A dissemination strategy for immunizing scale-free networks

We consider the problem of distributing a vaccine for immunizing a scale-free network against a given virus or worm. We introduce a new method, based on vaccine dissemination, that seems to reflect more accurately what is expected to occur in real-world networks. Also, since the dissemination is performed using only local information, the method can be easily employed in practice. Using a random-graph framework, we analyze our method both mathematically and by means of simulations. We demonstrate its efficacy regarding the trade-off between the expected number of nodes that receive the vaccine and the network's resulting vulnerability to develop an epidemic as the virus or worm attempts to infect one of its nodes. For some scenarios, the new method is seen to render the network practically invulnerable to attacks while requiring only a small fraction of the nodes to receive the vaccine

Stretchable Silver Nanowire–Elastomer Composite Microelectrodes with Tailored Electrical Properties

We introduce a photolithography process compatible with soft and rigid substrates, enabling the fabrication of complex 3D interconnected patterns of silver nanowire (AgNW) networks embedded in polydimethylsiloxane (PDMS). Dimensions of the AgNW micropatterns are controlled within the film plane by photolithography, whereas thickness is controlled via a novel and uniform deposition technique using centrifugation. We report the first systematic characterization of the electromechanical properties of such microelectrodes with finest stretchable feature of 15 μm. We observe a geometry-dependent behavior of the gauge factor not only by changing the thickness of the microelectrodes, as it has been commonly reported so far, but also by varying their lateral dimensions. The presented nanocomposites exhibited sheet resistances down to 0.6 Ω/sq, gauge factors ranging from 0.01 to 100, and stretchability above 50% uniaxial strain. This versatile process allows for the production of highly sensitive strain sensors and robust high-density stretchable conductors on a wafer scale with direct implications in mass production of stretchable electronic devices