2,012 research outputs found

    High-level asynchronous system design using the ACK framework

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    Journal ArticleDesigning asynchronous circuits is becoming easier as a number of design styles are making the transition from research projects to real, usable tools. However, designing asynchronous "systems" is still a difficult problem. We define asynchronous systems to be medium to large digital systems whose descriptions include both datapath and control, that may involve non-trivial interface requirements, and whose control is too large to be synthesized in one large controller. ACK is a framework for designing high performance asynchronous systems of this type. In ACK we advocate an approach that begins with procedural level descriptions of control and datapath and results in a hybrid system that mixes a variety of hardware implementation styles including burst-mode AFSMs, macromodule circuits, and programmable control. We present our views on what makes asynchronous high level system design different from lower level circuit design, motivate our ACK approach, and demonstrate using an example system design

    Computing the entire area/power consumption versus delay tradeoff curve for gate sizing with a piecewise linear simulator

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    The gate sizing problem is the problem of finding load drive capabilities for all gates in a given Boolean network such, that a given delay limit is kept, and the necessary cost in terms of active area usage and/or power consumption is minimal. This paper describes a way to obtain the entire cost versus delay tradeoff curve of a combinational logic circuit in an efficient way. Every point on the resulting curve is the global optimum of the corresponding gate sizing problem. The problem is solved by mapping it onto piecewise linear models in such a way, that a piecewise linear (circuit) simulator can do the job. It is shown that this setup is very efficient, and can produce tradeoff curves for large circuits (thousands of gates) in a few minutes. Benchmark results for the entire set of MCNC '91 two-level examples are give

    ANALYSIS OF MOS CURRENT MODE LOGIC (MCML) AND IMPLEMENTATION OF MCML STANDARD CELL LIBRARY FOR LOW-NOISE DIGITAL CIRCUIT DESIGN

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    MOS current mode logic (MCML) offers low noise digital circuits that reduce noise that can cripple analog components in mixed-signal integrated circuits, when compared to CMOS digital circuits. An MCML standard cell library was developed for the Cadence Virtuoso Integrated Circuit (IC) design software that gives IC designers the ability to design complex, low noise digital circuits for use in mixed-signal and noise sensitive systems at a high level of abstraction, allowing them to get superior products to market faster than competitors. The MCML standard cell library developed and presented here allows for fast development of mixed signal circuits by providing quiet digital building block gates that reduce the simultaneous switching noise (SSN) by an order of magnitude over conventional CMOS based designs [3]. This thesis project developed the following digital gates in MCML as a standard cell library for general-purpose low noise and very low noise applications: inverter, buffer, NAND, AND, NOR, OR, XOR, NXOR, 2:1 MUX, CMOS to MCML, MCML to CMOS, and double edge triggered flip-flop (DETFF)

    Investigating Single Precision Floating General Matrix Multiply in Heterogeneous Hardware

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    The fundamental operation of matrix multiplication is ubiquitous across a myriad of disciplines. Yet, the identification of new optimizations for matrix multiplication remains relevant for emerging hardware architectures and heterogeneous systems. Frameworks such as OpenCL enable computation orchestration on existing systems, and its availability using the Intel High Level Synthesis compiler allows users to architect new designs for reconfigurable hardware using C/C++. Using the HARPv2 as a vehicle for exploration, we investigate the utility of several of the most notable matrix multiplication optimizations to better understand the performance portability of OpenCL and the implications for such optimizations on this and future heterogeneous architectures. Our results give targeted insights into the applicability of best practices that were for existing architectures when used on emerging heterogeneous systems

    Layout regularity metric as a fast indicator of process variations

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    Integrated circuits design faces increasing challenge as we scale down due to the increase of the effect of sensitivity to process variations. Systematic variations induced by different steps in the lithography process affect both parametric and functional yields of the designs. These variations are known, themselves, to be affected by layout topologies. Design for Manufacturability (DFM) aims at defining techniques that mitigate variations and improve yield. Layout regularity is one of the trending techniques suggested by DFM to mitigate process variations effect. There are several solutions to create regular designs, like restricted design rules and regular fabrics. These regular solutions raised the need for a regularity metric. Metrics in literature are insufficient for different reasons; either because they are qualitative or computationally intensive. Furthermore, there is no study relating either lithography or electrical variations to layout regularity. In this work, layout regularity is studied in details and a new geometrical-based layout regularity metric is derived. This metric is verified against lithographic simulations and shows good correlation. Calculation of the metric takes only few minutes on 1mm x 1mm design, which is considered fast compared to the time taken by simulations. This makes it a good candidate for pre-processing the layout data and selecting certain areas of interest for lithographic simulations for faster throughput. The layout regularity metric is also compared against a model that measures electrical variations due to systematic lithographic variations. The validity of using the regularity metric to flag circuits that have high variability using the developed electrical variations model is shown. The regularity metric results compared to the electrical variability model results show matching percentage that can reach 80%, which means that this metric can be used as a fast indicator of designs more susceptible to lithography and hence electrical variations

    Area-power-delay trade-off in logic synthesis

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    This thesis introduces new concepts to perform area-power-delay trade-offs in a logic synthesis system. To achieve this, a new delay model is presented, which gives accurate delay estimations for arbitrary sets of Boolean expressions. This allows use of this delay model already during the very first steps of logic synthesis. Furthermore, new algorithms are presented for a number of different optimization tasks within logic synthesis. There are new algorithms to create prime irredundant Boo lean expressions, to perform technology mapping for use with standard cell generators, and to perform gate sizing. To prove the validity of the presented ideas, benchmark results are given throughout the thesis
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