A 300mV-Supply, 2nW-Power, 80pF-Load CMOS Digital-Based OTA for IoT Interfaces

This paper presents a power-efficient Ultra Low Voltage (ULV) Digital-Based Operational Transconductance Amplifier (DB-OTA), which uses static logic gates and processes digitally the analog input signal. Post-layout simulations in 180nm CMOS technology show that at 300mV supply voltage the circuit consumes just 2nW while driving a capacitive load of 80pF with Total Harmonic Distortion lower than 5% at 100mV input signal swing. The total silicon area is 1,426 μm2. The maximum energy efficiency supply for the DB-OTA and its scalability to 40nm CMOS technology node are also demonstrated

A Survey of Non-conventional Techniques for Low-voltage Low-power Analog Circuit Design

Designing integrated circuits able to work under low-voltage (LV) low-power (LP) condition is currently undergoing a very considerable boom. Reducing voltage supply and power consumption of integrated circuits is crucial factor since in general it ensures the device reliability, prevents overheating of the circuits and in particular prolongs the operation period for battery powered devices. Recently, non-conventional techniques i.e. bulk-driven (BD), floating-gate (FG) and quasi-floating-gate (QFG) techniques have been proposed as powerful ways to reduce the design complexity and push the voltage supply towards threshold voltage of the MOS transistors (MOST). Therefore, this paper presents the operation principle, the advantages and disadvantages of each of these techniques, enabling circuit designers to choose the proper design technique based on application requirements. As an example of application three operational transconductance amplifiers (OTA) base on these non-conventional techniques are presented, the voltage supply is only ±0.4 V and the power consumption is 23.5 µW. PSpice simulation results using the 0.18 µm CMOS technology from TSMC are included to verify the design functionality and correspondence with theory

Modeling of CMOS devices and circuits on flexible ultrathin chips

The field of flexible electronics is rapidly evolving. The ultrathin chips are being used to address the high-performance requirements of many applications. However, simulation and prediction of changes in response of device/circuit due to bending induced stress remains a challenge as of lack of suitable compact models. This makes circuit designing for bendable electronics a difficult task. This paper presents advances in this direction, through compressive and tensile stress studies on transistors and simple circuits such as inverters with different channel lengths and orientations of transistors on ultrathin chips. Different designs of devices and circuits in a standard CMOS 0.18-μm technology were fabricated in two separated chips. The two fabricated chips were thinned down to 20 μm using standard dicing-before-grinding technique steps followed by post-CMOS processing to obtain sufficient bendability (20-mm bending radius, or 0.05% nominal strain). Electrical characterization was performed by packaging the thinned chip on a flexible substrate. Experimental results show change of carrier mobilities in respective transistors, and switching threshold voltage of the inverters during different bending conditions (maximum percentage change of 2% for compressive and 4% for tensile stress). To simulate these changes, a compact model, which is a combination of mathematical equations and extracted parameters from BSIM4, has been developed in Verilog-A and compiled into Cadence Virtuoso environment. The proposed model predicts the mobility variations and threshold voltage in compressive and tensile bending stress conditions and orientations, and shows an agreement with the experimental measurements (1% for compressive and 0.6% for tensile stress mismatch)

High-Performance Deep SubMicron CMOS Technologies with Polycrystalline-SiGe Gates

The use of polycrystalline SiGe as the gate material for deep submicron CMOS has been investigated. A complete compatibility to standard CMOS processing is demonstrated when polycrystalline Si is substituted with SiGe (for Ge fractions below 0.5) to form the gate electrode of the transistors. Performance improvements are achieved for PMOS transistors by careful optimization of both transistor channel profile and p-type gate workfunction, the latter by changing Ge mole fraction in the gate. For the 0.18 ¿m CMOS generation we record up to 20% increase in the current drive, a 10% increase in the channel transconductance and subthreshold swing improvement from 82 mV/dec to 75 mV/dec resulting in excellent ¿on¿/¿off¿ currents ratio. At the same time, NMOS transistor performance is not affected by gate material substitutio

Design of Adiabatic MTJ-CMOS Hybrid Circuits

Low-power designs are a necessity with the increasing demand of portable devices which are battery operated. In many of such devices the operational speed is not as important as battery life. Logic-in-memory structures using nano-devices and adiabatic designs are two methods to reduce the static and dynamic power consumption respectively. Magnetic tunnel junction (MTJ) is an emerging technology which has many advantages when used in logic-in-memory structures in conjunction with CMOS. In this paper, we introduce a novel adiabatic hybrid MTJ/CMOS structure which is used to design AND/NAND, XOR/XNOR and 1-bit full adder circuits. We simulate the designs using HSPICE with 32nm CMOS technology and compared it with a non-adiabatic hybrid MTJ/CMOS circuits. The proposed adiabatic MTJ/CMOS full adder design has more than 7 times lower power consumtion compared to the previous MTJ/CMOS full adder