Molecular beam epitaxy of metamorphic buffer for InGaAs/InP photodetectors with high photosensitivity in the range of 2.2–2.6 um

The present work is concerned with finding optimal technological conditions for the synthesis of heterostructures with a metamorphic buffer for InGaAs/InP photodetectors in the wavelength range of 2.2–2.6 um using molecular beam epitaxy. Three choices of buffer structure differing in design and growth parameters were proposed. The internal structure of the grown samples was investigated by X-ray diffraction and transmission electron microscopy. Experimental data analysis has shown that the greatest degree of elastic strain relaxation in the InGaAs active layer was achieved in the sample where the metamorphic buffer formation ended with a consecutive increase and decrease in temperature. The said buffer also had InAs/InAlAs superlattice inserts. The dislocation density in this sample turned out to be minimal out of three, which allowed us to conclude that the described heterostructure configuration appears to be the most appropriate for manufacturing of short wavelength infrared range pin-photodetectors with high photosensitivity

Defect properties of InGaAsN layers grown as sub-monolayer digital alloys by molecular beam epitaxy

International audienceThe defect properties of InGaAsN dilute nitrides grown as sub-monolayer digital alloys (SDAs) by molecular beam epitaxy for photovoltaic application were studied by space charge capacitance spectroscopy. Alloys of i-InGaAsN (Eg = 1.03 eV) were lattice-matched grown on GaAs wafers as a superlattice of InAs/GaAsN with one monolayer of InAs (<0.5 nm) between wide GaAsN (7–12 nm) layers as active layers in single-junction solar cells. Low p-type background doping was demonstrated at room temperature in samples with InGaAsN layers 900 nm and 1200 nm thick (less 1 × 1015 cm−3). According to admittance spectroscopy and deep-level transient spectroscopy measurements, the SDA approach leads to defect-free growth up to a thickness of 900 nm. An increase in thickness to 1200 nm leads to the formation of non-radiative recombination centers with an activation energy of 0.5 eV (NT = 8.4 × 1014 cm−3) and a shallow defect level at 0.20 eV. The last one leads to the appearance of additional doping, but its concentration is low (NT = 5 × 1014 cm−3) so it does not affect the photoelectric properties. However, further increase in thickness to 1600 nm, leads to significant growth of its concentration to (3–5) × 1015 cm−3, while the concentration of deep levels becomes 1.3 × 1015 cm−3. Therefore, additional free charge carriers appearing due to ionization of the shallow level change the band diagram from p-i-n to p-n junction at room temperature. It leads to a drop of the external quantum efficiency due to the effect of pulling electric field decrease in the p-n junction and an increased number of non-radiative recombination centers that negatively impact lifetimes in InGaAsN