31 research outputs found
Highly integrated power electronic converters using active devices embedded in printed-circuit board
International audienceIn this paper, we present a short overview of the power dies interconnects based on PCB technology, then we focus on embedding of power dies in the PCB material. In the second part of the article, we present in details the technology we developed to embed dies in PCB. Results show that the electrical performance of the die remains satisfying after embedding, but that dies with a copper topside metal layer are required for this process
EDT for Power Devices
International audienceThis presentation gives an overview of the packaging requirements for power electronics, especially in terms of thermal aspects. Then, it briefly describes the state-of-the-art in the topic of advanced Printed-Circuit-Board (PCB) use in power electronics. Finally, the embedding technology developed in the 3DPHI platform is presente
Le changement en français : études de linguistique diachronique
Les textes réunis dans ce recueil traitent des grands changements qu'a connus le français depuis ses origines, en abordant les différents niveaux de l'analyse linguistique dans une perspective diachronique
Caractérisation de céramiques CaCu3Ti4O12 : comparaison entre échantillons massifs et films épais
Caractérisation de céramiques CaCu3Ti4O12 : comparaison entre échantillons massifs et films épais
Le changement en français : études de linguistique diachronique
Les textes réunis dans ce recueil traitent des grands changements qu'a connus le français depuis ses origines, en abordant les différents niveaux de l'analyse linguistique dans une perspective diachronique
Comparison of topside contact layouts for power dies embedded in PCB
International audienceEmbedding of power semiconductor dies in PCB is a very attractive technology, especially to achieve interconnects with a very low parasitic inductance and resistance. In this paper, we focus on the contact resistance and current distribution in a large (6Ă—6mm 2) diode embedded in PCB, as a function of the layout of its topside contact. We demonstrate that by choosing a suitable contact layout, it is possible to achieve a very low contact resistance