Marking Electrical Wiring With Condition Indicators

A method is provided for marking electrical Wiring with condition indicators. One or more markers are added to one or both of the insulative material and a surface of an electrical conductor such that it bonds thereto. Each marker is capable of emanating into a surrounding atmospheric environment as a gaseous effluent in response to a specific condition experienced by the electrical conductor

Wire Crimp Termination Verification Using Ultrasonic Inspection

The development of a new ultrasonic measurement technique to quantitatively assess wire crimp terminations is discussed. The amplitude change of a compressional ultrasonic wave propagating through the junction of a crimp termination and wire is shown to correlate with the results of a destructive pull test, which is a standard for assessing crimp wire junction quality. Various crimp junction pathologies such as undercrimping, missing wire strands, incomplete wire insertion, partial insulation removal, and incorrect wire gauge are ultrasonically tested, and their results are correlated with pull tests. Results show that the nondestructive ultrasonic measurement technique consistently (as evidenced with destructive testing) predicts good crimps when ultrasonic transmission is above a certain threshold amplitude level. A physics-based model, solved by finite element analysis, describes the compressional ultrasonic wave propagation through the junction during the crimping process. This model is in agreement within 6% of the ultrasonic measurements. A prototype instrument for applying this technique while wire crimps are installed is also presented. The instrument is based on a two-jaw type crimp tool suitable for butt-splice type connections. Finally, an approach for application to multipin indenter type crimps will be discussed

Ultrasonic Inspection to Quantify Failure Pathologies of Crimped Electrical Connections

Previous work has shown that ultrasonic inspection provides a means of assessing electrical crimp quality that ensures the electrical and mechanical integrity of an initial crimp before the installation process is completed. The amplitude change of a compressional ultrasonic wave propagating at right angles to the wire axis and through the junction of a crimp termination was shown to correlate with the results of destructive pull tests, which is a standard for assessing crimp wire junction quality. Of additional concern are crimps made at high speed assembly lines for wiring harnesses, which are used for critical applications, such as in aircraft. During high-speed assembly it is possible that many faulty crimps go undetected until long after assembly, and fail in service. The position and speed of the crimping jaw become factors as the high-speed crimp is formed. The work presented in this paper is designed to cover the more difficult and more subtle area of high-speed crimps by taking into account the rate change of the measurements. Building on the previous work, we present an analysis methodology, based on transmitted ultrasonic energy and timing of the first received pulse that is shown to correlate to the gauge of the crimp/ferrule combination and the position of the crimping jaw. Results demonstrating the detectability of a number of the crimp failure pathologies, such as missing strands, partially inserted wires and incomplete crimp compression, are presented. The ability of this technique to estimate crimp height, a mechanical measure of crimp quality, is discussed

Measuring Vapors To Monitor the State of Cure of a Resin

A proposed noninvasive method of monitoring the cure path and the state of cure of an epoxy or other resin involves measurement of the concentration( s) of one or more compound(s) in the vaporous effluent emitted during the curing process. The method is based on the following general ideas: (1) The concentrations of the effluent compounds in the vicinity of the curing resin are approximately proportional to the instantaneous rate of curing. (2) As curing proceeds at a given temperature, subsequent decreases in the concentrations are indicative of approaching completion of cure; that is, the lower are the concentrations, the more nearly complete is the cure

The Application of Ultrasonic Inspection to Crimped Electrical Connections

The development of a new ultrasonic measurement technique to quantitatively assess wire crimp terminations is discussed. The development of a prototype instrument, based on a modified, commercially available, crimp tool, is demonstrated for applying this technique when wire crimps are installed. The crimp tool has three separate crimping locations that accommodate the three different ferrule diameters. The crimp tool in this study is capable of crimping wire diameters ranging from 12 to 26 American Wire Gauge (AWG). A transducer design is presented that allows for interrogation of each of the three crimp locations on the crimp tool without reconfiguring the device. An analysis methodology, based on transmitted ultrasonic energy and timing of the first received pulse is shown to correlate to both crimp location in the tool and the AWG of the crimp/ferrule combination. The detectability of a number of the crimp failure pathologies, such as missing strands, partially inserted wires and incomplete crimp compression, is discussed. A wave propagation model, solved by finite element analysis, describes the compressional ultrasonic wave propagation through the junction during the crimping process

A Method For The Verification Of Wire Crimp Compression Using Ultrasonic Inspection

The development of a new ultrasonic measurement technique to assess quantitatively wire crimp terminations is discussed. The amplitude change of a compressional ultrasonic wave propagating at right angles to the wire axis and through the junction of a crimp termination is shown to correlate with the results of a destructive pull test, which is a standard for assessing crimp wire junction quality. To demonstrate the technique, the case of incomplete compression of crimped connections is ultrasonically tested, and the results are correlated with pull tests. Results show that the nondestructive ultrasonic measurement technique consistently predicts good crimps when the ultrasonic transmission is above a certain threshold amplitude level. A quantitative measure of the quality of the crimped connection based on the ultrasonic energy transmitted is shown to respond accurately to crimp quality. A wave propagation model, solved by finite element analysis, describes the compressional ultrasonic wave propagation through the junction during the crimping process. This model is in agreement within 6% of the ultrasonic measurements. A prototype instrument for applying this technique while wire crimps are installed is also presented. The instrument is based on a two-jaw type crimp tool suitable for butt-splice type connections. A comparison of the results of two different instruments is presented and shows reproducibility between instruments within a 95% confidence bound

Assessment and Calibration of a Crimp Tool Equipped with Ultrasonic Analysis Features

A method is provided for calibrating ultrasonic signals passed through a crimp formed with respect to a deformable body via an ultrasonically-equipped crimp tool (UECT). The UECT verifies a crimp quality using the ultrasonic signals. The method includes forming the crimp, transmitting a first signal, e.g., a pulse, to a first transducer of the UECT, and converting the first signal, using the first transducer, into a second signal which defines an ultrasonic pulse. This pulse is transmitted through the UECT into the crimp. A second transducer converts the second signal into a third signal, which may be further conditioned, and the ultrasonic signals are calibrated using the third signal or its conditioned variant. An apparatus for calibrating the ultrasonic signals includes a pulse module (PM) electrically connected to the first and second transducers, and an oscilloscope or display electrically connected to the PM for analyzing an electrical output signal therefrom

Status of Thermal NDT of Space Shuttle Materials at NASA

Since the Space Shuttle Columbia accident, NASA has focused on improving advanced NDE techniques for the Reinforced Carbon-Carbon (RCC) panels that comprise the orbiter's wing leading edge and nose cap. Various nondestructive inspection techniques have been used in the examination of the RCC, but thermography has emerged as an effective inspection alternative to more traditional methods. Thermography is a non-contact inspection method as compared to ultrasonic techniques which typically require the use of a coupling medium between the transducer and material. Like radiographic techniques, thermography can inspect large areas, but has the advantage of minimal safety concerns and the ability for single-sided measurements. Details of the analysis technique that has been developed to allow insitu inspection of a majority of shuttle RCC components is discussed. Additionally, validation testing, performed to quantify the performance of the system, will be discussed. Finally, the results of applying this technology to the Space Shuttle Discovery after its return from the STS-114 mission in July 2005 are discussed

A Digital, Constant-Frequency Pulsed Phase-Locked-Loop Instrument for Real-Time, Absolute Ultrasonic Phase Measurements

A digitally controlled instrument for conducting single-frequency and swept-frequency ultrasonic phase measurements has been developed based on a constant-frequency pulsed phase-locked-loop (CFPPLL) design. This instrument uses a pair of direct digital synthesizers to generate an ultrasonically transceived tone-burst and an internal reference wave for phase comparison. Real-time, constant-frequency phase tracking in an interrogated specimen is possible with a resolution of 0.000 38 rad (0.022), and swept-frequency phase measurements can be obtained. Using phase measurements, an absolute thickness in borosilicate glass is presented to show the instruments efficacy, and these results are compared to conventional ultrasonic pulse-echo time-of-flight (ToF) measurements. The newly developed instrument predicted the thickness with a mean error of 0.04 m and a standard deviation of error of 1.35 m. Additionally, the CFPPLL instrument shows a lower measured phase error in the absence of changing temperature and couplant thickness than high-resolution cross-correlation ToF measurements at a similar signal-to-noise ratio. By showing higher accuracy and precision than conventional pulse-echo ToF measurements and lower phase errors than cross-correlation ToF measurements, the new digitally controlled CFPPLL instrument provides high-resolution absolute ultrasonic velocity or path-length measurements in solids or liquids, as well as tracking of material property changes with high sensitivity. The ability to obtain absolute phase measurements allows for many new applications than possible with previous ultrasonic pulsed phase-locked loop instruments. In addition to improved resolution, swept-frequency phase measurements add useful capability in measuring properties of layered structures, such as bonded joints, or materials which exhibit non-linear frequency-dependent behavior, such as dispersive media