolved Raman and Luminescence (TRR/L), visible and near-infrared spectroscopy (VISIR), high-resolution color imaging (RMI), and acoustic recording (MIC). SuperCam operates at remote distances, primarily 2-7 m, while providing data at sub-mm to mm scales. We report on SuperCam's science objectives in the context of the Mars 2020 mission goals and ways the different techniques can address these questions. The instrument is made up of three separate subsystems: the Mast Unit is designed and built in France; the Body Unit is provided by the United States; the calibration target holder is contributed by Spain, and the targets themselves by the entire science team. This publication focuses on the design, development, and tests of the Mast Unit; companion papers describe the other units. The goal of this work is to provide an understanding of the technical choices made, the constraints that were imposed, and ultimately the validated performance of the flight model as it leaves Earth, and it will serve as the foundation for Mars operations and future processing of the data.In France was provided by the Centre National d'Etudes Spatiales (CNES). Human resources were provided in part by the Centre National de la Recherche Scientifique (CNRS) and universities. Funding was provided in the US by NASA's Mars Exploration Program. Some funding of data analyses at Los Alamos National Laboratory (LANL) was provided by laboratory-directed research and development funds

Pares scales: For Individual Study and Like-Instrument Class Instruction

Pares-Whistle

A 25 Gb/s 3D-Integrated CMOS/Silicon-Photonic Receiver for Low-Power High-Sensitivity Optical Communication

Integrating optical receivers based on double-sampling architecture exhibit a low-power alternative to those designed around transimpedance amplifiers (TIA). In this paper, we present a 3D-integrated CMOS/silicon-photonic optical receiver. The receiver features a low-bandwidth TIA integrating front-end double-sampling technique and dynamic offset modulation. The copper-pillar-based 3D-integration technology used here enables ultralow parasitics and 40 μm pitch for interconnection. We study different tradeoffs in designing an optical receiver and how to choose between a full-bandwidth TIA front-end and integrating architecture using a resistive front-end or a low-bandwidth TIA front-end. The design methodology is supported by measurements of two 3D-integrated prototypes based on a conventional TIA and a double-sampling integrating receiver. The proposed receiver architecture achieves −14.9 dBm of sensitivity and energy efficiency of 170 fJ/b at 25 Gb/s, while the conventional receiver achieves a sensitivity of −10.4 dBm and energy efficiency of 260 fJ/b at 21.2 Gb/s

Ultra Wide Micro Bumps Interconnection Matrix for High Energy Particle Detection: Process and Assembly

International audienceMicro pillars and micro bumps interconnections are considered as mature technology for 3-D integration and chip stacking. However, in the framework of high-energy particles detection as ATLAS Large Hadron Collider new tracker project at CERN, very large area array of dense interconnections with an aggressive specification of total thickness variation (TTV) of +/-2μm are required to grant successful detectors assembly process. This paper will first describe the test vehicle that has been designed on purpose for this study. The studies undertaken including lithography mapping, seed layer and electrochemical deposition (ECD) process will then be detailed introducing a model of anode intensity contribution to the overall TTV. To conclude, daisy chain electrical test results and yields after stacking using dieto-wafer approaches will be discussed with respects to process parameters

A 10Gb/s Si-photonic transceiver with 150μW 120μs-lock-time digitally supervised analog microring wavelength stabilization for 1Tb/s/mm 2 Die-to-Die Optical Networks

International audienceSilicon photonics has allowed cost reduction and performance improvement for optical interconnects for the past few years, and short-reach wavelength-division-multiplexed (WDM) links have recently emerged thanks to the introduction of microring modulators and filters [1-5]. Nevertheless, the promise of optical networks-on-chip foreseen in [1] has to face the integration challenges of scalable low-footprint elementary drivers and robust operation under heavy thermal stress due to self-heating of the cores with varying loads. This work presents a 3D-stacked CMOS-on-Si-photonic transceiver chip, which includes base building-blocks targeting die-to-die WDM optical communication for multicore processors: 10Gbps 2.5V pp OOK modulator driver, associated receiver, and digitally-supervised analog wavelength stabilization using microring heaters and remapping for 0-to-90°C operating range, for a total footprint of 0.01mm 2 per microring