9 research outputs found

    Dynamic Transient Response of Viscoelastic Structures

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    This chapter focuses on investigating the dynamic transient response of viscoelastic structures. First, the influence of nonviscous modes on the vibrational response of exponentially damped systems has been studied on lumped parameter systems where the analytical solution has been derived by modal superposition and by means of Laplace transformation. Then, the analytical solution is obtained by modal superposition and compared to two numerical solutions derived for continuous systems by finite element formulations. These numerical solutions have been solved by modal superposition and by direct integration applying through a particularly built method together with the Newmark method. Finally, an experimental procedure for studying the influence that geometrical properties of viscoelastic joints have on the vibrational response of a metallic beam doubly supported on viscoelastic adhesive joints has been developed

    Dynamic Characterization of Adhesive Materials for Vibration Control

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    This chapter focuses on the dynamic characterization of adhesive materials for vibration control proposes. First, the experimental characterization and modelization of the relaxation and complex moduli of the flexible adhesive ISR 70-03 by means of a dynamic mechanical thermal analysis technique (DMTA) are presented. Then, the interconversion path between the relaxation modulus E ( t ) and the corresponding complex modulus E * ( ω ) for linear viscoelastic solid materials is explored. In contrast to other approximate methods, in this work the fast Fourier transform (FFT) algorithm is directly applied on relaxation functions. Finally, an experimental study for the structural noise and vibration reduction in a cabin elevator by means of adhesive-bonded joints of panels is presented

    Familien parte hartzea eskolan. Kasu baten azterketa: La Salle Isasi ikastetxea.

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    66 p. : il. -- Bibliogr.: p. 53-56[EUS] Gradu Amaierako Lan honetan 2019-2020 ikasturtean Eibarko La Salle Isasi ikastetxean, familien parte hartzea zelakoa den aztertu da. Horretarako; hasieran, familiei buruzko zenbait alderdi teoriko; familia kontzeptua, familia motak, familien gaur egungo egoera … azaldu dira bilaketa bibliografiko baten bidez. Horrela, alderdi praktikoan barneratu aurretik, familien egoera eta gaur egun arte jasandako aldaketak ezagutzeko aukera eduki dut. Ondoren, ikastetxeko ikasleen familiei inkesta bat pasatu zaie haien parte hartzea zelakoa den baloratu ahal izateko eta ikastetxeari buruz duten ikuspegia zein den ezagutzeko. Horrez gain, ikasleen tutoreei ere beste inkesta bat pasatu zaie familien parte hartzea balora dezaten. Azterketa horretan, zenbait datu atera dira familiek zein tutoreek eskainitakoak eta grafikoen bidez islatuak izan direnak. Datu horiei esker, zenbait ondorio atera dira eta horiek hobetzeko proposamenak sortu.[ES] En este Trabajo de Fin de Grado, se ha analizado la participación de las familias de la escuela La Salle Isasi durante el curso escolar 2019-2020. Para ello; primero, se han explicado algunos aspectos teóricos acerca de las familias a través de una búsqueda bibliográfica; el concepto de familia, tipos de familia, situación actual de las familias ... De este modo, antes de adentrarnos en el aspecto práctico, he podido conocer el estado de las familias y los cambios que han experimentado hasta la fecha. Posteriormente, a las familias de los alumnos de dichos colegios se les ha enviado una encuesta para evaluar su participación y sus opiniones acerca de la escuela. Además, los tutores de los alumnos también realizaron una encuesta para evaluar la participación familiar. En este estudio, se extrajeron algunos datos que nos facilitaron las familias y los tutores, los cuales se reflejan en unos gráficos. Estos datos han llevado a una serie de conclusiones y propuestas para mejorarlos.[EN] In this Final Degree Project, the participation of the families of La Salle Isasi school in Eibar during the 2019-2020 school year has been analysed. For this analysis; first of all, some theoretical aspects about the family have been explained through a bibliographic search; family concept, types of family, the current situation of the families ... In this way, before entering the practical aspect, I have been able to know the status of the families and the changes they have experienced to date. Subsequently, a survey was sent to the families of the students of these schools to evaluate their participation and their opinions about the school. In addition, the students´ tutors also conducted a survey to evaluate family participation. In this study, some data were extracted that were provided to us by families and tutors, which are reflected in graphs. These data have led to a series of conclusions and proposals to improve them

    Introducing the Electronic Knowledge Framework into the Traditional Automotive Suppliers’ Industry: From Mechanical Engineering to Mechatronics

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    The automotive sector is undergoing radical changes. New trends such as electrification, autonomous driving, connectivity, and car-sharing—to name a few—are disturbing the carmakers, which must satisfy their clients while meeting the increasingly strict environmental regulations. This pressure also falls on automotive parts suppliers, which now are asked to manufacture high-added-value integral systems, while struggling to keep a very adjusted price. As traditional automotive components evolve into electronic systems, suppliers must gain digital mastery to remain competitive. This paper presents different ways of introducing e-skills in a company and illustrates this with some examples from the Basque automotive industry. The aim is to encourage corporations to take the step towards digitalization, providing different options for them to choose the one that best suits their current scenario. For this study we have analyzed the literature and the press releases of the component manufacturers and interviewed staff from some of them. This research seeks to provide solutions so that the automotive sector remains competitive, as it is a strategic sector for the economy and employment.This work has been partially supported by the grant ‘Ayudas para el desarrollo de proyectos de I+D mediante la contratación de personas doctoradas y la realización de doctorados industriales, programa BIKAINTEK 2019’, by the Department of Economic Development, Sustainability and Environment of the Basque Government. Additionally, this work has been partially supported by Eusko Jaularitza-Gobierno Vasco (HAZITEK ESTRATEGICOS 2020 ZL-2020/00022-PILAR-y 2021 ZL-2021/00931-COMMUTE-), by CDTI (IDI-20201264) and FEDER funds

    Next-Generation Pedal: Integration of Sensors in a Braking Pedal for a Full Brake-by-Wire System

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    This article presents a novel approach to designing and validating a fully electronic braking pedal, addressing the growing integration of electronics in vehicles. With the imminent rise of brake-by-wire (BBW) technology, the brake pedal requires electronification to keep pace with industry advancements. This research explores technologies and features for the next-generation pedal, including low-power consumption electronics, cost-effective sensors, active adjustable pedals, and a retractable pedal for autonomous vehicles. Furthermore, this research brings the benefits of the water injection technique (WIT) as the base for manufacturing plastic pedal brakes towards reducing cost and weight while enhancing torsional stiffness. Communication with original equipment manufacturers (OEMs) has provided valuable insights and feedback, facilitating a productive exchange of ideas. The findings include two sensor prototypes utilizing inductive technology and printed-ink gauges. Significantly, reduced power consumption was achieved in a Hall-effect sensor already in production. Additionally, a functional BBW prototype was developed and validated. This research presents an innovative approach to pedal design that aligns with current electrification trends and autonomous vehicles. It positions the braking pedal as an advanced component that has the potential to redefine industry standards. In summary, this research significantly contributes to the electronic braking pedal technology presenting the critical industry needs that have driven technical studies and progress in the field of sensors, electronics, and materials, highlighting the challenges that component manufacturers will inevitably face in the forthcoming years.This work has been partially supported by the grant “Ayudas para el desarrollo de proyectos de I+D mediante la contratación de personas doctoradas y la realización de doctorados industriales, programa BIKAINTEK 2019” by the Department of Economic Development, Sustainability, and Environment of the Basque Government. Additionally, this work has been partially supported by the Government of Spain, through the Center for the Development of Industrial Technology (CDTI) under grant agreement IDI-20200198 and by Eusko Jaularitza-Gobierno Vasco (SOC4CRIS KK-2023/00015)

    A Robust Technique for Polymer Damping Identification Using Experimental Transmissibility Data

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    This paper presents a robust method to estimate polymers’ damping, based on modal identification methods on frequency functions. The proposed method presents great advantages compared to other traditional methods such as the HPB method for polymeric materials where high damping or noise levels can limit their use. Specifically, this new method is applied on an experimental transmissibility function measured in a composite cantilever beam and the complex modulus is determined as a function of frequency. From this, a regenerated function is obtained based on the Euler–Bernoulli beam theory, and it is compared with experimental data. It can be concluded that the best way to apply the curve-fitting method for further testing of polymeric materials is when it is used with the whole frequency range by means of the MDOF method considering the residuals. In addition, this has the added advantage that the number of experimental tests to be carried out is much lower compared to using the SDOF method
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