Low Power Processor Architectures and Contemporary Techniques for Power Optimization – A Review

The technological evolution has increased the number of transistors for a given die area significantly and increased the switching speed from few MHz to GHz range. Such inversely proportional decline in size and boost in performance consequently demands shrinking of supply voltage and effective power dissipation in chips with millions of transistors. This has triggered substantial amount of research in power reduction techniques into almost every aspect of the chip and particularly the processor cores contained in the chip. This paper presents an overview of techniques for achieving the power efficiency mainly at the processor core level but also visits related domains such as buses and memories. There are various processor parameters and features such as supply voltage, clock frequency, cache and pipelining which can be optimized to reduce the power consumption of the processor. This paper discusses various ways in which these parameters can be optimized. Also, emerging power efficient processor architectures are overviewed and research activities are discussed which should help reader identify how these factors in a processor contribute to power consumption. Some of these concepts have been already established whereas others are still active research areas. © 2009 ACADEMY PUBLISHER

An Electromigration and Thermal Model of Power Wires for a Priori High-Level Reliability Prediction

In this paper, a simple power-distribution electrothermal model including the interconnect self-heating is used together with a statistical model of average and rms currents of functional blocks and a high-level model of fanout distribution and interconnect wirelength. Following the 2001 SIA roadmap projections, we are able to predict a priori that the minimum width that satisfies the electromigration constraints does not scale like the minimum metal pitch in future technology nodes. As a consequence, the percentage of chip area covered by power lines is expected to increase at the expense of wiring resources unless proper countermeasures are taken. Some possible solutions are proposed in the paper

Arithmetic Operations in Multi-Valued Logic

This paper presents arithmetic operations like addition, subtraction and multiplications in Modulo-4 arithmetic, and also addition, multiplication in Galois field, using multi-valued logic (MVL). Quaternary to binary and binary to quaternary converters are designed using down literal circuits. Negation in modular arithmetic is designed with only one gate. Logic design of each operation is achieved by reducing the terms using Karnaugh diagrams, keeping minimum number of gates and depth of net in to consideration. Quaternary multiplier circuit is proposed to achieve required optimization. Simulation result of each operation is shown separately using Hspice.Comment: 12 Pages, VLSICS Journal 201

Indicating Asynchronous Array Multipliers

Multiplication is an important arithmetic operation that is frequently encountered in microprocessing and digital signal processing applications, and multiplication is physically realized using a multiplier. This paper discusses the physical implementation of many indicating asynchronous array multipliers, which are inherently elastic and modular and are robust to timing, process and parametric variations. We consider the physical realization of many indicating asynchronous array multipliers using a 32/28nm CMOS technology. The weak-indication array multipliers comprise strong-indication or weak-indication full adders, and strong-indication 2-input AND functions to realize the partial products. The multipliers were synthesized in a semi-custom ASIC design style using standard library cells including a custom-designed 2-input C-element. 4x4 and 8x8 multiplication operations were considered for the physical implementations. The 4-phase return-to-zero (RTZ) and the 4-phase return-to-one (RTO) handshake protocols were utilized for data communication, and the delay-insensitive dual-rail code was used for data encoding. Among several weak-indication array multipliers, a weak-indication array multiplier utilizing a biased weak-indication full adder and the strong-indication 2-input AND function is found to have reduced cycle time and power-cycle time product with respect to RTZ and RTO handshaking for 4x4 and 8x8 multiplications. Further, the 4-phase RTO handshaking is found to be preferable to the 4-phase RTZ handshaking for achieving enhanced optimizations of the design metrics.Comment: arXiv admin note: text overlap with arXiv:1903.0943

Asynchronous Early Output Dual-Bit Full Adders Based on Homogeneous and Heterogeneous Delay-Insensitive Data Encoding

This paper presents the designs of asynchronous early output dual-bit full adders without and with redundant logic (implicit) corresponding to homogeneous and heterogeneous delay-insensitive data encoding. For homogeneous delay-insensitive data encoding only dual-rail i.e. 1-of-2 code is used, and for heterogeneous delay-insensitive data encoding 1-of-2 and 1-of-4 codes are used. The 4-phase return-to-zero protocol is used for handshaking. To demonstrate the merits of the proposed dual-bit full adder designs, 32-bit ripple carry adders (RCAs) are constructed comprising dual-bit full adders. The proposed dual-bit full adders based 32-bit RCAs incorporating redundant logic feature reduced latency and area compared to their non-redundant counterparts with no accompanying power penalty. In comparison with the weakly indicating 32-bit RCA constructed using homogeneously encoded dual-bit full adders containing redundant logic, the early output 32-bit RCA comprising the proposed homogeneously encoded dual-bit full adders with redundant logic reports corresponding reductions in latency and area by 22.2% and 15.1% with no associated power penalty. On the other hand, the early output 32-bit RCA constructed using the proposed heterogeneously encoded dual-bit full adder which incorporates redundant logic reports respective decreases in latency and area than the weakly indicating 32-bit RCA that consists of heterogeneously encoded dual-bit full adders with redundant logic by 21.5% and 21.3% with nil power overhead. The simulation results obtained are based on a 32/28nm CMOS process technology

A survey of carbon nanotube interconnects for energy efficient integrated circuits

This article is a review of the state-of-art carbon nanotube interconnects for Silicon application with respect to the recent literature. Amongst all the research on carbon nanotube interconnects, those discussed here cover 1) challenges with current copper interconnects, 2) process & growth of carbon nanotube interconnects compatible with back-end-of-line integration, and 3) modeling and simulation for circuit-level benchmarking and performance prediction. The focus is on the evolution of carbon nanotube interconnects from the process, theoretical modeling, and experimental characterization to on-chip interconnect applications. We provide an overview of the current advancements on carbon nanotube interconnects and also regarding the prospects for designing energy efficient integrated circuits. Each selected category is presented in an accessible manner aiming to serve as a survey and informative cornerstone on carbon nanotube interconnects relevant to students and scientists belonging to a range of fields from physics, processing to circuit design

VLSI Revisited - Revival in Japan

This paper describes the abundance of semiconductor consortia that have come into existence in Japan since the mid-1990s. They clearly reflect the ambition of the government - through its reorganized ministry METI and company initiatives - to regain some of the industrial and technological leadership that Japan has lost. The consortia landscape is very different in Japan compared with EU and the US. Outside Japan the universities play a much bigger and very important role. In Europe there has emerged close collaboration, among national government agencies, companies and the EU Commission in supporting the IT sector with considerable attention to semiconductor technologies. Another major difference, and possibly the most important one, is the fact that US and EU consortia include and mix partners from different areas of the semiconductor landscape including wafer makers, material suppliers, equipment producers and integrated device makers.semiconductors, Hitachi, Sony, Toshiba, Elpida, Renesas, Sematech, VLSI, JESSI, MEDEA, ASPLA, MIRAI, innovation system