Aplicación de un recubrimiento comestible desarrollado con almidón de papa andina y carboximetilcelulosa para la reducción de lípidos durante la fritura

This work aimed to search for alternative uses for different varieties of Andean potatoes (Solanum tuberosum ssp andigenum) which have been reintroduced in north-western Argentina. Specifically, the development of simple and compound films made with hydrocolloids such as carboxymethyl-cellulose (CMC) and starch (S) extracted from Andean potatoes var. Runa, and its application as a cover in the deep frying of Andean potato chips var. Waycha was studied to minimize oil absorption. The effect of prior bleaching of the chips with different media was also evaluated: water, calcium chloride solution, and ascorbic acid. The coatings were applied to potatoes chips before being fried. The results showed that the type of oil used did not affect absorption by the chips. The bleaching treatments with calcium chloride and coating with S/CMC, showed a significant reduction in oil absorption (39.5 % ± 0.7), delayed its oxidation, and decreased the loss of tocopherols during the frying process. It also contributed to the physical and sensory characteristics of the final product, which presented high acceptability by consumers.Este trabajo tuvo como objetivo buscar alternativas de uso para diferentes variedades de papas andinas (Solanum tuberosum ssp andigenum) reintroducidas en el noroeste argentino. Específicamente, el desarrollo de películas simples y compuestas elaboradas con hidrocoloides como la carboximetilcelulosa (CMC) y el almidón (S) extraído de papa andina variedad Runa, y su aplicación como cobertura en frituras de papas andinas var. Waycha fue estudiado para minimizar la absorción de aceite. También se evaluó el efecto del blanqueo previo de las hojuelas con diferentes medios: agua, solución de cloruro de calcio y ácido ascórbico. Los recubrimientos se aplicaron a patatas fritas antes de freírlas. Los resultados mostraron que el tipo de aceite utilizado no afectó su absorción por parte de las hojuelas. Los tratamientos de blanqueo con cloruro de calcio y recubrimiento con S/CMC, mostraron una reducción significativa en la absorción de aceite (39,5 % ± 0,7), retrasaron su oxidación y disminuyeron la pérdida de tocoferoles durante el proceso de fritura. También contribuyó a las características físicas y sensoriales del producto final, que presentó alta aceptabilidad por parte de los consumidores

Los principales problemas de salud según la opinión de los usuarios

ObjetivoConocer los problemas de salud o enfermedades que los usuarios de 2 áreas básicas de salud (ABS) consideran más importantes para la población española y para sí mismos; averiguar si existe relación entre estos problemas y los que afectan a miembros de su entorno familiar y social.DiseñoEstudio observacional, transversal, descriptivo.EmplazamientoCuatro y 2 consultas de las ABS Sant Josep (L’Hospitalet de Llobregat) y San Martí (Barcelonés), respectivamente.PacientesSe incluyeron 360 pacientes mayores de 26 años que acudieron a las consultas por algún problema de salud. Los participantes fueron elegidos por muestreo aleatorio sistemático entre los meses de mayo y octubre de 2000.Mediciones y resultados principalesLos datos se obtuvieron a partir de una encuesta con 10 preguntas. En opinión de los participantes, los principales problemas de salud en la población española y para sí mismos fueron: cáncer, enfermedades cardiovasculares y sida. El cáncer (58,61%; IC del 95%, 53,53–63,69) y el sida (15,27%; IC del 95%, 11,56–18,98) fueron los problemas considerados como prioritarios para la investigación. Los problemas del aparato locomotor (22,10%; IC del 95%, 17,82–26,38), la hipertensión (14,74%; IC del 95%, 11,08–18,40) y la diabetes (13,14%, IC del 95%, 9,66–16,62) fueron los principales problemas que afirmaron tener los encuestados.ConclusionesEl cáncer y las enfermedades cardiovasculares se revelan como las que más preocupan a los encuestados y que afectan a más miembros de su entorno familiar y social. En cambio, su preocupación por el sida no refleja la realidad de dicho entorno. Con frecuencia no reconocen el problema de salud que ha motivado su visita como una verdadera enfermedad.ObjectiveTo know the health problems or diseases that patients of 2 basic health areas (BHA) assess as the most important for Spanish population and for themselves; to know if any relation exists between these problems and their existence in the family or social patients’ environment.DesignAn observational cross-sectional and descriptive studySettingFour clinics of the BHA Sant Josep (L´Hospitalet de Llobregat) and 2 clinics of the BHA Sant Martí (Barcelonés).PatientsThe sample consists of 360 patients aged above 26 years who attended clinics for some health problem. Participants were chosen by a randomised systematic sampling, from May to October 2000.Measurements and main resultsData were gathered from a questionnaire of ten items. Acording with the participants, the main problems for Spanish population and for themselves were: cancer, cardiovascular diseases and AIDS. Cancer (58,61%; 95% CI, 53,53–63,69) and AIDS (15,27%; 95% CI, 11,56–18,98) are the problems pointed out as research priorities. The aparato locomotor (22,10%; 95% CI, 17,82–26,38), hypertension (14,74%; 95% CI, 11,08–18,40) and diabetes (13,14%, 95% CI, 9,66–16,62) are the main problems suffered by the surveyed. Cancer is the disease that more participants’ relatives suffered.ConclusionsCancer and cardiovascular diseases are the pathologies that cause more concern among the surveyed and these are the diseases which mostly affect their relatives and relationships. Nevertheless their worry for the AIDS don´t show their immediate reality. Frequently, patients don´t recognize the health problem that motivated their visit as a real disease

El papel de la distancia social en el perdón de la violencia psicológica: malestar personal y coacción como respuesta de afrontamiento

Through two studies, the present investigation analyzes the process of forgiveness before a situation of psychological abuse, depending on the social distance in relation to the person who transgresses. In the first study (n = 145), the granting of forgiveness to different types of violence (physical vs. psychological). The results showed that psychological degree (vs. physical). In the second study (n = 155) pardon, discomfort or personal distress was analyzed and coercion as a coping response, as a function of social distance (actor vs. observer). The results showed that personal discomfort is related to less forgiveness, and this in turn, is related to less coercion, especially in the condition of actor (observer). Likewise, the results also showed that forgiveness mediates the relationship between personal discomfort and resolution of coercion, especially when it comes to the perspective of the actor.A través de dos estudios, la presente investigación analizar el proceso de perdón ante una situación de abuso psicológico, en función de la distancia social en relación con la persona que transgrede. En el primer estudio (n = 145), se examinó el otorgamiento de perdón ante diferentes tipos de violencia (física vs. psicológica). Los resultados mostraron que la violencia psicológica en mayor grado (vs. física). En el segundo estudio (n = 155) se analizó el perdón, el malestar o distrés personal y la coacción como respuesta de afrontamiento, en función de la distancia social (actor vs. observador). Los resultados evidenciaron que, el malestar personal se relaciona con un menor perdón, y éste a su vez, se relaciona con una menor coerción, especialmente en la condición de actor (observador). Asimismo, los resultados también evidenciaron que el perdón media la relación entre el malestar personal y la resolución de coerción, especialmente, cuando se trata de la perspectiva del actor

Complex low volume electronics simulation tool to improve yield and reliability

Assembly of Printed Circuit Boards (PCB) in low volumes and a high-mix requires a level of manual intervention during product manufacture, which leads to poor first time yield and increased production costs. Failures at the component-level and failures that stem from non-component causes (i.e. system-level), such as defects in design and manufacturing, can account for this poor yield. These factors have not been incorporated in prediction models due to the fact that systemfailure causes are not driven by well-characterised deterministic processes. A simulation and analysis support tool being developed that is based on a suite of interacting modular components with well defined functionalities and interfaces is presented in this paper. The CLOVES (Complex Low Volume Electronics Simulation) tool enables the characterisation and dynamic simulation of complete design; manufacturing and business processes (throughout the entire product life cycle) in terms of their propensity to create defects that could cause product failure. Details of this system and how it is being developed to fulfill changing business needs is presented in this paper. Using historical data and knowledge of previous printed circuit assemblies (PCA) design specifications and manufacturing experiences, defect and yield results can be effectively stored and re-applied for future problem solving. For example, past PCA design specifications can be used at design stage to amend designs or define process options to optimise the product yield and service reliability

Characterization of printed solder paste excess and bridge related defects

Surface Mount Technology (SMT) involves the printing of solder paste on to printed circuit board (PCB) interconnection pads prior to component placement and reflow soldering. This paper focuses on the solder paste deposition process. With an approximated cause ratio of 50 – 70% of post assembly defects, solder paste deposition represents the most significant cause initiator of the three sub-processes. Paradigmatic cause models, and associated design rules and effects data are extrapolated from academic and industrial literature and formulated into physical models that identify and integrate the process into three discrete solder paste deposition events - i.e. (i) stencil / PCB alignment, (ii) print stroke / aperture filling and (iii) stencil separation / paste transfer. The project’s industrial partners are producers of safety-critical products and have recognised the in-service reliability benefits of electro-mechanical interface elimination when multiple smaller circuit designs are assimilated into one larger Printed Circuit Assembly (PCA). However, increased solder paste deposition related defect rates have been reported with larger PCAs and therefore, print process physical models need to account for size related phenomena

A simulation module for supporting the manufacture of high value added electronics manufacturing

Given the global pressures and demanding requirements for high value added electronics manufacturing, it is vital to make the right decisions on the shop floor. One of the main shop floor level decisions in the domain is the selection of the most appropriate scheduling strategy for the available manufacturing system. Simulation has proved to be a powerful decision support tool. However, very few studies have used this potential to support the evaluation of scheduling strategies in a manufacturing context. A component-based simulation tool to evaluate the performance of scheduling strategies on a particular system is presented in this paper. The component based structure of the simulation tool allows the main problem requirements to be addressed. An example, based on a real company, illustrates the nature of the simulation results and the kind of support that can be obtaine

Complex Low Volume Electronics Simulation Tool to Improve Yield and Reliability

Assembly of Printed Circuit Boards (PCB) in low volumes and a high-mix requires a level of manual intervention during product manufacture, which leads to poor first time yield and increased production costs. Failures at the component-level and failures that stem from non-component causes (i.e. system-level), such as defects in design and manufacturing, can account for this poor yield. These factors have not been incorporated in prediction models due to the fact that systemfailure causes are not driven by well-characterised deterministic processes. A simulation and analysis support tool being developed that is based on a suite of interacting modular components with well defined functionalities and interfaces is presented in this paper. The CLOVES (Complex Low Volume Electronics Simulation) tool enables the characterisation and dynamic simulation of complete design; manufacturing and business processes (throughout the entire product life cycle) in terms of their propensity to create defects that could cause product failure. Details of this system and how it is being developed to fulfill changing business needs is presented in this paper. Using historical data and knowledge of previous printed circuit assemblies (PCA) design specifications and manufacturing experiences, defect and yield results can be effectively stored and re-applied for future problem solving. For example, past PCA design specifications can be used at design stage to amend designs or define process options to optimise the product yield and service reliability

A simulation module for supporting the manufacture of high value added electronics manufacturing

Given the global pressures and demanding requirements for high value added electronics manufacturing, it is vital to make the right decisions on the shop floor. One of the main shop floor level decisions in the domain is the selection of the most appropriate scheduling strategy for the available manufacturing system. Simulation has proved to be a powerful decision support tool. However, very few studies have used this potential to support the evaluation of scheduling strategies in a manufacturing context. A component-based simulation tool to evaluate the performance of scheduling strategies on a particular system is presented in this paper. The component based structure of the simulation tool allows the main problem requirements to be addressed. An example, based on a real company, illustrates the nature of the simulation results and the kind of support that can be obtaine

Characterization of printed solder paste excess and bridge related defects

Surface Mount Technology (SMT) involves the printing of solder paste on to printed circuit board (PCB) interconnection pads prior to component placement and reflow soldering. This paper focuses on the solder paste deposition process. With an approximated cause ratio of 50 – 70% of post assembly defects, solder paste deposition represents the most significant cause initiator of the three sub-processes. Paradigmatic cause models, and associated design rules and effects data are extrapolated from academic and industrial literature and formulated into physical models that identify and integrate the process into three discrete solder paste deposition events - i.e. (i) stencil / PCB alignment, (ii) print stroke / aperture filling and (iii) stencil separation / paste transfer. The project’s industrial partners are producers of safety-critical products and have recognised the in-service reliability benefits of electro-mechanical interface elimination when multiple smaller circuit designs are assimilated into one larger Printed Circuit Assembly (PCA). However, increased solder paste deposition related defect rates have been reported with larger PCAs and therefore, print process physical models need to account for size related phenomena