Thinning with lime sulphur - effect on flowers or on leaves?

Behandlung von nicht nur der Blüten aber auch die Rosettenblätter mit Schwefelkalk vergrößert nicht den Ausdünnungseffekt. Das Entfernen (einen Teil) der Rosettenblätter verringerte den Fruchtansatz ein wenig aber vergrößerte den Junifall stark. Die Schlussfolgerung war das Schwefelkalk ausdünnend wirkt durch Verbrennung der Blüte und nicht durch Schädigung der Blätter. In diesem Fall mit Handsprühgerät, wann die Blumen gut getroffen werden mit Schwefelkalk, ist die Ausdünnung sehr gut

Effectivity of lime sulphur as a flower thinning agent

Unter 3 verschiedenen Bedingungen wurde die Blütenausdünnung vom Schwefelkalk untersucht. Die Wirkung wechselt von 12 bis 40% abhängig von Spritzgerät, Anwendungszeit und Wassermenge. Die Daten nach Junifall sind gestört durch schweren Apfelsägewespenbefall. Durch die Spritzungen ist die Dünnungsarbeit im Juli kaum verringert, aber die Chance auf Blütenknospen für das nächste Jahr verbessert. Über Nebenwirkungen von dieser Anwendung von Schwefelkalk ist noch zu melden: keine Blattbeschädigung, keine Berostung und 0,4 Samen weniger pro Frucht

A 40 Gb/s InP-monolithically integrated DPSK-demolulator enhanced by cross-gain-compensation in an SOA

We fabricated and experimentally tested a novel monolithically integrated Indium Phosphide optical circuit for differential phase-shift keying demodulation, which is robust to noise degradations of the received signal. The circuit consists of a one-bit-delay interferometer that demodulates the incoming signal and a semiconductor optical amplifier where the constructive and destructive demodulated outputs synchronously counter-propagate experiencing a reshaping effect. The novel optical circuit has been fabricated for 40 Gb/s signals, and the amplitude signal restoration is demonstrated by comparing the obtained output eye diagrams with those of a commercial fiber-based demodulator. We find a net improvement in the signal to noise ratio when the circuit is fed with a noisy input signal

Multiple sclerosis is linked to MAPK(ERK) overactivity in microglia

Reassessment of published observations in patients with multiple sclerosis (MS) suggests a microglial malfunction due to inappropriate (over)activity of the mitogen-activated protein kinase pathway ERK (MAPKERK). These observations regard biochemistry as well as epigenetics, and all indicate involvement of this pathway. Recent preclinical research on neurodegeneration already pointed towards a role of MAPK pathways, in particular MAPKERK. This is important as microglia with overactive MAPK have been identified to disturb local oligodendrocytes which can lead to locoregional demyelination, hallmark of MS. This constitutes a new concept on pathophysiology of MS, besides the prevailing view, i.e., autoimmunity. Acknowledged risk factors for MS, such as EBV infection, hypovitaminosis D, and smoking, all downregulate MAPKERK negative feedback phosphatases that normally regulate MAPKERK activity. Consequently, these factors may contribute to inappropriate MAPKERK overactivity, and thereby to neurodegeneration. Also, MAPKERK overactivity in microglia, as a factor in the pathophysiology of MS, could explain ongoing neurodegeneration in MS patients despite optimized immunosuppressive or immunomodulatory treatment. Currently, for these patients with progressive disease, no effective treatment exists. In such refractory MS, targeting the cause of overactive MAPKERK in microglia merits further investigation as this phenomenon may imply a novel treatment approach

The 243 steps of making photonic integrated circuits in InP

The fabrication ofInP-based Photonic Integrated Circuits (PICs) is a complex process. The process used in the COBRA cleanroom in Eindhoven consists of 13 deposition, 10 lithography, 14 dry- and 7 wet-etching steps. Together with the intermediate cleaning, preparation and inspection procedures, the total process flow consists of 243 steps. In this paper we show how we created a robust modular process flow that can be usedfor a large variety of active- and passive circuits. These circuits can be fabricated together in multi-project wafer runs, allowing a drastic reduction of the fabrication costs making even small-volume production economicallyfeasible

The 243 steps of making photonic integrated circuits in InP

The fabrication ofInP-based Photonic Integrated Circuits (PICs) is a complex process. The process used in the COBRA cleanroom in Eindhoven consists of 13 deposition, 10 lithography, 14 dry- and 7 wet-etching steps. Together with the intermediate cleaning, preparation and inspection procedures, the total process flow consists of 243 steps. In this paper we show how we created a robust modular process flow that can be usedfor a large variety of active- and passive circuits. These circuits can be fabricated together in multi-project wafer runs, allowing a drastic reduction of the fabrication costs making even small-volume production economicallyfeasible

A monolithic 20GHz integrated extended cavity mode-locked quantum well ring laser at 1.58µm fabricated in the JEPPIX platform

We report on a passively modelocked InP/InGaAsP quantum well semiconductor ring laser which operates at 20GHz repetition rate and at 1.58µm output wavelength. A number of devices with varying relative positions of the absorbers and amplifiers have been realized using active-passive integration technology in the JEPPIX fabrication platform. The 4mm-long laser ring cavity incorporates a 750µm-long optical amplifier section, a separate 40µm-long saturable absorber section, passive waveguide sections and a passive MMI-type 50% output coupler. We investigate operation regimes of the laser and explore conditions for single mode lasing and mode-locked operation