Network-on-Chip

Addresses the Challenges Associated with System-on-Chip Integration Network-on-Chip: The Next Generation of System-on-Chip Integration examines the current issues restricting chip-on-chip communication efficiency, and explores Network-on-chip (NoC), a promising alternative that equips designers with the capability to produce a scalable, reusable, and high-performance communication backbone by allowing for the integration of a large number of cores on a single system-on-chip (SoC). This book provides a basic overview of topics associated with NoC-based design: communication infrastructure design, communication methodology, evaluation framework, and mapping of applications onto NoC. It details the design and evaluation of different proposed NoC structures, low-power techniques, signal integrity and reliability issues, application mapping, testing, and future trends. Utilizing examples of chips that have been implemented in industry and academia, this text presents the full architectural design of components verified through implementation in industrial CAD tools. It describes NoC research and developments, incorporates theoretical proofs strengthening the analysis procedures, and includes algorithms used in NoC design and synthesis. In addition, it considers other upcoming NoC issues, such as low-power NoC design, signal integrity issues, NoC testing, reconfiguration, synthesis, and 3-D NoC design. This text comprises 12 chapters and covers: The evolution of NoC from SoC—its research and developmental challenges NoC protocols, elaborating flow control, available network topologies, routing mechanisms, fault tolerance, quality-of-service support, and the design of network interfaces The router design strategies followed in NoCs The evaluation mechanism of NoC architectures The application mapping strategies followed in NoCs Low-power design techniques specifically followed in NoCs The signal integrity and reliability issues of NoC The details of NoC testing strategies reported so far The problem of synthesizing application-specific NoCs Reconfigurable NoC design issues Direction of future research and development in the field of NoC Network-on-Chip: The Next Generation of System-on-Chip Integration covers the basic topics, technology, and future trends relevant to NoC-based design, and can be used by engineers, students, and researchers and other industry professionals interested in computer architecture, embedded systems, and parallel/distributed systems

Advanced photon counting techniques for long-range depth imaging

The Time-Correlated Single-Photon Counting (TCSPC) technique has emerged as a candidate approach for Light Detection and Ranging (LiDAR) and active depth imaging applications. The work of this Thesis concentrates on the development and investigation of functional TCSPC-based long-range scanning time-of-flight (TOF) depth imaging systems. Although these systems have several different configurations and functions, all can facilitate depth profiling of remote targets at low light levels and with good surface-to-surface depth resolution. Firstly, a Superconducting Nanowire Single-Photon Detector (SNSPD) and an InGaAs/InP Single-Photon Avalanche Diode (SPAD) module were employed for developing kilometre-range TOF depth imaging systems at wavelengths of ~1550 nm. Secondly, a TOF depth imaging system at a wavelength of 817 nm that incorporated a Complementary Metal-Oxide-Semiconductor (CMOS) 32×32 Si-SPAD detector array was developed. This system was used with structured illumination to examine the potential for covert, eye-safe and high-speed depth imaging. In order to improve the light coupling efficiency onto the detectors, the arrayed CMOS Si-SPAD detector chips were integrated with microlens arrays using flip-chip bonding technology. This approach led to the improvement in the fill factor by up to a factor of 15. Thirdly, a multispectral TCSPC-based full-waveform LiDAR system was developed using a tunable broadband pulsed supercontinuum laser source which can provide simultaneous multispectral illumination, at wavelengths of 531, 570, 670 and ~780 nm. The investigated multispectral reflectance data on a tree was used to provide the determination of physiological parameters as a function of the tree depth profile relating to biomass and foliage photosynthetic efficiency. Fourthly, depth images were estimated using spatial correlation techniques in order to reduce the aggregate number of photon required for depth reconstruction with low error. A depth imaging system was characterised and re-configured to reduce the effects of scintillation due to atmospheric turbulence. In addition, depth images were analysed in terms of spatial and depth resolution

Intelligent Circuits and Systems

ICICS-2020 is the third conference initiated by the School of Electronics and Electrical Engineering at Lovely Professional University that explored recent innovations of researchers working for the development of smart and green technologies in the fields of Energy, Electronics, Communications, Computers, and Control. ICICS provides innovators to identify new opportunities for the social and economic benefits of society.　 This conference bridges the gap between academics and R&D institutions, social visionaries, and experts from all strata of society to present their ongoing research activities and foster research relations between them. It provides opportunities for the exchange of new ideas, applications, and experiences in the field of smart technologies and finding global partners for future collaboration. The ICICS-2020 was conducted in two broad categories, Intelligent Circuits & Intelligent Systems and Emerging Technologies in Electrical Engineering