Device for Protection Against Transient and Temporary Overvoltage Including Limitation of the Specific Energy

An arrangement is presented which ensures protection against transient and line frequency overvoltage and limits the load on the consumer to a minimum even in case of transient currents. The arrangement consists of a special arrester in the shunt circuit, a fast switch in the series circuit as well as a control and measuring device. The design, mode of operation and parameters of the components of the arrangement are described based on different loads. The protective effect is discussed

Quench dynamics across quantum critical points

We study the quantum dynamics of a number of model systems as their coupling constants are changed rapidly across a quantum critical point. The primary motivation is provided by the recent experiments of Greiner et al. (Nature 415, 39 (2002)) who studied the response of a Mott insulator of ultracold atoms in an optical lattice to a strong potential gradient. In a previous work (cond-mat/0205169), it had been argued that the resonant response observed at a critical potential gradient could be understood by proximity to an Ising quantum critical point describing the onset of density wave order. Here we obtain numerical results on the evolution of the density wave order as the potential gradient is scanned across the quantum critical point. This is supplemented by studies of the integrable quantum Ising spin chain in a transverse field, where we obtain exact results for the evolution of the Ising order correlations under a time-dependent transverse field. We also study the evolution of transverse superfluid order in the three dimensional case. In all cases, the order parameter is best enhanced in the vicinity of the quantum critical point.Comment: 10 pages, 6 figure

Absolute differential cross sections for electron-impact excitation of CO near threshold: II. The Rydberg states of CO

Absolute differential cross sections for electron-impact excitation of Rydberg states of CO have been measured from threshold to 3.7 eV above threshold and for scattering angles between 20° and 140°. Measured excitation functions for the b 3Σ+, B 1Σ+ and E 1π states are compared with cross sections calculated by the Schwinger multichannel method. The behaviour of the excitation functions for these states and for the j 3Σ+ and C 1Σ+ states is analysed in terms of negative-ion states. One of these resonances has not been previously reported

Laser structuring of thin layers for flexible electronics by a shock wave-induced delamination process

The defect-free laser-assisted structuring of thin films on flexible substrates is a challenge for laser methods. However, solving this problem exhibits an outstanding potential for a pioneering development of flexible electronics. Thereby, the laser-assisted delamination method has a great application potential. At the delamination process: the localized removal of the layer is induced by a shock wave which is produced by a laser ablation process on the rear side of the substrate. In this study, the thin-film patterning process is investigated for different polymer substrates dependent on the material and laser parameters using a KrF excimer laser. The resultant structures were studied by optical microscopy and white light interferometry (WLI). The delamination process was tested at different samples (indium tin oxide (ITO) on polyethylene terephthalate (PET), epoxy-based negative photoresist (SU8) on polyimide (PI) and indium tin oxide/copper indium gallium selenide/molybdenum (ITO/CIGS/Mo) on PI

Laser-Induced front Side Etching: An Easy and Fast Method for Sub-μm Structuring of Dielectrics

Laser-induced front side etching (LIFE) is a method for the nanometer-precision structuring of dielectrics, e.g. fused silica, using thin metallic as well as organic absorber layer attached to the laser-irradiated front side of the sample. As laser source an excimer laser with a wavelength of 248 nm and an pulse duration of 25 ns was used. For sub-μm patterning a phase mask illuminated by the top hat laser beam was projected by a Schwarzschild objective. The LIFE process allows the fabrication of well-defined and smooth surface structures with sub-μm lateral etching regions (Δx < 350 nm) and vertical etching depths from 1 nm to sub-mm

Laser Embossing of Micro-and Submicrometer Surface Structures in Copper

Micro- and submicrometer structures have been transferred from nickel foils into solid copper surfaces by laser microembossing. The developed arrangement for laser microembossing allows a large-area replication using multi- pulse laser scanning scheme, guaranties a low contamination of the embossed surface and enables the utilization of thick workpieces. In the micrometer range the replicated patterns feature a high accuracy regarding the shape. A significant difference between the master and the replication pattern could be observed for the laser embossing of submicrometer patterns. In conclusion, the results show that the proposed laser embossing process is a promising method with a number of applications in microengineering