Low defect InGaAs quantum well selectively grown by metal organic chemical vapor deposition on Si(100) 300 mm wafers for next generation non planar devices

International audienc

High-Density 3D Monolithically Integrated Multiple 1T1R Multi-Level-Cell for Neural Networks

International audienc

Introducing photonic devices for 40Gbits/s wavelength division multiplexing transceivers on 300-mm SOI wafers using CMOS processes

International audienceno abstrac

Introducing photonic devices for 40Gbits/s wavelength division multiplexing transceivers on 300-mm SOI wafers using CMOS processes

International audienceno abstrac

Gate-last integration on planar FDSOI for low-VTp and low-EOT MOSFETs

International audienc

Active Interposer Technology for Chiplet-Based Advanced 3D System Architectures

International audienceWe report the first successful technology integration of chiplets on an active silicon interposer, fully processed, packaged and tested. Benefits of chiplet-based architectures are discussed. Built up technology is presented and focused on 3D interconnects process and characterization. 3D packaging is presented up to the successful structural test and characterization of the demonstrator