Grain boundary pseudopartial wetting

Usually one distinguishes partial and complete wetting of surfaces or interfaces. In case of partial wetting contact angle θ > 0 and the liquid droplet is surrounded by “dry” surface or interface. In the majority of cases the direct transition occurs from partial wetting into complete wetting, for example by increasing temperature or decreasing pressure. However, in some cases the state of pseudopartial wetting occurs between partial and complete wetting. In this case the contact angle θ > 0, the liquid droplet does not spread over the substrate, but the thin (few nm) precursor film exists around the droplet and separates substrate and gas. Such precursor film is very similar for the liquid “pancake” in case of complete wetting and deficit of the liquid phase. The pseudopartial wetting has been observed before only for liquid/liquid mixtures (alcanes/water solution of salt or glucose) or Pb and Bi on the Cu surface. We observed the pseudopartial wetting of Al/Al grain boundaries (GBs) by solid Zn in the Al – 10 wt.% Zn ultra-fine grained polycrystals. The solid Zn partially wets Al/Al GBs (with non-zero contact angle). Nevertheless, the Al/Al GBs contain the 2 nm thin uniform Zn-rich layer connected with Zn grains. Such thin layers are the reason of high ductility of ultra-fine grained Al–Zn alloys at room temperature. This phenomenon opens the way for development of novel light-weight alloys. The pseudopartieal GB wetting by a liquid phase exists also in the WC–Co hard alloys. The pseudopartieal GB wetting by various liquid and solid phases also controls the properties of Nd–Fe–B-based hard magnetic alloys

Wetting transition of grain boundaries in the Sn-rich part of the Sn-Bi phase diagram

The microstructural evolution of tin-rich Sn-Bi alloys after the grain boundary wetting phase transition in the (liquid + beta-Sn) two-phase region of the Sn-Bi phase diagram was investigated. Three Sn-Bi alloys with 30.6, 23, and 10 wt% Bi were annealed between 139 and 215 A degrees C for 24 h. The micrographs of Sn-Bi alloys reveal that the small amount of liquid phase prevented the grain boundary wetting transition to occur during annealing close to the solidus line. The melted area of the grain boundary triple junctions and grain boundaries increased with increasing the annealing temperature. When the amount of liquid phase exceeded 34 wt% during annealing, increasing temperature has not affected the wetting behavior of grain boundaries noticeably and led only to the increase of the amount of liquid phase among solid grains in the microstructure. The XRD results show that the phase structure and crystallinity remained unchanged after quenching from various annealing temperatures

Grain boundary pseudopartial wetting

Usually one distinguishes partial and complete wetting of surfaces or interfaces. In case of partial wetting contact angle θ > 0 and the liquid droplet is surrounded by “dry” surface or interface. In the majority of cases the direct transition occurs from partial wetting into complete wetting, for example by increasing temperature or decreasing pressure. However, in some cases the state of pseudopartial wetting occurs between partial and complete wetting. In this case the contact angle θ > 0, the liquid droplet does not spread over the substrate, but the thin (few nm) precursor film exists around the droplet and separates substrate and gas. Such precursor film is very similar for the liquid “pancake” in case of complete wetting and deficit of the liquid phase. The pseudopartial wetting has been observed before only for liquid/liquid mixtures (alcanes/water solution of salt or glucose) or Pb and Bi on the Cu surface. We observed the pseudopartial wetting of Al/Al grain boundaries (GBs) by solid Zn in the Al – 10 wt.% Zn ultra-fine grained polycrystals. The solid Zn partially wets Al/Al GBs (with non-zero contact angle). Nevertheless, the Al/Al GBs contain the 2 nm thin uniform Zn-rich layer connected with Zn grains. Such thin layers are the reason of high ductility of ultra-fine grained Al–Zn alloys at room temperature. This phenomenon opens the way for development of novel light-weight alloys. The pseudopartieal GB wetting by a liquid phase exists also in the WC–Co hard alloys. The pseudopartieal GB wetting by various liquid and solid phases also controls the properties of Nd–Fe–B-based hard magnetic alloys

Grain boundary pseudopartial wetting

Usually one distinguishes partial and complete wetting of surfaces or interfaces. In case of partial wetting contact angle θ > 0 and the liquid droplet is surrounded by “dry” surface or interface. In the majority of cases the direct transition occurs from partial wetting into complete wetting, for example by increasing temperature or decreasing pressure. However, in some cases the state of pseudopartial wetting occurs between partial and complete wetting. In this case the contact angle θ > 0, the liquid droplet does not spread over the substrate, but the thin (few nm) precursor film exists around the droplet and separates substrate and gas. Such precursor film is very similar for the liquid “pancake” in case of complete wetting and deficit of the liquid phase. The pseudopartial wetting has been observed before only for liquid/liquid mixtures (alcanes/water solution of salt or glucose) or Pb and Bi on the Cu surface. We observed the pseudopartial wetting of Al/Al grain boundaries (GBs) by solid Zn in the Al – 10 wt.% Zn ultra-fine grained polycrystals. The solid Zn partially wets Al/Al GBs (with non-zero contact angle). Nevertheless, the Al/Al GBs contain the 2 nm thin uniform Zn-rich layer connected with Zn grains. Such thin layers are the reason of high ductility of ultra-fine grained Al–Zn alloys at room temperature. This phenomenon opens the way for development of novel light-weight alloys. The pseudopartieal GB wetting by a liquid phase exists also in the WC–Co hard alloys. The pseudopartieal GB wetting by various liquid and solid phases also controls the properties of Nd–Fe–B-based hard magnetic alloys