Feedback Amplifier based on an Embedded HEMT in Thin-film Multilayer MCM-D Technology

In this paper a feedback amplifier circuit integrated in MCM-D (MultiChip Module with Deposited thin films) on glass technology is presented. The active device of the amplifier is a thin-film Ge (germanium) -based HEMT. The HEMT is embedded in the bottom dielectric layer of the MCM-D. The combination of passive MCM-D technology and HEMTs on Ge allows for efficient semi-monolithic integration of active devices and realization of MCMs with embedded passive and active components for amplifier circuits

0-Level packaging techniques for flip-chip mounted MMICs

Currently, the thin film microwave multi-chip module (MCM) technology offers many benefits for a compact, lightweight and low cost integration of RF and microwave circuits [see Carchon et al (1)]. This technology allows the realisation of low loss transmission lines with a variety of characteristic impedances (between 10 and 100 Ohm) up to the higher mm-wave frequencies (>50 GHz). The technology also allows mounting active circuits (such as MMICs) by e.g. flip-chip technology. However, when placing different functions closely together, an adequate shielding and also mechanical protection of the active dies may be required. For this purpose, we developed a wafer level (called 0- level) package concept using micromachined cavities to realise versatile, microwave compatible protection and shielding structures on the thin film substrate. 0-level packaging refers to packaging before separation of the dies of the thin film integration substrate. In order to illustrate this concept and the benefits in real microwave functions, the realisation of a Ka-band LNA module, including 0-level package, bias circuits and RF feedthrough structures is discussed in this contribution

Carbohydrate-deficient glycoprotein syndrome type IA (phosphomannomutase-deficiency).

The carbohydrate-deficient glycoprotein or CDG syndromes (OMIM 212065) are a recently delineated group of genetic, multisystem diseases with variable dysmorphic features. The known CDG syndromes are characterized by a partial deficiency of the N-linked glycans of secretory glycoproteins, lysosomal enzymes, and probably also membranous glycoproteins. Due to the deficiency of terminal N-acetylneuraminic acid or sialic acid, the glycan changes can be observed in serum transferrin or other glycoproteins using isoelectrofocusing with immunofixation as the most widely used diagnostic technique. Most patients show a serum sialotransferrin pattern characterized by increased di- and asialotransferrin bands (type I pattern). The majority of patients with type I are phosphomannomutase deficient (type IA), while in a few other patients, deficiencies of phosphomannose isomerase (type IB) or endoplasmic reticulum glucosyltransferase (type IC) have been demonstrated. This review is an update on CDG syndrome type IA