TCA<i>m</i>M^CogniGron::Energy Efficient Memristor-Based TCAM for Match-Action Processing

The Internet relies heavily on programmable match-action processors for matching network packets against locally available network rules and taking actions, such as forwarding and modification of network packets. This match-action process must be performed at high speed, i.e., commonly within one clock cycle, using a specialized memory unit called Ternary Content Addressable Memory (TCAM). Building on transistor-based CMOS designs, state-of-the-art TCAM architectures have high energy consumption and lack resilient designs for incorporating novel technologies for performing appropriate actions. In this article, we motivate the use of a novel fundamental component, the ‘Memristor’, for the development of TCAM architecture for match-action processing. Memristors can provide energy efficiency, non-volatility and better resource density as compared to transistors. We have proposed a novel memristor-based TCAM architecture called TCAmMCogniGron, built upon the voltage divider principle and requiring only two memristors and five transistors for storage and search operations compared to sixteen transistors in the traditional TCAM architecture. We analyzed its performance over an experimental data set of Nb-doped SrTiO3-based memristor. The analysis of TCAmMCogniGron showed promising power consumption statistics of 16 uW and 1 uW for match and mismatch operations along with twice the improvement in resources density as compared to the traditional architectures

Content Addressable Memories and Transformable Logic Circuits Based on Ferroelectric Reconfigurable Transistors for In-Memory Computing

As a promising alternative to the Von Neumann architecture, in-memory computing holds the promise of delivering high computing capacity while consuming low power. Content addressable memory (CAM) can implement pattern matching and distance measurement in memory with massive parallelism, making them highly desirable for data-intensive applications. In this paper, we propose and demonstrate a novel 1-transistor-per-bit CAM based on the ferroelectric reconfigurable transistor. By exploiting the switchable polarity of the ferroelectric reconfigurable transistor, XOR/XNOR-like matching operation in CAM can be realized in a single transistor. By eliminating the need for the complementary circuit, these non-volatile CAMs based on reconfigurable transistors can offer a significant improvement in area and energy efficiency compared to conventional CAMs. NAND- and NOR-arrays of CAMs are also demonstrated, which enable multi-bit matching in a single reading operation. In addition, the NOR array of CAM cells effectively measures the Hamming distance between the input query and stored entries. Furthermore, utilizing the switchable polarity of these ferroelectric Schottky barrier transistors, we demonstrate reconfigurable logic gates with NAND/NOR dual functions, whose input-output mapping can be transformed in real-time without changing the layout. These reconfigurable circuits will serve as important building blocks for high-density data-stream processors and reconfigurable Application-Specific Integrated Circuits (r-ASICs). The CAMs and transformable logic gates based on ferroelectric reconfigurable transistors will have broad applications in data-intensive applications from image processing to machine learning and artificial intelligence

Limits on Fundamental Limits to Computation

An indispensable part of our lives, computing has also become essential to industries and governments. Steady improvements in computer hardware have been supported by periodic doubling of transistor densities in integrated circuits over the last fifty years. Such Moore scaling now requires increasingly heroic efforts, stimulating research in alternative hardware and stirring controversy. To help evaluate emerging technologies and enrich our understanding of integrated-circuit scaling, we review fundamental limits to computation: in manufacturing, energy, physical space, design and verification effort, and algorithms. To outline what is achievable in principle and in practice, we recall how some limits were circumvented, compare loose and tight limits. We also point out that engineering difficulties encountered by emerging technologies may indicate yet-unknown limits.Comment: 15 pages, 4 figures, 1 tabl

ENERGY EFFICIENCY EXPLORATION OF COARSE-GRAIN RECONFIGURABLE ARCHITECTURE WITH EMERGING NONVOLATILE MEMORY

With the rapid growth in consumer electronics, people expect thin, smart and powerful devices, e.g. Google Glass and other wearable devices. However, as portable electronic products become smaller, energy consumption becomes an issue that limits the development of portable systems due to battery lifetime. In general, simply reducing device size cannot fully address the energy issue. To tackle this problem, we propose an on-chip interconnect infrastructure and pro- gram storage structure for a coarse-grained reconfigurable architecture (CGRA) with emerging non-volatile embedded memory (MRAM). The interconnect is composed of a matrix of time-multiplexed switchboxes which can be dynamically reconfigured with the goal of energy reduction. The number of processors performing computation can also be adapted. The use of MRAM provides access to high-density storage and lower memory energy consumption versus more standard SRAM technologies. The combination of CGRA, MRAM, and flexible on-chip interconnection is considered for signal processing. This application domain is of interest based on its time-varying computing demands. To evaluate CGRA architectural features, prototype architectures have been pro- totyped in a field-programmable gate array (FPGA). Measurements of energy, power, instruction count, and execution time performance are considered for a scalable num- ber of processors. Applications such as adaptive Viterbi decoding and Reed Solomon coding are used for evaluation. To complete this thesis, a time-scheduled switchbox was integrated into our CGRA model. This model was prototyped on an FPGA. It is shown that energy consumption can be reduced by about 30% if dynamic design reconfiguration is performed

Gestión de jerarquías de memoria híbridas a nivel de sistema

Tesis inédita de la Universidad Complutense de Madrid, Facultad de Informática, Departamento de Arquitectura de Computadoras y Automática y de Ku Leuven, Arenberg Doctoral School, Faculty of Engineering Science, leída el 11/05/2017.In electronics and computer science, the term ‘memory’ generally refers to devices that are used to store information that we use in various appliances ranging from our PCs to all hand-held devices, smart appliances etc. Primary/main memory is used for storage systems that function at a high speed (i.e. RAM). The primary memory is often associated with addressable semiconductor memory, i.e. integrated circuits consisting of silicon-based transistors, used for example as primary memory but also other purposes in computers and other digital electronic devices. The secondary/auxiliary memory, in comparison provides program and data storage that is slower to access but offers larger capacity. Examples include external hard drives, portable flash drives, CDs, and DVDs. These devices and media must be either plugged in or inserted into a computer in order to be accessed by the system. Since secondary storage technology is not always connected to the computer, it is commonly used for backing up data. The term storage is often used to describe secondary memory. Secondary memory stores a large amount of data at lesser cost per byte than primary memory; this makes secondary storage about two orders of magnitude less expensive than primary storage. There are two main types of semiconductor memory: volatile and nonvolatile. Examples of non-volatile memory are ‘Flash’ memory (sometimes used as secondary, sometimes primary computer memory) and ROM/PROM/EPROM/EEPROM memory (used for firmware such as boot programs). Examples of volatile memory are primary memory (typically dynamic RAM, DRAM), and fast CPU cache memory (typically static RAM, SRAM, which is fast but energy-consuming and offer lower memory capacity per are a unit than DRAM). Non-volatile memory technologies in Si-based electronics date back to the 1990s. Flash memory is widely used in consumer electronic products such as cellphones and music players and NAND Flash-based solid-state disks (SSDs) are increasingly displacing hard disk drives as the primary storage device in laptops, desktops, and even data centers. The integration limit of Flash memories is approaching, and many new types of memory to replace conventional Flash memories have been proposed. The rapid increase of leakage currents in Silicon CMOS transistors with scaling poses a big challenge for the integration of SRAM memories. There is also the case of susceptibility to read/write failure with low power schemes. As a result of this, over the past decade, there has been an extensive pooling of time, resources and effort towards developing emerging memory technologies like Resistive RAM (ReRAM/RRAM), STT-MRAM, Domain Wall Memory and Phase Change Memory(PRAM). Emerging non-volatile memory technologies promise new memories to store more data at less cost than the expensive-to build silicon chips used by popular consumer gadgets including digital cameras, cell phones and portable music players. These new memory technologies combine the speed of static random-access memory (SRAM), the density of dynamic random-access memory (DRAM), and the non-volatility of Flash memory and so become very attractive as another possibility for future memory hierarchies. The research and information on these Non-Volatile Memory (NVM) technologies has matured over the last decade. These NVMs are now being explored thoroughly nowadays as viable replacements for conventional SRAM based memories even for the higher levels of the memory hierarchy. Many other new classes of emerging memory technologies such as transparent and plastic, three-dimensional(3-D), and quantum dot memory technologies have also gained tremendous popularity in recent years...En el campo de la informática, el término ‘memoria’ se refiere generalmente a dispositivos que son usados para almacenar información que posteriormente será usada en diversos dispositivos, desde computadoras personales (PC), móviles, dispositivos inteligentes, etc. La memoria principal del sistema se utiliza para almacenar los datos e instrucciones de los procesos que se encuentre en ejecución, por lo que se requiere que funcionen a alta velocidad (por ejemplo, DRAM). La memoria principal está implementada habitualmente mediante memorias semiconductoras direccionables, siendo DRAM y SRAM los principales exponentes. Por otro lado, la memoria auxiliar o secundaria proporciona almacenaje(para ficheros, por ejemplo); es más lenta pero ofrece una mayor capacidad. Ejemplos típicos de memoria secundaria son discos duros, memorias flash portables, CDs y DVDs. Debido a que estos dispositivos no necesitan estar conectados a la computadora de forma permanente, son muy utilizados para almacenar copias de seguridad. La memoria secundaria almacena una gran cantidad de datos aun coste menor por bit que la memoria principal, siendo habitualmente dos órdenes de magnitud más barata que la memoria primaria. Existen dos tipos de memorias de tipo semiconductor: volátiles y no volátiles. Ejemplos de memorias no volátiles son las memorias Flash (algunas veces usadas como memoria secundaria y otras veces como memoria principal) y memorias ROM/PROM/EPROM/EEPROM (usadas para firmware como programas de arranque). Ejemplos de memoria volátil son las memorias DRAM (RAM dinámica), actualmente la opción predominante a la hora de implementar la memoria principal, y las memorias SRAM (RAM estática) más rápida y costosa, utilizada para los diferentes niveles de cache. Las tecnologías de memorias no volátiles basadas en electrónica de silicio se remontan a la década de1990. Una variante de memoria de almacenaje por carga denominada como memoria Flash es mundialmente usada en productos electrónicos de consumo como telefonía móvil y reproductores de música mientras NAND Flash solid state disks(SSDs) están progresivamente desplazando a los dispositivos de disco duro como principal unidad de almacenamiento en computadoras portátiles, de escritorio e incluso en centros de datos. En la actualidad, hay varios factores que amenazan la actual predominancia de memorias semiconductoras basadas en cargas (capacitivas). Por un lado, se está alcanzando el límite de integración de las memorias Flash, lo que compromete su escalado en el medio plazo. Por otra parte, el fuerte incremento de las corrientes de fuga de los transistores de silicio CMOS actuales, supone un enorme desafío para la integración de memorias SRAM. Asimismo, estas memorias son cada vez más susceptibles a fallos de lectura/escritura en diseños de bajo consumo. Como resultado de estos problemas, que se agravan con cada nueva generación tecnológica, en los últimos años se han intensificado los esfuerzos para desarrollar nuevas tecnologías que reemplacen o al menos complementen a las actuales. Los transistores de efecto campo eléctrico ferroso (FeFET en sus siglas en inglés) se consideran una de las alternativas más prometedores para sustituir tanto a Flash (por su mayor densidad) como a DRAM (por su mayor velocidad), pero aún está en una fase muy inicial de su desarrollo. Hay otras tecnologías algo más maduras, en el ámbito de las memorias RAM resistivas, entre las que cabe destacar ReRAM (o RRAM), STT-RAM, Domain Wall Memory y Phase Change Memory (PRAM)...Depto. de Arquitectura de Computadores y AutomáticaFac. de InformáticaTRUEunpu