海洋沉积物32Si测年方法研究

天然32Si是宇宙射线成因的,随着降水进入湖泊或海洋,被硅质生物摄取后最终存在于生物硅中。32Si来源单一,生产速率相对恒定,半衰期为150 a,可测年的时间尺度为100～1 000 a,是该时间尺度最合适的测年核素,填补了百年到千年时间尺度测年方法的空白。本文建立了海洋沉积物32Si的测量方法,主要步骤为:（1）样品前处理;（2）生物硅的分离与纯化;（3）生物硅样品中磷的分离与纯化;（4）32P的制样与β计数测量。全程通过硅钼蓝和磷钼蓝分光光度法监测实验过程硅和磷的损失情况,对南沙海域采集的沉积物岩心进行研究,得到南沙海域沉积物岩心32Si的平均活度为16.60 mBq/kg,范围值为8.39～33.34 mBq/kg;32Si在SiO2中的平均比活度为0.356 Bq/kg,32Si的核素丰度平均值为1.29×10-16 (32Si/SiO2);根据岩心32Si活度估算得深水区（水深1 335～1 537 m）和浅水区（121～141 m）岩心的沉积速率分别为0.106 cm/a、0.191 cm/a;根据32Si活度计算32Si的平均沉降通量为2.14×10-6 Bq/（cm2·a）,与参考文献的结果较为吻合。中国地质调查局项目(GZH201500207,GZH201300503,DD20160146

一种磁标记生物传感器、其制备方法以及检测方法

本发明公开了一种磁标记生物传感器，其生物探针固定层由导电层、绝缘层以及供电装置构成，绝缘层表面嵌入着多个导电单元，每个导电单元与导电层形成电连接，多个导电单元形成导电单元阵列；当供电装置供电时，经磁标记的生物探针被固定吸附在导电单元阵列表面；检测完毕后，只需停止供电，磁标记的生物探针将即刻脱离导电单元阵列，然后通过清洗处理便能够彻底清除该磁标记的生物探针。因此，本发明避免了现有技术采用化学偶联方法固定生物探针所产生的检测完毕后不能有效清除磁标记的生物探针，从而影响芯片重复利用的问题，同时能够保持现有的检测精度，是一种结构简单、使用方便、可重复利用的新型磁标记生物传感器，具有潜在的应用价值

一种磁标记生物传感器系统

本发明公开了一种磁标记生物传感器系统。该系统包括检测片、磁场施加装置、探头、微弱信号放大装置以及显示装置；其中，检测片包括无磁性基片及其表面的固定层，第一抗体、待测目标分子、第二抗体与磁性微球；探头是由磁阻传感器元件构成的惠斯登桥臂组；检测状态时，将检测片上的待测目标分子进行磁标记后置入磁场施加装置，利用探头探测磁标记的磁信号并将其转化为电信号，通过微弱信号放大装置放大后在显示装置显示。该系统集成化、小型化，能够实现对待测目标分子的自动、快速、准确、方便的检测，因此在肿瘤标志物检测、食品中残留农药或病菌检测、水体中特点微生物检测等生物传感技术领域具有优良的应用前景

一种磁标记生物检测系统及其检测方法

本发明提供了一种磁标记生物检测系统。该系统主要由磁场施加单元、磁传感单元、磁标记样品单元、磁标记样品输送单元、显示单元以及磁屏蔽单元组成。其中，磁标记样品单元与磁传感单元分别为独立单元，采用非接触式的检测方式，结构简单，可实现现场快速检测，并且磁传感单元可以重复利用，有效节约了检测成本，避免了交叉感染造成的假阳性，为快速、准确、低成本地检测待测生物分子提供了一条良好的途径，在食品安全、环境污染、肿瘤的早期筛查等领域具有良好的应用前景

電激發光材料

本發明有關於一種電激發光材料，該材料係為一種咔唑衍生物，並具有下列化學式(I)之結構。本發明之電激發光材料係以咔唑為起始物，先利用偶合反應形成帶有芳香基的中間體，而後再將硼基團引入前述中間體，以合成出具高色純度之藍光電激發光材料

Research Progresses of Copper Interconnection in Chips

本文详细介绍芯片制造中铜互连技术,综述酸性硫酸铜电镀工艺要点及常用添加剂作用机理,并概述国内外新型添加剂研究进展. 在此基础上,展望新型铜互连工艺替代酸性硫酸电镀铜工艺的可能性.In this paper, the copper interconnection technology in chip manufacturing is introduced in detail, and the essentials of acidic copper sulfate electroplating process and the mechanisms of common-used additives are reviewed. The progresses of novel additives at home and abroad are also summarized. Based on the studied achievement, the possibility of the novel copper interconnect process replacing the acidic copper electroplating is prospected.国家自然科学基金项目资助(21972118);国家自然科学基金项目资助(21827802)通讯作者:杨防祖,詹东平E-mail:[email protected];[email protected]:YANGFang-zu,ZHANDong-pingE-mail:[email protected];[email protected]固体表面物理化学国家重点实验室,厦门大学化学化工学院,福建 厦门 361005College of Chemistry and Chemical Engineering, State Key Laboratory of Physical Chemistry of Solid Surfaces, Xiamen University, Xiamen 361005, Fujian, Chin

Studies and Progresses on Hole Metallization in High-Density Interconnected Printed Circuit Boards

孔金属化互连是印制电路板（PCB）高密度集成的核心制程之一,化学镀铜和电子电镀铜是实现孔金属化的关键技术。本文介绍HDI-PCB的概念和制作流程;综述化学镀铜和电子电镀铜孔金属化互连的研究和进展,包括溶液组成和操作条件的影响,添加剂及其相互作用机理,以及盲孔填充和通孔孔壁加厚机制;展望高密度互连印制电路板电子电镀基础研究及新技术发展方向。Printed circuit boards (PCBs) are almost the core components of all electronic systems. With the rapid development of sciences and technologies, PCBs are gradually developing in the direction of multi-layer, thin and high-density wiring due to the functionalization, miniaturization, lightweight and high reliability of electronic products, as well as the widespread popularization of the subminiature package such as chip scale package (CSP) and ball grid array (BGA). Therefore, High-density interconnected printed circuit boards (HDI-PCBs) arise. Hole metallization is one of the core technologies in HDI-PCBs and includes two processes composed of conductive treatment and electron electroplating. Electroless copper plating, as one of the conductive treatment methods, not only can deposit a copper layer with excellent conductivity and adhesion, but also has more reliable process maturity. However, reducing agent formaldehyde harms human health and environment. As a relatively eco-friendly and cheap reducing agent, hypophosphite is expected to replace formaldehyde in the process of the electroless copper plating if the copper deposition rate and the coating quality can be improved. Electron copper electroplating is closely related to the electrical properties of the electronic products. With the increase of PCBs integration, the diameters of holes decrease and the aspect ratios increase, which makes blind microvia and through hole more difficult to realize the superfilling and conformal thickening, respectively. For the superfilling of blind microvia, there are some mature models. But for the conformal thickening of through hole, there is no applicable theoretical guidance, and therefore, more studies are needed. It is very important to find suitable and novel additives besides the improvement of plating conditions for electron copper electroplating. In acidic sulfate copper electron electroplating process, although there are lots of studies on the additives, the interaction mechanism of the additives still needs to be further revealed, which not only contributes to understand the molecular mechanism of various additives, but also provides theoretical basis and guidance for the design and development of novel and efficient additives. In addition, the research and development of weakly alkaline and neutral electron copper electroplating process are also important for hole metallization of HDI-PCB. This paper firstly describes the concept of HDI-PCB, and then reviews recent studies and progresses on the electroless copper plating and acidic sulfate copper electron electroplating processes, which involves the effects of bath composition and operating conditions, the interactive mechanism of additives, and the filling and thickening mechanisms of the holes. Finally, the future directions towards basic research and novel electron electroplating development are highlighted.国家自然科学基金项目(21972118)通讯作者:杨防祖,孙世刚E-mail:[email protected];[email protected]:Fang-ZuYang,Shi-GangSunE-mail:[email protected];[email protected]厦门大学化学化工学院,固体表面物理化学国家重点实验室,福建 厦门 361005College of Chemistry and Chemical Engineering, State Key Laboratory of Physical Chemistry of Solid Surfaces, Xiamen University, Xiamen 361005, Fujian Chin