10 research outputs found

    Mechanical and Thermoelectric Properties of Bulk AlSb Synthesized by Controlled Melting, Pulverizing and Subsequent Vacuum Hot Pressing

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    Aluminum antimonide is a semiconductor of the Group III-V order. With a wide indirect band gap, AlSb is one of the least discovered of this family of semiconductors. Bulk synthesis of AlSb has been reported on numerous occasions, but obtaining a single phase has always proven to be extremely difficult. This work reports a simple method for the synthesis of single-phase AlSb. Subsequently, consolidation was done into a near single-phase highly dense semiconductor in a form usable for thermoelectric applications. Further, the thermoelectric properties of this system are accounted for the first time. In addition, the mechanical properties of the intermetallic compound are briefly discussed for a possibility of further use

    Turning SKD 11 Hardened Steel: An Experimental Study of Surface Roughness and Material Removal Rate Using Taguchi Method

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    Heat-treated steel is widely used in industrial applications due to its high strength and other desirable mechanical qualities. Grinding, which requires a lot of power and is expensive, is typically used to harden machining. In recent times, hard machining has emerged as a viable alternative to grind in select applications. In this investigation, turning operations with a carbide insert (CNMA 120408-KR3215) were carried out on SKD 11 (53 HRC) hardened steel. A total of nine machining tests were completed using the L9 orthogonal array. The response variables considered in this study were surface roughness (Ra) and material removal rate (MRR). The analysis of the signal to noise ratio reveals that the optimal combination of cutting process parameters for achieving a desired surface roughness consists of a cutting speed of 119 m/min, a feed rate of 0.11 mm/rev, and a depth of cut of 0.2 mm. The contribution of each process parameter to the machining performance of the carbide tool-work piece combination is determined through the use of ANOVA. Depth of cut has the greatest impact (57.33%) to MRR, while feed rate has the highest contribution (82.15%) to Ra. Moreover, desirability function analysis (DFA) was conducted to optimize the multiple responses. DFA suggested that, to attain a satisfactory response to the output parameters, higher range of cutting speed, depth of cut, and lower range of feed rate are appreciable; therefore, the analytical findings suggest that a cutting speed of 189 m/min, feed rate of 0.11 mm/rev, and a depth of cut of 0.5 mm can induce a favorable Ra of 0.971 μm and MRR of 10.248 cm3/min. In hard machining, cutting speed has a bigger influence on surface finish than feed rate

    Thermoelectric properties of the aliovalent half-Heusler alloy Zn0.5Ti0.5NiSb with intrinsic low thermal conductivity

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    The EPSRC is acknowledged for funding the research into new half-Heusler materials, through award (EP/N01717X/1) and for a PhD studentship for B. F. K.Using mixtures of aliovalent elements to achieve a valence balanced electronic state is a rapidly emerging area in half-Heusler thermoelectric materials research. Here, we report on Zn0.5Ti0.5NiSb, a combination of ZnNiSb and TiNiSb, which by adjusting the Zn/Ti-ratio can be made p- and n-type, achieving peak zT = 0.18 at 793 K and zT = 0.33 at 700 K, respectively. These promising values are underpinned by a low lattice thermal conductivity, κL = 2.7 W m−1 K−1 at 340 K, similar for all samples, decreasing to 1.25 W m−1 K−1 at 793 K. Transport data reveal similar weighted electronic mobilities for p- and n-type samples, suggesting similar zT should be possible. For both polarities, a transition to degenerate conduction is observed, superposed on intrinsic semiconducting behaviour with a bandgap Eg = 0.4 eV. Neutron and synchrotron X-ray diffraction experiments, including total scattering, indicate the absence of interstitial metals and do not reveal strong local structural variations. The absence of substantial mass disorder and lattice strain points towards bond disorder as a possible origin for the low κL. This work describes a new materials system and provides further insight into the impact of aliovalent alloying in the half-Heusler structure.Publisher PDFPeer reviewe

    Alloying-Induced Structural Transition in the Promising Thermoelectric Compound CaAgSb

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    AMX Zintl compounds, crystallizing in several closely related layered structures, have recently garnered attention due to their exciting thermoelectric properties. In this study, we show that orthorhombic CaAgSb can be alloyed with hexagonal CaAgBi to achieve a solid solution with a structural transformation at x ∼ 0.8. This transition can be seen as a switch from three-dimensional (3D) to two-dimensional (2D) covalent bonding in which the interlayer M–X bond distances expand while the in-plane M–X distances contract. Measurements of the elastic moduli reveal that CaAgSb1–xBix becomes softer with increasing Bi content, with the exception of a steplike 10% stiffening observed at the 3D-to-2D phase transition. Thermoelectric transport measurements reveal promising Hall mobility and a peak zT of 0.47 at 620 K for intrinsic CaAgSb, which is higher than those in previous reports for unmodified CaAgSb. However, alloying with Bi was found to increase the hole concentration beyond the optimal value, effectively lowering the zT. Interestingly, analysis of the thermal conductivity and electrical conductivity suggests that the Bi-rich alloys are low Lorenz-number (L) materials, with estimated values of L well below the nondegenerate limit of L = 1.5 × 10–8 W Ω K–2, in spite of the metallic-like transport properties. A low Lorenz number decouples lattice and electronic thermal conductivities, providing greater flexibility for enhancing thermoelectric properties

    Key properties of inorganic thermoelectric materials - tables (version 1)

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    This paper presents tables of key thermoelectric properties, which define thermoelectric conversion efficiency, for a wide range of inorganic materials. The twelve families of materials included in these tables are primarily selected on the basis of well established, internationally-recognized performance and promise for current and future applications: tellurides, skutterudites, half Heuslers, Zintls, Mg-Sb antimonides, clathrates, FeGa3-type materials, actinides and lanthanides, oxides, sulfides, selenides, silicides, borides and carbides. As thermoelectric properties vary with temperature, data are presented at room temperature to enable ready comparison, and also at a higher temperature appropriate to peak performance. An individual table of data and commentary are provided for each family of materials plus source references for all the data. © 2022 The Author(s). Published by IOP Publishing Ltd
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