Fibers and Conductive Films Using Silver Nanoparticles and Nanowires by Near-Field Electrospinning Process

The silver nanowires (AgNWs) and silver nanoparticles (AgNPs) were synthesized. With near-field electrospinning (NFES) process, fibers and thin films with AgNPs and AgNWs were fabricated. In the NFES process, 10 k voltage was applied and the AgNPs and AgNWs fibers can be directly orderly collected without breaking and bending. Then, the characteristics of the fibers were analyzed by four-point probe and EDS. The conductive film was analyzed. When the thickness of films with AgNWs and AgNPs was 1.6 µm, the sheet resistance of films was 0.032 Ω/sq which was superior to that of the commercial ITO. The transmissivity of films was analyzed. The transmissivity was inversely proportional to sheet resistance of the films. In the future, the fibers and films can be used as transparent conductive electrodes

Improvement of the Thermal Conductivity and Mechanical Properties of 3D-Printed Polyurethane Composites by Incorporating Hydroxylated Boron Nitride Functional Fillers

Recently, the use of fused deposition modeling (FDM) in the three-dimensional (3D) printing of thermal interface materials (TIMs) has garnered increasing attention. Because fillers orient themselves along the direction of the melt flow during printing, this method could effectively enhance the thermal conductivity of existing composite materials. However, the poor compatibility and intensive aggregation of h-BN fillers in polymer composites are still detrimental to their practical application in thermally conductive materials. In this study, hydroxyl-functionalized boron nitride (OH-BN) particles were prepared by chemical modification and ultrasonic-assisted liquid-phase exfoliation to explore their impact on the surface compatibility, mechanical properties and the final anisotropic thermal conductivity of thermoplastic polyurethane (TPU) composites fabricated by FDM printing. The results show that the surface-functionalized OH-BN fillers are homogeneously dispersed in the TPU matrix via hydrogen bonding interactions, which improve the interfacial adhesion between the filler and matrix. For the same concentration of loaded filler, the OH-BN/TPU composites exhibit better mechanical properties and thermal conductivities than composites incorporating non-modified h-BN. These composites also show higher heat conduction along the stand-vertical direction, while simultaneously exhibiting a low dielectric constant and dielectric loss. This work therefore provides a possible strategy for the fabrication of thermal management polymers using 3D-printing methods

Spherical Composite Powder by Coupling Polymethyl Methacrylate and Boron Nitride via Spray Drying for Cosmetic Application

In the present study, spherical composite powder was successfully prepared via spray drying process using polymethyl methacrylate (PMMA) and hexagonal boron nitride (h-BN) powders. The pristine and as-prepared composite powders were examined using scanning electron microscopy, a particle size analyzer, oil absorption, and specific surface area analyses. These powders were then mixed with linseed oil to prepare samples for UV-Visible-Near Infrared spectroscopy investigation to determine their light absorption ability. Blank and powder-added blemish balm creams were examined using a sun protection factor tester and a thermal conductivity tester. In addition, transmittances of these creams were also evaluated. The experimental results show that spray-dried spherical composite powder exhibited good oil absorption ability. The blemish balm cream with 10 wt.% spray-dried composite powder not only exhibited superior sunscreen protection ability, but also good thermal conductivity

Tungsten Oxide Nanopowders and Nanorods Prepared by a Modified Plasma Arc Gas Condensation Technique

Tungsten oxide nanopowders and nanorods were synthesized by using a modified plasma arc gas condensation technique that involved the introduction of a mixed gas with controllable partial O2 pressure into a gas condensation system. Experimental results showed that yellow and blue tungsten oxide nanopowders, prepared under an Ar to O2 ratios of 1: 1 and 100: 1, exhibited a major WO3 phase and W19O55 phase, respectively. The nanopowders grew into W5O14-phase nanorods along the [001] direction when H2 was used as the reduction gas. [doi:10.2320/matertrans.M2009068

Application of Upper Extremity Radionuclide Venography as a Diagnostic Approach for Port-A Catheter Thrombosis

To investigate the role of upper extremity radionuclide venography as a potential diagnostic modality in the assessment of venous thrombosis associated with a Port-A catheter. Methods: Fourteen symptomatic patients who had received Port-A catheter implantation were enrolled. A dynamic nuclear medicine flow study was performed with intravenous administration of Technetium-99m macroaggregated albumin to both upper extremities. Imaging patterns of the venous system were categorized as patency, partial obstruction, and total occlusion. Results: The findings of the dynamic images clearly demonstrated clinical problems. Three patients were free of a definite venous flow change. Three patients had partial obstruction of venous return. A significant cut-off of venous return was demonstrated in 8 patients, and total occlusions were hence diagnosed. All patients underwent this procedure smoothly without any complication. Conclusion: These results suggest that upper extremity radionuclide venography is an easily performed and effective method for diagnosing Port-A catheter thrombosis in clinical practice

A Low-Temperature Alumina/Copper Diffusion Bonding Process using La-Doped Titanium Interlayers

Ceramic-to-metal heterojunctions have been established to improve high-temperature stability for applications in aerospace and harsh environments. In this work, we employed low-temperature diffusion bonding to realize an alumina/Cu heterogeneous joint. Using a thin layer of lanthanum-doped titanium (La-doped Ti) to metallize the alumina surface, we achieved the bonding at a temperature range of 250⁻350 °C. We produced a uniform, thermally stable, and high-strength alumina/Cu joint after a hot-press process in vacuum. Signals from X-ray diffraction (XRD) suggested the successful diffusion of Ti and La into the alumina substrate, as Ti can easily substitute Al in alumina, and La has a better oxygen affinity than that of Al. The transmission electron microscopy and XRD results also showed the existence of CuxTiyO phases without CuxTiy or LaOx. In addition, the bonding strength of alumina/copper hot-pressed at 250, 300, and 350 °C were 7.5, 9.8 and 15.0 MPa, respectively. The process developed in this study successfully lowered the bonding temperature for the alumina/copper joint