Clustered two-dimensional mesh topology for large-scale network-on-chip architecture

Driven by the continuous scaling of Moore’s law, the number of processing cores in chip multiprocessors and systems-on-a-chip are expected to grow tremendously in the near future. Connecting the different components of a multiprocessor chip in a scalable and efficient way has become increasingly challenging. Current network-on-chip (NoC) topologies are adequate for small-size networks but are not optimized for large-scale networks. Transmitted packets inside a large NoC require longer route to reach their destinations, resulting in an increase in certain performance parameters such as latency and power consumption. Thus, it is necessary to develop a new topology appropriate for large-size NoCs. In this research, we proposed a cost-effective network topology for large-size NoCs that improves performance in terms of end-to-end latency. The topology, called RaMesh, consists of clusters of mesh networks. A routing algorithm suitable for this topology was also proposed. The RaMesh architecture together with mesh, torus, and clustered 2D-mesh were simulated using Noxim (NoC simulator), C for software NoC models, and Altera ModelSim for Verilog hardware models. Simulations were conducted under different network traffic and for a variety of network sizes. Experimental results showed that RaMesh performed better than equivalent 2D-mesh and torus topologies. RaMesh topology was also benchmarked against a clustered mesh topology. Average hop count in the proposed topology was at least 22.7% lower compared to the mesh and torus. Average latency was also decreased by at least 24.66% as compared to the mesh and torus. Finally, the saturation point for the proposed topology increased by at least 15% as compared to mesh and torus

NoC adaptatif pour SoC reconfigurable

Les systèmes embarqués sur puce modernes intègrent des milliards de transistors et des composants intégrés hétérogènes pour fournir toutes les fonctionnalités requises par les applications courantes. La solution support de la communication dans ce cadre s'appuie sur la notion de réseau sur puce (NoC pour network on chip). Les principaux objectifs de la conception d'un NoC sont d'obtenir des performances élevées, pour un coût d'implémentation (notamment en surface et en consommation électrique) le plus faible possible. Ainsi, le concepteur de NoC doit tenir compte de l'impact des paramètres du NoC sur le compromis entre les performances du réseau et la taille de silicium requis pour son implémentation. L'utilisation de la technologie submicronique profonde amène des phénomènes de variabilité et de vieillissement qui causes des événements singuliers uniques (SEU pour Single Event Upset). Un SEU provoque le changement d'état d'un bit qui provoque l'échec de la transmission d'une donnée dans un NoC. La mise en œuvre de routage supportant la tolérance aux fautes est donc nécessaire. Dans cette thèse, nous proposons dans un premier temps, une évaluation de l'impact des paramètres de conception des NoC sur ses performances. Le résultat permet de guider le concepteur dans ses choix et le réglage des paramètres du réseau permettant d'éviter la dégradation de ses performances. Deuxièmement, nous avons proposé de nouveaux algorithmes de routage adaptatifs tolérants aux pannes pour un réseaux maillé 2D appelé Gradient et pour un réseaux maillé 3D appelé Diagonal. Ces algorithmes s'adaptent et proposent des séquences de chemins alternatifs pour les paquets lorsque le chemin principal est fautif. Nous avons ainsi évalué le coût d'implémentation de Gradient sur un FPGA actuel. Tous ces travaux ont été validés et caractérisée par simulation et mis en œuvre en FPGA. Les résultats fournissent la comparaison des performances de nos algorithmes avec les algorithmes de l'état de l'art.Chips will be designed with billions of transistors and heterogeneous components integrated to provide full functionality of a current application for embedded system. These applications also require highly parallel and flexible communicating architecture through a regular interconnection network. The emerging solution that can fulfill this requirement is Network-on-Chips (NoCs). Designing an ideal NoC with high throughput, low latency, minimum using resources, minimum power consumption and small area size are very time consuming. Each application required different levels of QoS such as minimum level throughput delay and jitter. In this thesis, firstly, we proposed an evaluation of the impact of design parameters on performance of NoC. We evaluate the impact of NoC design parameters on the performances of an adaptive NoCs. The objective is to evaluate how big the impact of upgrading the value on performances. The result shows the accuracy of choosing and adjusting the network parameters can avoid performance degradation. It can be considered as the control mechanism in an adaptive NoC to avoid the degradation of QoS NoC. The use of deep sub-micron technology in embedded system and its variability process cause Single Event Upsets (SEU) and ''aging'' the circuit. SEU and aging of circuit is the major problem that cause the failure on transmitting the packet in a NoC. Implementing fault-tolerant routing techniques in NoC switching instead of adding virtual channel is the best solution to avoid the fault in NoC. Communication performance of a NoC is depends heavily on the routing algorithm. An adaptive routing algorithm such as fault-tolerant has been proposed for deadlock avoidance and load balancing. This thesis proposed a novel adaptive fault-tolerant routing algorithm for 2D mesh called Gradient and for 3D mesh called Diagonal. Both algorithms consider sequences of alternative paths for packets when the main path fails. The proposed algorithm tolerates faults in worst condition traffic in NoCs. The number of hops, the number of alternative paths, latency and throughput in faulty network are determined and compared with other 2D mesh routing algorithms. Finally, we implemented Gradient routing algorithm into FPGA. All these work were validated and characterized through simulation and implemented into FPGA. The results provide the comparison performance between proposed method with existing related method using some scenarios.RENNES1-Bibl. électronique (352382106) / SudocSudocFranceF

Exploration and Design of Power-Efficient Networked Many-Core Systems

Multiprocessing is a promising solution to meet the requirements of near future applications. To get full benefit from parallel processing, a manycore system needs efficient, on-chip communication architecture. Networkon- Chip (NoC) is a general purpose communication concept that offers highthroughput, reduced power consumption, and keeps complexity in check by a regular composition of basic building blocks. This thesis presents power efficient communication approaches for networked many-core systems. We address a range of issues being important for designing power-efficient manycore systems at two different levels: the network-level and the router-level. From the network-level point of view, exploiting state-of-the-art concepts such as Globally Asynchronous Locally Synchronous (GALS), Voltage/ Frequency Island (VFI), and 3D Networks-on-Chip approaches may be a solution to the excessive power consumption demanded by today’s and future many-core systems. To this end, a low-cost 3D NoC architecture, based on high-speed GALS-based vertical channels, is proposed to mitigate high peak temperatures, power densities, and area footprints of vertical interconnects in 3D ICs. To further exploit the beneficial feature of a negligible inter-layer distance of 3D ICs, we propose a novel hybridization scheme for inter-layer communication. In addition, an efficient adaptive routing algorithm is presented which enables congestion-aware and reliable communication for the hybridized NoC architecture. An integrated monitoring and management platform on top of this architecture is also developed in order to implement more scalable power optimization techniques. From the router-level perspective, four design styles for implementing power-efficient reconfigurable interfaces in VFI-based NoC systems are proposed. To enhance the utilization of virtual channel buffers and to manage their power consumption, a partial virtual channel sharing method for NoC routers is devised and implemented. Extensive experiments with synthetic and real benchmarks show significant power savings and mitigated hotspots with similar performance compared to latest NoC architectures. The thesis concludes that careful codesigned elements from different network levels enable considerable power savings for many-core systems.Siirretty Doriast

Adaptive Routing Approaches for Networked Many-Core Systems

Through advances in technology, System-on-Chip design is moving towards integrating tens to hundreds of intellectual property blocks into a single chip. In such a many-core system, on-chip communication becomes a performance bottleneck for high performance designs. Network-on-Chip (NoC) has emerged as a viable solution for the communication challenges in highly complex chips. The NoC architecture paradigm, based on a modular packet-switched mechanism, can address many of the on-chip communication challenges such as wiring complexity, communication latency, and bandwidth. Furthermore, the combined benefits of 3D IC and NoC schemes provide the possibility of designing a high performance system in a limited chip area. The major advantages of 3D NoCs are the considerable reductions in average latency and power consumption. There are several factors degrading the performance of NoCs. In this thesis, we investigate three main performance-limiting factors: network congestion, faults, and the lack of efficient multicast support. We address these issues by the means of routing algorithms. Congestion of data packets may lead to increased network latency and power consumption. Thus, we propose three different approaches for alleviating such congestion in the network. The first approach is based on measuring the congestion information in different regions of the network, distributing the information over the network, and utilizing this information when making a routing decision. The second approach employs a learning method to dynamically find the less congested routes according to the underlying traffic. The third approach is based on a fuzzy-logic technique to perform better routing decisions when traffic information of different routes is available. Faults affect performance significantly, as then packets should take longer paths in order to be routed around the faults, which in turn increases congestion around the faulty regions. We propose four methods to tolerate faults at the link and switch level by using only the shortest paths as long as such path exists. The unique characteristic among these methods is the toleration of faults while also maintaining the performance of NoCs. To the best of our knowledge, these algorithms are the first approaches to bypassing faults prior to reaching them while avoiding unnecessary misrouting of packets. Current implementations of multicast communication result in a significant performance loss for unicast traffic. This is due to the fact that the routing rules of multicast packets limit the adaptivity of unicast packets. We present an approach in which both unicast and multicast packets can be efficiently routed within the network. While suggesting a more efficient multicast support, the proposed approach does not affect the performance of unicast routing at all. In addition, in order to reduce the overall path length of multicast packets, we present several partitioning methods along with their analytical models for latency measurement. This approach is discussed in the context of 3D mesh networks.Siirretty Doriast

Exploration architecturale et étude des performances des réseaux sur puce 3D partiellement connectés verticalement

Utilization of the third dimension can lead to a significant reduction in power and average hop-count in Networks- on-Chip (NoC). TSV technology, as the most promising technology in 3D integration, offers short and fast vertical links which copes with the long wire problem in 2D NoCs. Nonetheless, TSVs are huge and their manufacturing process is still immature, which reduces the yield of 3D NoC based SoC. Therefore, Vertically-Partially-Connected 3D-NoC has been introduced to benefit from both 3D technology and high yield. Moreover, Vertically-Partially-Connected 3D-NoC is flexible, due to the fact that the number, placement, and assignment of the vertical links in each layer can be decided based on the limitations and requirements of the design. However, there are challenges to present a feasible and high-performance Vertically-Partially-Connected Mesh-based 3D-NoC due to the removed vertical links between the layers. This thesis addresses the challenges of Vertically-Partially-Connected Mesh-based 3D-NoC: Routing is the major problem of the Vertically-Partially-Connected 3D-NoC. Since some vertical links are removed, some of the routers do not have up or/and down ports. Therefore, there should be a path to send a packet to upper or lower layer which obviously has to be determined by a routing algorithm. The suggested paths should not cause deadlock through the network. To cope with this problem we explain and evaluate a deadlock- and livelock-free routing algorithm called Elevator First. Fundamentally, the NoC performance is affected by both 1) micro-architecture of routers and 2) architecture of interconnection. The router architecture has a significant effect on the performance of NoC, as it is a part of transportation delay. Therefore, the simplicity and efficiency of the design of NoC router micro architecture are the critical issues, especially in Vertically-Partially-Connected 3D-NoC which has already suffered from high average latency due to some removed vertical links. Therefore, we present the design and implementation the micro-architecture of a router which not only exactly and quickly transfers the packets based on the Elevator First routing algorithm, but it also consumes a reasonable amount of area and power. From the architecture point of view, the number and placement of vertical links have a key role in the performance of the Vertically-Partially-Connected Mesh-based 3D-NoC, since they affect the average hop-count and link and buffer utilization in the network. Furthermore, the assignment of the vertical links to the routers which do not have up or/and down port(s) is an important issue which influences the performance of the 3D routers. Therefore, the architectural exploration of Vertically-Partially-Connected Mesh-based 3D-NoC is both important and non-trivial. We define, study, and evaluate the parameters which describe the behavior of the network. The parameters can be helpful to place and assign the vertical links in the layers effectively. Finally, we propose a quadratic-based estimation method to anticipate the saturation threshold of the network's average latency.L'utilisation de la troisième dimension peut entraîner une réduction significative de la puissance et de la latence moyenne du trafic dans les réseaux sur puce (Network-on-Chip). La technologie des vias à travers le substrat (ou Through-Silicon Via) est la technologie la plus prometteuse pour l'intégration 3D, car elle offre des liens verticaux courts qui remédient au problème des longs fils dans les NoCs-2D. Les TSVs sont cependant énormes et les processus de fabrication sont immatures, ce qui réduit le rendement des systèmes sur puce à base de NoC-3D. Par conséquent, l'idée de réseaux sur puce 3D partiellement connectés verticalement a été introduite pour bénéficier de la technologie 3D tout en conservant un haut rendement. En outre, de tels réseaux sont flexibles, car le nombre, l'emplacement et l'affectation des liens verticaux dans chaque couche peuvent être décidés en fonction des exigences de l'application. Cependant, ce type de réseaux pose un certain nombre de défis : Le routage est le problème majeur, car l'élimination de certains liens verticaux fait que l'on ne peut utiliser les algorithmes classiques qui suivent l'ordre des dimensions. Pour répondre à cette question nous expliquons et évaluons un algorithme de routage déterministe appelé “Elevator First”, qui garanti d'une part que si un chemin existe, alors on le trouve, et que d'autre part il n'y aura pas d'interblocages. Fondamentalement, la performance du NoC est affecté par a) la micro architecture des routeurs et b) l'architecture d'interconnexion. L'architecture du routeur a un effet significatif sur la performance du NoC, à cause de la latence qu'il induit. Nous présentons la conception et la mise en œuvre de la micro-architecture d'un routeur à faible latence implantant​​l'algorithme de routage Elevator First, qui consomme une quantité raisonnable de surface et de puissance. Du point de vue de l'architecture, le nombre et le placement des liens verticaux ont un rôle important dans la performance des réseaux 3D partiellement connectés verticalement, car ils affectent le nombre moyen de sauts et le taux d'utilisation des FIFOs dans le réseau. En outre, l'affectation des liens verticaux vers les routeurs qui n'ont pas de ports vers le haut ou/et le bas est une question importante qui influe fortement sur les performances. Par conséquent, l'exploration architecturale des réseaux sur puce 3D partiellement connectés verticalement est importante. Nous définissons, étudions et évaluons des paramètres qui décrivent le comportement du réseau, de manière à déterminer le placement et l'affectation des liens verticaux dans les couches de manière simple et efficace. Nous proposons une méthode d'estimation quadratique visantà anticiper le seuil de saturation basée sur ces paramètres