The Beta Generalized Exponential Distribution

We introduce the beta generalized exponential distribution that includes the beta exponential and generalized exponential distributions as special cases. We provide a comprehensive mathematical treatment of this distribution. We derive the moment generating function and the $r$th moment thus generalizing some results in the literature. Expressions for the density, moment generating function and $r$th moment of the order statistics also are obtained. We discuss estimation of the parameters by maximum likelihood and provide the information matrix. We observe in one application to real data set that this model is quite flexible and can be used quite effectively in analyzing positive data in place of the beta exponential and generalized exponential distributions

Parametric study on the solderability of etched PWB copper

The rapid advancement of interconnect technology has resulted in a more engineered approach to designing and fabricating printed wiring board (PWB) surface features. Recent research at Sandia National Laboratories has demonstrated the importance of surface roughness on solder flow. This paper describes how chemical etching was used to enhance the solderability of surfaces that were normally difficult to wet. The effects of circuit geometry, etch concentration, and etching time on solder flow are discussed. Surface roughness and solder flow data are presented. The results clearly demonstrate the importance of surface roughness on the solderability of fine PWB surface mount features

Can quantitative analysis of multi-parametric MRI independently predict failure of focal salvage HIFU therapy in men with radio-recurrent prostate cancer?

OBJECTIVES: Focal salvage HIFU is a feasible therapeutic option in some men who have recurrence after primary radiotherapy for prostate cancer. We aimed to determine if multi-parametric quantitative parameters, in addition to clinical factors, might have a role in independently predicting focal salvage HIFU outcomes. METHODS: A retrospective registry analysis included 150 consecutive men who underwent focal salvage HIFU (Sonablate500) (2006-2015); 89 had mpMRI available. Metastatic disease was excluded by nodal assessment on pelvic MRI, a radioisotope bone-scan and/or choline or FDG PET/CT scan. All men had mpMRI and either transperineal template prostate mapping biopsy or targeted and systematic TRUS-biopsy. mpMRI included T2-weighted, diffusion-weighted and dynamic contrast-enhancement. Pre-HIFU quantitative mpMRI data was obtained using Horos DICOM Viewer v3.3.5 for general MRI parameters and IB DCE v2.0 plug-in. Progression-free survival (PFS) was defined by biochemical failure and/or positive localized or distant imaging results and/or positive biopsy and/or systemic therapy and/or metastases/prostate cancer-specific death. Potential predictors of PFS were analyzed by univariable and multivariable Cox-regression. RESULTS: Median age at focal salvage HIFU was 71 years (interquartile range [IQR] 65-74.5) and median PSA pre-focal salvage treatment was 5.8ng/ml (3.8-8). Median follow-up was 35 months (23-47) and median time to failure was 15 months (7.8-24.3). D-Amico low, intermediate and high-risk disease was present in 1% (1/89), 40% (36/89) and 43% (38/89) prior to focal salvage HIFU (16% missing data). 56% (50/89) failed by the composite outcome. A total of 22 factors were evaluated on univariable and 8 factors on multivariable analysis. The following quantitative parameters were included: Ktrans, Kep, Ve, Vp, IS, rTTP and TTP. On univariable analysis, PSA, prostate volume at time of radiotherapy failure and Ve (median) value were predictors for failure. Ve represents extracellular fraction of the whole tissue volume. On multivariable analysis, only Ve (median) value remained as an independent predictor. CONCLUSIONS: One pharmacokinetic quantitative parameter based on DCE sequences seems to independently predict failure following focal salvage HIFU for radio-recurrent prostate cancer. This likely relates to the tumor microenvironment producing heat-sinks which counter the heating effect of HIFU. Further validation in larger datasets and evaluating mechanisms to reduce heat-sinks are required

An Assessment of Recent and Future Temperature Change over the Sichuan Basin, China, using CMIP5 Climate Models

The Sichuan basin is one of the most densely populated regions of China, making the area particularly vulnerable to the adverse impacts associated with future climate change. As such, climate models are important for understanding regional and local impacts of climate change and variability, like heat stress and drought. In this study, climate models from phase 5 of the Coupled Model Intercomparison Project (CMIP5) are validated over the Sichuan basin by evaluating how well each model can capture the phase, amplitude, and variability of the regionally observed mean, maximum, and minimum temperature between 1979 and 2005. The results reveal that the majority of the models do not capture the basic spatial pattern and observed means, trends, and probability distribution functions. In particular, mean and minimum temperatures are underestimated, especially during the winter, resulting in biases exceeding −3°C. Models that reasonably represent the complex basin topography are found to generally have lower biases overall. The five most skillful climate models with respect to the regional climate of the Sichuan basin are selected to explore twenty-first-century temperature projections for the region. Under the CMIP5 high-emission future climate change scenario, representative concentration pathway 8.5 (RCP8.5), the temperatures are projected to increase by approximately 4°C (with an average warming rate of +0.72°C decade−1), with the greatest warming located over the central plains of the Sichuan basin, by 2100. Moreover, the frequency of extreme months (where mean temperature exceeds 28°C) is shown to increase in the twenty-first century at a faster rate compared to the twentieth century.Funding for this research was provided by the Engineering and Physical Sciences Research Council (EPSRC) as part of the Low Carbon Climate-Responsive Heating and Cooling of Cities (LoHCool) project (EP/N009797/1)

Reduced oxide soldering activation (ROSA) PWB solderability testing

The effect of ROSA pretreatment on the solderability of environmentally stressed PWB test coupons was investigated. The PWB surface finish was an electroplated, reflowed solder. Test results demonstrated the ability to recover plated-through-hole fill of steam aged samples with solder after ROSA processing. ROSA offers an alternative method for restoring the solderability of aged PWB surfaces

Ogre and Pythia: An Invariance Proof Method for Weak Consistency Models

We design an invariance proof method for concurrent programs parameterised by a weak consistency model. The calculational design of the invariance proof method is by abstract interpretation of a truly parallel analytic semantics. This generalises the methods by Lamport and Owicki-Gries for sequential consistency. We use cat as an example of language to write consistency specifications of both concurrent programs and machine architectures

Environmentally compatible solder materials for thick film hybrid assemblies

New soldering materials and processes have been developed over the last several years to address a variety of environmental issues. One of the primary efforts by the electronics industry has involved the development of alternative solders to replace the traditional lead-containing alloys. Sandia National Laboratories is developing such alternative solder materials for printed circuit board and hybrid microcircuit (HMC) applications. This paper describes the work associated with low residue, lead-free soldering of thick film HMC`s. The response of the different materials to wetting, aging, and mechanical test conditions was investigated. Hybrid test vehicles were designed and fabricated with a variety of chip capacitors and leadless ceramic chip carriers to conduct thermal, electrical continuity, and mechanical evaluations of prototype joints. Microstructural development along the solder and thick film interface, after isothermal solid state aging over a range of elevated temperatures and times, was quantified using microanalytical techniques. Flux residues on soldered samples were stressed (temperature-humidity aged) to identify potential corrosion problems. Mechanical tests also supported the development of a solder joint lifetime prediction model. Progress of this effort is summarized

The effect of lead content and surface roughness on wetting and spreading of low-lead and no-lead solders on copper-clad FR-4 laminates

Environmental and health concerns pertaining to lead have encouraged research into low-lead alloys for electronic soldering. The development of solder alloys containing lower amounts of lead than Sn/Pb eutectic (37 wt.% lead), but possessing similar properties, is an industry-wide goal. To determine the wettability of low-lead solders, 21 alloys each of Sn/Ag and Sn/Cu eutectic (containing 0 to 10 wt.% lead and/or indium) were tested on as-received copper-clad FR-4. Contact angles for the alloys ranged from 12.5 to 38.9{degrees} and area of spread measurements ranged from 5.2 to 17.3 mm{sup 2} compared with 5 to 150 and {approximately}19 mm{sup 2}, respectively, for Sn/Pb eutectic. Alloys with 8 to 10 wt.% lead showed contact angles and areas of spread similar to Sn/Pb eutectic under similar conditions. The best results on the as-received substrates, compared to the Sn/Pb eutectic, were obtained from the Sn/Ag eutectic with 10 wt.% lead. The very low-lead (less than 10 wt.% lead) and lead-free alloys, however, failed to achieve the performance level of eutectic Sn/Pb solders. A desire to improve the spreading of very low-lead and lead-free solders provided the impetus for these efforts to produce {open_quotes}engineered{close_quotes} rough surfaces. In an attempt to improve the wettability and spreading behavior of very low-lead and lead-free alloys, the very low-lead and lead-free members of the Sn/Ag system were tested on roughened copper-clad FR-4. Every alloy in the test suite demonstrated improvement in area of spread on the roughened substrates. The best results on the roughened substrates, compared to the Sn/Pb eutectic, were obtained from the Sn/Ag eutectic with 8 wt.% lead. The effects of surface roughness on the wettability and flow behavior of solder alloys has provided insight into surface morphologies that lead to improved solderability

Contributions of team climate in the study of interprofessional collaboration: a conceptual analysis

The concept of team climate is widely used to understand and evaluate working environments. It shares some important features with Interprofessional Collaboration (IPC). The four-factor theory of climate for work group innovation, which underpins team climate, could provide a better basis for understanding both teamwork and IPC. This article examines in detail the common ground between team climate and IPC, and assesses the relevance of team climate as a theoretical approach to understanding IPC. There are important potential areas of overlap between team climate and IPC that we have grouped under four headings: (1) interaction and communication between team members; (2) common objectives around which collective work is organised; (3) responsibility for performing work to a high standard; and (4) promoting innovation in working practices. These overlapping areas suggest common characteristics that could provide elements of a framework for considering the contribution of team climate to collaborative working, both from a conceptual perspective and, potentially, in operational terms as, for example, a diagnostic tool