Enthalpies of mixing of liquid systems for lead free soldering: Al–Cu–Sn system

► First paper providing enthalpy of mixing determined by calorimetry for Al–Cu–Sn. ► Comparative discussion of values derived from KEMS data published before. ► Enthalpy of mixing at 1000 °C described for the entire ternary system Al–Cu–Sn. ► New experimental enthalpy of mixing values for the binary Al–Cu system

Enthalpy of mixing of liquid Co–Sn alloys

A literature overview of enthalpy of mixing data for liquid Co–Sn alloys shows large scattering but no clear temperature dependence. Therefore drop calorimetry was performed in the Co–Sn system at twelve different temperatures in 100 K steps in the temperature range (673 to 1773) K. The integral enthalpy of mixing was determined starting from 1173 K and fitted to a standard Redlich–Kister polynomial. In addition, the limiting partial molar enthalpy of Co in Sn was investigated by small additions of Co to liquid Sn at temperatures (673 to 1773) K. The integral and partial molar enthalpies of the Co–Sn system generally show an exothermic mixing behavior. Significant temperature dependence was detected for the enthalpies of mixing. The minimum integral enthalpy values vary with rising temperature from approx. −7820 J/mol at T = 1173 K to −1350 J/mol at T = 1773 K; the position of the minimum is between (59 and 61) at.% Co. The results are discussed and compared with literature data available for this system. X-ray studies and scanning electron microscopy of selected alloys obtained from the calorimetric measurements were carried out in order to check the completeness of the solution process