Investigation of the stresses in continuous thin films and patterned lines by x-ray diffraction

Strains and stresses in aluminum thin films and patterned lines were measured using x-ray diffraction. Measurements were performed on pure aluminum and on ion-implanted aluminum, as annealed and six months after an annealing treatment. The results suggest that stresses in passivated lines, starting from an unequitriaxial state of stress, show the tendency to relax in the direction of an equitriaxial state of stress, depending on the ratio of grain size and linewidth or film thickness. The relaxation is particularly rapid in ion-implanted aluminum lines, in contradiction to the expected strengthening effect. Possible implications for electromigration resistance are discussed

Engineering Micropatterned Dry Adhesives: From Contact Theory to Handling Applications

Reversible adhesion is the key functionality to grip, place, and release objects nondestructively. Inspired by nature, micropatterned dry adhesives are promising candidates for this purpose and have attracted the attention of research groups worldwide. Their enhanced adhesion compared to nonpatterned surfaces is frequently demonstrated. An important conclusion is that the contact mechanics involved is at least as important as the surface energy and chemistry. In this paper, the roles of the contact geometry and mechanical properties are reviewed. With a focus on applications, the effects of substrate roughness and of temperature variations, and the long-term performance of micropatterned adhesives are discussed. The paper provides a link between the current, detailed understanding of micropatterned adhesives and emerging applications

Adhesion characteristics of PDMS surfaces during repeated pull-off force measurements

To mimic the adhesive effects of gecko toes, artificial surfaces have been manufactured recently using polydimethylsiloxanes (PDMS). However, the effects of repeated contacts on the adhesive properties remain largely unexplored. In this paper we report on the effect of repeated pull-off force measurements on the adhesion behavior of PDMS (polymer kit Sylgard 184, Dow Corning) tested with a borosilicate glass probe. A decrease in pull-off force with increase in number of test cycles is found until a plateau is reached. The initial value and the rate of change in pull-off force strongly depend on the sample preparation procedure, including curing time and cross-linking. It is proposed that the behavior is due to steady coverage of the probe with free oligomers. The results are crucial for developing reusable, durable, and residue-free bioinspired adhesives

Brittle-to-ductile transition in ultrathin Ta/Cu film systems

Current semiconductor technology demands the use of compliant substrates for flexible integrated circuits. However, the maximum total strain of such devices is often limited by the extensibility of the metallic components. Although cracking in thin films is extensively studied theoretically, little experimental work has been carried out thus far. Here, we present a systematic study of the cracking behavior of 34- to 506-nm-thick Cu films on polyamide with 3.5-to 19-nm-thick Ta interlayers. The film systems have been investigated by a synchrotron-based tensile testing technique and in situ tensile tests in a scanning electron microscope. By relating the energy release during cracking obtained from the stress-strain curves to the crack area, the fracture toughness of the Cu films can be obtained. It increases with Cu film thickness and decreases with increasing Ta film thickness. Films thinner than 70 nm exhibit brittle fracture, indicating an increasing inherent brittleness of the Cu film

Composite pillars with a tunable interface for adhesion to rough substrates

The benefits of synthetic fibrillar dry adhesives for temporary and reversible attachment to hard objects with smooth surfaces have been successfully demonstrated in previous studies. However, surface roughness induces a dramatic reduction in pull-off stresses and necessarily requires revised design concepts. Toward this aim, we introduce cylindrical two-phase single pillars, which are composed of a mechanically stiff stalk and a soft tip layer. Adhesion to smooth and rough substrates is shown to exceed that of conventional pillar structures. The adhesion characteristics can be tuned by varying the thickness of the soft tip layer, the ratio of the Young’s moduli and the curvature of the interface between the two phases. For rough substrates, adhesion values similar to those obtained on smooth substrates were achieved. Our concept of composite pillars overcomes current practical limitations caused by surface roughness and opens up fields of application where roughness is omnipresent

Fibrillar Elastomeric Micropatterns Create Tunable Adhesion Even to Rough Surfaces

Acknowledgements V.B., N.K.G., and E.A. contributed with conception and experimental design. V.B. performed the experiments. V.B., R.H., A.G., and R.M.M. carried out analysis and interpretation of data. V.B., R.H., A.G., and E.A. wrote the manuscript. V.B. and R.H. contributed equally to this work. V.B. acknowledges funding by SPP 1420 of the German Science Foundation DFG. E.A., N.K.G., and R.H. acknowledge funding from the European Research Council under the European Union/ERC Advanced Grant “Switch2Stick,” Agreement No. 340929.Peer reviewedPublisher PD

Elevated temperature adhesion of bioinspired polymeric micropatterns to glass

Micropatterned polymer surfaces that operate at various temperatures are required for emerging technical applications such as handling of objects or space debris. As the mechanical properties of polymers can vary significantly with temperature, adhesion performance can exhibit large variability. In the present paper, we experimentally study temperature effects on the adhesion of micropatterned adhesives (pillar length 20 μm, aspect ratios 0.4 and 2) made from three different polymers, i.e., polydimethylsiloxane (PDMS), perfluoropolyether dimethacrylate (PFPEdma), and polyurethane (PU-ht). PU specimens showed the highest pull-off stresses of about 57 kPa at 60 °C, i.e., more than twice the value of unpatterned control samples. The work of separation similarly showed a maximum at that temperature, which was identified as the glass transition temperature, Tg. PDMS and PFPEdma specimens were tested above their Tg. As a result, the adhesion properties decreased monotonically (about 50% for both materials) for temperature elevation from 20 to 120 °C. Overall, the results obtained in our study indicate that the operating temperature related to the glass transition temperature should be considered as a significant parameter for assessing the adhesion performance of micropatterned adhesives and in the technical design of adhesion devices

A Design Strategy for Mushroom-Shaped Microfibrils With Optimized Dry Adhesion: Experiments and Finite Element Analyses

Enhanced dry adhesion of micropatterned polymeric surfaces has been frequently demonstrated. Among the design parameters, the cap geometry plays an important role to improve their performance. In this study, we combined experiments on single polyurethane mushroom-shaped fibrils (with a stalk diameter of 80 µm and height of 125 µm) against flat glass, with numerical simulations implementing a cohesive zone. We found that the geometry of the mushroom cap strongly affects the interfacial crack behavior and the pull-off stress. The experimental and numerical results suggest that optimal adhesion was accompanied by the appearance of both edge and interior interfacial cracks during separation. Finite elemental analyses revealed the evolution of the interfacial stress distributions as a function of the cap thickness and confirmed the distinct detachment mechanisms. Furthermore, the effect of the stalk diameter and the Young's modulus on the adhesive force was established, resulting in an optimal design for mushroom-shaped fibrils

Internal friction in F.C.C. alloys due to solute drag on dislocations. - I. : A model for the effect of core diffusion

The internal friction (mechanical loss) behavior of dislocations is studied in a model which, for the first time, considers the substitutional solute mobility in the dislocation core to be higher than in the bulk around it. The parameters investigated include the external stress sigma xy, the solute concentration c0, the pinning length of the dislocation and the temperature. It is shown that, at low c0 and high sigma xy, the kinetics of the dislocation motion is determined by the fast diffusion of the solute atoms in the core, while for high c0 and low sigma xy, the diffusion of the atoms far away from the dislocation is rate-limiting. The results are compared with the analytica model of Schoeck and are applied to the alloy system Al-Si. New experimental results supporting the model are described in a companion paper (Paper II)