Field-effect silicon-plasmonic photodetector for coherent T-wave reception

Plasmonic internal photoemission detectors (PIPED) have recently been shown to combine compact footprint and high bandwidth with monolithic co-integration into silicon photonic circuits, thereby opening an attractive route towards optoelectronic generation and detection of waveforms in the sub-THz and THz frequency range, so-called T-waves. In this paper, we further expand the PIPED concept by introducing a metal-oxide-semiconductor (MOS) interface with an additional gate electrode that allows to control the carrier dynamics in the device and the degree of internal photoemission at the metal-semiconductor interfaces. We experimentally study the behavior of dedicated field-effect (FE-)PIPED test structures and develop a physical understanding of the underlying principles. We find that the THz down-conversion efficiency of FE-PIPED can be significantly increased when applying a gate potential. Building upon the improved understanding of the device physics, we further perform simulations and show that the gate field increases the carrier density in the conductive channel below the gate oxide to the extent that the device dynamics are determined by ultra-fast dielectric relaxation rather than by the carrier transit time. In this regime, the bandwidth can be increased to more than 1 THz. We believe that our experiments open a new path towards understanding the principles of internal photoemission in plasmonic structures, leading to PIPED-based optoelectronic signal processing systems with unprecedented bandwidth and efficiency

Photonic-Electronic Ultra-Broadband Signal Processing: Concepts, Devices, and Applications

Combining photonic integrated circuits (PIC) with millimeter-wave electronics opens novel perspectives in generation and detection of ultra-broadband signals with disruptive potential for a wide variety of applications. Here, we will give an overview on our recent progress in the field of ultra-broadband photonic-electronic signal processing, covering device concepts such as silicon plasmonic integration, signal processing concepts such as Kramers-Kronig-based phase reconstruction of THz signals, as well as application demonstrations in the field of high-speed wireless data transmission