155 research outputs found

    Analysis of profit of generation company in power market

    Get PDF
    In recent decades, the operation of power systems in the power market model has been researched and applied by many countries. The profit of generation companies is always interested in research to ensure operation and balance of power market. This paper studies and analysis profit of generation companies to participate in the power market. In addition, this paper has analyzed the participation of new generation in the power market with 39-bus IEEE power system

    Light Absorption and Photoluminescence Quenching Properties of Bulk Heterojunction Materials Based on the Blend of Poly(n-vinylcarbazole)/poly(n-hexylthiophen)

    Get PDF
    The enhancement of light absorption and photoluminescence quenching properties of the bulk heterojunction systems which were fabricated using poly(N-vinylcarbazole) (PVK); poly(N-hexylthiophene)(P3HT) and fullerene derivative 1-(3-methoxycarbonyl) propyl-1-phenyl-[6,6] C61 (PCBM) were investigated. The optimized material showed a broad absorption in the region from ultra violet to near infra-red and the luminescence quenching higher than 90%. The obtained results provide further insight into photophysics of the heterojunction system and device performance improvement by using this system as an active layer

    Thermoresistance of p-Type 4H–SiC Integrated MEMS Devices for High-Temperature Sensing

    Get PDF
    There is an increasing demand for the development and integration of multifunctional sensing modules into power electronic devices that can operate in high temperature environments. Here, the authors demonstrate the tunable thermoresistance of p‐type 4H–SiC for a wide temperature range from the room temperature to above 800 K with integrated flow sensing functionality into a single power electronic chip. The electrical resistance of p‐type 4H–SiC is found to exponentially decrease with increasing temperature to a threshold temperature of 536 K. The temperature coefficient of resistance (TCR) shows a large and negative value from −2100 to −7600 ppm K−1, corresponding to a thermal index of 625 K. From the threshold temperature of 536–846 K, the electrical resistance shows excellent linearity with a positive TCR value of 900 ppm K−1. The authors successfully demonstrate the integration of p–4H–SiC flow sensing functionality with a high sensitivity of 1.035 μA(m s−1)−0.5 mW−1. These insights in the electrical transport of p–4H–SiC aid to improve the performance of p–4H–SiC integrated temperature and flow sensing systems, as well as the design consideration and integration of thermal sensors into 4H–SiC power electronic systems operating at high temperatures of up to 846 K

    Response Surface Designs Robust against Nuisance Factors

    Get PDF
    This paper discusses an algorithmic approach to constructing trend-free and orthogonally-blocked response surface designs. The constructed designs have the main effects, 2-factor interactions and second-order effects being orthogonal or near-orthogonal to the nuisance factors such as the time-trend or the blocking factors. The paper also provides a catalogue of (near-) trend-free Box–Behnkens designs and orthogonally blocked Box–Behnkens designs arranged in rows and columns

    Preparation and characterization of magnesium hydroxyapatite coatings on 316L stainless steel

    Get PDF
    Magnesium hydroxyapatite coatings (MgHAp) were deposited on the surface of 316L stainless steel (316L SS) substrates by electrodeposition technique. Different concentrations of Mg2+ ion were incorporated into the apatite structure by adding Mg(NO3)2 into electrolyte solution containing 3×10-2 M Ca(NO3)2, 1.8×10-2 M NH4H2PO4 and   6×10-2 M NaNO3. With Mg2+ concentration 1×10-3 M, the obtained coatings have 0.2 wt% Mg2+. The influences of scanning potential ranges, scanning times to deposit MgHAp coatings were researched. The analytical results FTIR, SEM, X-ray, EDX, thickness and adhension strength showed that MgHAp coatings were single phase of HAp, fibrous shapes, thickness 8.1 µm and adhesion strength 7.20 MPa at the scanning potential ranges of 0÷-1.7 V/SCE and scanning times of 5 scans. Keywords. 316L SS, Electrodeposition, MgHAp

    Investigation of Energy Transfer in a Blend of electroluminescent Conducting Polymers

    Get PDF
    With the aim of improving the photonic efficiency of an organic light emitting diode a blend of electroluminescent polymers, poly[9-vinylcarbarzole] (PVK) and poly[2-methoxy-5-(2-ethylhexyloxy)-1,4-phenylenevinylene] (MEH-PPV) was prepared. The energy transfer in the blend was investigated through the comparison of absorption, photoluminescence (PL) and current-voltage (I-V) characteristics of the blend and standard polymers. The obtained results showed that energy transfer from PVK to MEH-PPV enable to form localized excited-state complexes (e.g. exciplexes) in MEH-PPV. The PL intensity of the blended polymers was enhanced as the relative content of MEH-PPV was increased, and particularly, the highest improved PL was observed for an weight fraction of 15 wt{\%} of MEH-PPV in PVK. Organic light emitting diodes made from these blends would exhibit a large photonic efficiency

    Endoparasites in pigs raised in smallholder farms in Hung Yen province of Vietnam

    Get PDF
    As being part of an ongoing project, assessing animal health and food safety risks in smallholder pig value chains in Hung Yen province of Vietnam, the presence of endoparasites was investigated in a repeated study. Three communes, with a total of 545 smallhoder pig farms, from three districts were selected. In each commune, ten farms were randomly chosen. On farm data including farm management and biosecurity measures were recorded by using a checklist and observations. From each farm, one pooled fecal sample was collected from a randomly chosen barn monthly and followed from June to December 2014 for seven months. Fecal samples were analyzed for intestinal parasites by floatation and sedimentation methods. The intensity of most commonly seen parasites was determined by the McMaster counting technique. In 198 collected fecal samples, six types of parasites were detected, namely Eimeria 89 (44.95%), Ascaris suum 43 (21.72%), Strongyloides sp. 41 (20.71%), Trichocephalus suis 19 (9.60%), Fasciolopsis buski 10 (5.05%), and Fasciola 2 (1.01%). Highest intensities were observed for Eimeria (maximum 80900 oocyst/g), followed by Ascaris suum (2400 egg/g), Strongyloides sp. (1900 egg/g), and Trichocephalus suis (1300 egg/g); the others were reported at much lower intensities. Infection levels and intensities of the parasites tended to be higher during the hot months, June to September. No significant difference between communes was found. At least one type of parasites was present in 137 samples (69.19%). Most of farms (96.67%) were positive for at least one type of parasites in at least one sample. There was a significant difference in infection level of endoparasites between biogas and non-biogas farms. The general high parasite burden reported in this study will be addressed in future interventions which will include parasite control apart from other measures

    Designs for Screening Experiments with Quantitative Factors

    Get PDF
    Most screening experiments in chemometrics and science are quantitative, i.e. continuous factors. These factors should be 3-level and the designs for these experiments should also be 3-level. However, popular designs for screening experiments are still Plackett-Burman designs (PBDs) and 2-level fractional factorial designs (FFDs) such as resolution III and resolution IV FFDs. This chapter introduces the conference matrices as an alternative to PBDs and resolution III FFDs and definitive screening designs, a conference matrix-based class of designs, as an alternative to resolution IV FFDs. A table of conference matrices of up to order 32 and examples are also provided for illustration

    Nano strain-amplifier: making ultra-sensitive piezoresistance in nanowires possible without the need of quantum and surface charge effects

    Get PDF
    This paper presents an innovative nano strain-amplifier employed to significantly enhance the sensitivity of piezoresistive strain sensors. Inspired from the dogbone structure, the nano strain-amplifier consists of a nano thin frame released from the substrate, where nanowires were formed at the centre of the frame. Analytical and numerical results indicated that a nano strain-amplifier significantly increases the strain induced into a free standing nanowire, resulting in a large change in their electrical conductance. The proposed structure was demonstrated in p-type cubic silicon carbide nanowires fabricated using a top down process. The experimental data showed that the nano strain-amplifier can enhance the sensitivity of SiC strain sensors at least 5.4 times larger than that of the conventional structures. This result indicates the potential of the proposed strain-amplifier for ultra-sensitive mechanical sensing applications.Comment: 4 pages, 5 figure

    A rapid and cost-effective metallization technique for 3C-SiC MEMS using direct wire bonding

    Get PDF
    This paper presents a simple, rapid and cost-effective wire bonding technique for single crystalline silicon carbide (3C–SiC) MEMS devices. Utilizing direct ultrasonic wedge–wedge bonding, we have demonstrated for the first time the direct bonding of aluminum wires onto SiC films for the characterization of electronic devices without the requirement for any metal deposition and etching process. The bonded joints between the Al wires and the SiC surfaces showed a relatively strong adhesion force up to approximately 12.6–14.5 mN and excellent ohmic contact. The bonded wire can withstand high temperatures above 420 K, while maintaining a notable ohmic contact. As a proof of concept, a 3C–SiC strain sensor was demonstrated, where the sensing element was developed based on the piezoresistive effect in SiC and the electrical contact was formed by the proposed direct-bonding technique. The SiC strain sensor possesses high sensitivity to the applied mechanical strains, as well as exceptional repeatability. The work reported here indicates the potential of an extremely simple direct wire bonding method for SiC for MEMS and microelectronic applications
    corecore