LC-VCO design optimization methodology based on the gm/ID ratio for nanometer CMOS technologies

In this paper, an LC voltage-controlled oscillator (LC-VCO) design optimization methodology based on the gm/ID technique and on the exploration of all inversion regions of the MOS transistor (MOST) is presented. An in-depth study of the compromises between phase noise and current consumption permits optimization of the design for given specifications. Semiempirical models of MOSTs and inductors, obtained by simulation, jointly with analytical phase noise models, allow to get a design space map where the design tradeoffs are easily identified. Four LC-VCO designs in different inversion regions in a 90-nm CMOS process are obtained with the proposed methodology and verified with electrical simulations. Finally, the implementation and measurements are presented for a 2.4-GHz VCO operating in moderate inversion. The designed VCO draws 440 μA from a 1.2-V power supply and presents a phase noise of -106.2 dBc/Hz at 400 kHz from the carrier

Characterization of 28 nm FDSOI MOS and application to the design of a low-power 2.4 GHz LNA

IoT is expected to connect billions of devices all over world in the next years, and in a near future, it is expected to use LR-WPAN in a wide variety of applications. Not all the devices will require of high performance but will require of low power hungry systems since most of them will be powered with a battery. Conventional CMOS technologies cannot cover these needs even scaling it to very small regimes, which appear other problems. Hence, new technologies are emerging to cover the needs of this devices. One promising technology is the UTBB FDSOI, which achieves good performance with very good energy efficiency. This project characterizes this technology to obtain a set of parameters of interest for analog/RF design. Finally, with the help of a low-power design methodology (gm/Id approach), a design of an ULP ULV LNA is performed to check the suitability of this technology for IoT

Ultra-Low-Voltage IC Design Methods

The emerging nanoscale technologies inherently offer transistors working with low voltage levels and are optimized for low-power operation. However, these technologies lack quality electronic components vital for reliable analog and/or mixed-signal design (e.g., resistor, capacitor, etc.) as they are predominantly used in high-performance digital designs. Moreover, the voltage headroom, ESD properties, the maximum current densities, parasitic effects, process fluctuations, aging effects, and many other parameters are superior in verified-by-time CMOS processes using planar transistors. This is the main reason, why low-voltage, low-power high-performance analog and mixed-signal circuits are still being designed in mature process nodes. In the proposed chapter, we bring an overview of main challenges and design techniques effectively applicable for ultra-low-voltage and low-power analog integrated circuits in nanoscale technologies. New design challenges and limitations linked with a low value of the supply voltage, the process fluctuation, device mismatch, and other effects are discussed. In the later part of the chapter, conventional and unconventional design techniques (bulk-driven approach, floating-gate, dynamic threshold, etc.) to design analog integrated circuits towards ultra-low-voltage systems and applications are described. Examples of ultra-low-voltage analog ICs blocks (an operational amplifier, a voltage comparator, a charge pump, etc.) designed in a standard CMOS technology using the unconventional design approach are presented

Analog integrated circuit design in ultra-thin oxide CMOS technologies with significant direct tunneling-induced gate current

The ability to do mixed-signal IC design in a CMOS technology has been a driving force for manufacturing personal mobile electronic products such as cellular phones, digital audio players, and personal digital assistants. As CMOS has moved to ultra-thin oxide technologies, where oxide thicknesses are less than 3 nm, this type of design has been threatened by the direct tunneling of carriers though the gate oxide. This type of tunneling, which increases exponentially with decreasing oxide thickness, is a source of MOSFET gate current. Its existence invalidates the simplifying design assumption of infinite gate resistance. Its problems are typically avoided by switching to a high-&kappa/metal gate technology or by including a second thick(er) oxide transistor. Both of these solutions come with undesirable increases in cost due to extra mask and processing steps. Furthermore, digital circuit solutions to the problems created by direct tunneling are available, while analog circuit solutions are not. Therefore, it is desirable that analog circuit solutions exist that allow the design of mixed-signal circuits with ultra-thin oxide MOSFETs. This work presents a methodology that develops these solutions as a less costly alternative to high-&kappa/metal gate technologies or thick(er) oxide transistors. The solutions focus on transistor sizing, DC biasing, and the design of current mirrors and differential amplifiers. They attempt to minimize, balance, and cancel the negative effects of direct tunneling on analog design in traditional (non-high-&kappa/metal gate) ultra-thin oxide CMOS technologies. They require only ultra-thin oxide devices and are investigated in a 65 nm CMOS technology with a nominal VDD of 1 V and a physical oxide thickness of 1.25 nm. A sub-1 V bandgap voltage reference that requires only ultra-thin oxide MOSFETs is presented (TC = 251.0 ppm/°C). It utilizes the developed methodology and illustrates that it is capable of suppressing the negative effects of direct tunneling. Its performance is compared to a thick-oxide voltage reference as a means of demonstrating that ultra-thin oxide MOSFETs can be used to build the analog component of a mixed-signal system

Ultra low power circuits for a miniature apnoea detection device

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A Radiation hard bandgap reference circuit in a standard 0.13um CMOS Technology

With ongoing CMOS evolution, the gate-oxide thickness steadily decreases, resulting in an increased radiation tolerance of MOS transistors. Combined with special layout techniques, this yields circuits with a high inherent robustness against X-rays and other ionizing radiation. In bandgap voltage references, the dominant radiation-susceptibility is then no longer associated with the MOS transistors, but is dominated by the diodes. This paper gives an analysis of radiation effects in both MOSdevices and diodes and presents a solution to realize a radiation-hard voltage reference circuit in a standard CMOS technology. A demonstrator circuit was implemented in a standard 0.13 m CMOS technology. Measurements show correct operation with supply voltages in the range from 1.4 V down to 0.85 V, a reference voltage of 405 mV 7.5 mV ( = 6mVchip-to-chip statistical spread), and a reference voltage shift of only 1.5 mV (around 0.8%) under irradiation up to 44 Mrad (Si)

An Ultra-Low-Power Track-and-Hold Amplifier

The future of electronics is the Internet of Things (IoT) paradigm, where always-on devices and sensors monitor and transform everyday life. A plethora of applications (such as navigating drivers past road hazards or monitoring bridge and building stresses) employ this technology. These unattended ground-sensor applications require decade(s)-long operational life-times without battery changes. Such electronics demand stringent performance specifications with only nano-Watt power levels.This thesis presents an ultra-low-power track-and-hold amplifier for such systems. It serves as the front-end of a SAR-ADC or the building block for equalizers or filters. This amplifier\u27s design attains exceptional hold times by mitigating switch subthreshold leakage and bulk leakage. Its novel transmission-gate topology achieves wide-swing performance. Though only consuming 100 pico-Watts, it achieves a precision of 7.6 effective number of bits (ENOB). The track-and-hold amplifier was designed in 130-nm CMOS

Ultra Low Power Design for Digital CMOS Circuits Operating Near Threshold

Circuits operating in the subthreshold region are synonymous to low energy operation. However, the penalty in performance is colossal. In this paper, we investigate how designing in moderate inversion region recuperates some of that lost performance, while remaining very near to the minimum energy point. An power based minimum energy delay modeling that is continuous over the weak, moderate, and strong inversion regions is presented. The effect of supply voltage and device sizing on the minimum energy and performance is determined. The proposed model is utilized to design a temperature to time generator at 32nm technology node asthe application of the proposed model