A survey of carbon nanotube interconnects for energy efficient integrated circuits

This article is a review of the state-of-art carbon nanotube interconnects for Silicon application with respect to the recent literature. Amongst all the research on carbon nanotube interconnects, those discussed here cover 1) challenges with current copper interconnects, 2) process & growth of carbon nanotube interconnects compatible with back-end-of-line integration, and 3) modeling and simulation for circuit-level benchmarking and performance prediction. The focus is on the evolution of carbon nanotube interconnects from the process, theoretical modeling, and experimental characterization to on-chip interconnect applications. We provide an overview of the current advancements on carbon nanotube interconnects and also regarding the prospects for designing energy efficient integrated circuits. Each selected category is presented in an accessible manner aiming to serve as a survey and informative cornerstone on carbon nanotube interconnects relevant to students and scientists belonging to a range of fields from physics, processing to circuit design

A Modern Primer on Processing in Memory

Modern computing systems are overwhelmingly designed to move data to computation. This design choice goes directly against at least three key trends in computing that cause performance, scalability and energy bottlenecks: (1) data access is a key bottleneck as many important applications are increasingly data-intensive, and memory bandwidth and energy do not scale well, (2) energy consumption is a key limiter in almost all computing platforms, especially server and mobile systems, (3) data movement, especially off-chip to on-chip, is very expensive in terms of bandwidth, energy and latency, much more so than computation. These trends are especially severely-felt in the data-intensive server and energy-constrained mobile systems of today. At the same time, conventional memory technology is facing many technology scaling challenges in terms of reliability, energy, and performance. As a result, memory system architects are open to organizing memory in different ways and making it more intelligent, at the expense of higher cost. The emergence of 3D-stacked memory plus logic, the adoption of error correcting codes inside the latest DRAM chips, proliferation of different main memory standards and chips, specialized for different purposes (e.g., graphics, low-power, high bandwidth, low latency), and the necessity of designing new solutions to serious reliability and security issues, such as the RowHammer phenomenon, are an evidence of this trend. This chapter discusses recent research that aims to practically enable computation close to data, an approach we call processing-in-memory (PIM). PIM places computation mechanisms in or near where the data is stored (i.e., inside the memory chips, in the logic layer of 3D-stacked memory, or in the memory controllers), so that data movement between the computation units and memory is reduced or eliminated.Comment: arXiv admin note: substantial text overlap with arXiv:1903.0398

ClaPIM: Scalable Sequence CLAssification using Processing-In-Memory

DNA sequence classification is a fundamental task in computational biology with vast implications for applications such as disease prevention and drug design. Therefore, fast high-quality sequence classifiers are significantly important. This paper introduces ClaPIM, a scalable DNA sequence classification architecture based on the emerging concept of hybrid in-crossbar and near-crossbar memristive processing-in-memory (PIM). We enable efficient and high-quality classification by uniting the filter and search stages within a single algorithm. Specifically, we propose a custom filtering technique that drastically narrows the search space and a search approach that facilitates approximate string matching through a distance function. ClaPIM is the first PIM architecture for scalable approximate string matching that benefits from the high density of memristive crossbar arrays and the massive computational parallelism of PIM. Compared with Kraken2, a state-of-the-art software classifier, ClaPIM provides significantly higher classification quality (up to 20x improvement in F1 score) and also demonstrates a 1.8x throughput improvement. Compared with EDAM, a recently-proposed SRAM-based accelerator that is restricted to small datasets, we observe both a 30.4x improvement in normalized throughput per area and a 7% increase in classification precision

A Benes Based NoC Switching Architecture for Mixed Criticality Embedded Systems

Multi-core, Mixed Criticality Embedded (MCE) real-time systems require high timing precision and predictability to guarantee there will be no interference between tasks. These guarantees are necessary in application areas such as avionics and automotive, where task interference or missed deadlines could be catastrophic, and safety requirements are strict. In modern multi-core systems, the interconnect becomes a potential point of uncertainty, introducing major challenges in proving behaviour is always within specified constraints, limiting the means of growing system performance to add more tasks, or provide more computational resources to existing tasks. We present MCENoC, a Network-on-Chip (NoC) switching architecture that provides innovations to overcome this with predictable, formally verifiable timing behaviour that is consistent across the whole NoC. We show how the fundamental properties of Benes networks benefit MCE applications and meet our architecture requirements. Using SystemVerilog Assertions (SVA), formal properties are defined that aid the refinement of the specification of the design as well as enabling the implementation to be exhaustively formally verified. We demonstrate the performance of the design in terms of size, throughput and predictability, and discuss the application level considerations needed to exploit this architecture

An ultra-low power in-memory computing cell for binarized neural networks

Deep Neural Networks (DNN’s) are widely used in many artificial intelligence applications such as image classification and image recognition. Data movement in DNN’s results in increased power consumption. The primary reason behind the energy-expensive data movement in DNN’s is due to the conventional Von Neuman architecture in which computing unit and memory are physically separated. To address the issue of energy-expensive data movement in DNN’s in-memory computing schemes are proposed in the literature. The fundamental principle behind in-memory computing is to enable the vector computations closer to the memory. In-memory computing schemes based on CMOS technologies are of great importance nowadays due to the ease of massive production and commercialization. However, many of the proposed in-memory computing schemes suffer from power and performance degradation. Besides, some of them are capable of reducing power consumption only to a small extent and this requires sacrificing the overall signal to noise ratio (SNR). This thesis discusses an efficient In-Memory Computing (IMC) cell for Binarized Neural Networks (BNNs). Moreover, IMC cell was modelled using the simplest current computing method. In this thesis, the developed IMC cell is a practical solution to the energy-expensive data movement within the BNNs. A 4-bit Digital to Analog Converter (DAC) is designed and simulated using 130nm CMOS process. Using the 4-bit DAC the functionality of IMC scheme for BNNs is demonstrated. The optimised 4-bit DAC shows that it is a powerful IMC method for BNNs. The results presented in this thesis show this approach of IMC is capable of accurately performing dot operation between the input activations and the weights. Furthermore, 4-bit DAC provides a 4-bit weight precision, which provides an effective means to improve the overall accuracy

A Holistic Solution for Reliability of 3D Parallel Systems

As device scaling slows down, emerging technologies such as 3D integration and carbon nanotube field-effect transistors are among the most promising solutions to increase device density and performance. These emerging technologies offer shorter interconnects, higher performance, and lower power. However, higher levels of operating temperatures and current densities project significantly higher failure rates. Moreover, due to the infancy of the manufacturing process, high variation, and defect densities, chip designers are not encouraged to consider these emerging technologies as a stand-alone replacement for Silicon-based transistors. The goal of this dissertation is to introduce new architectural and circuit techniques that can work around high-fault rates in the emerging 3D technologies, improving performance and reliability comparable to Silicon. We propose a new holistic approach to the reliability problem that addresses the necessary aspects of an effective solution such as detection, diagnosis, repair, and prevention synergically for a practical solution. By leveraging 3D fabric layouts, it proposes the underlying architecture to efficiently repair the system in the presence of faults. This thesis presents a fault detection scheme by re-executing instructions on idle identical units that distinguishes between transient and permanent faults while localizing it to the granularity of a pipeline stage. Furthermore, with the use of a dynamic and adaptive reconfiguration policy based on activity factors and temperature variation, we propose a framework that delivers a significant improvement in lifetime management to prevent faults due to aging. Finally, a design framework that can be used for large-scale chip production while mitigating yield and variation failures to bring up Carbon Nano Tube-based technology is presented. The proposed framework is capable of efficiently supporting high-variation technologies by providing protection against manufacturing defects at different granularities: module and pipeline-stage levels.PHDComputer Science & EngineeringUniversity of Michigan, Horace H. Rackham School of Graduate Studieshttp://deepblue.lib.umich.edu/bitstream/2027.42/168118/1/javadb_1.pd

A Benes̆ Based NoC Switching Architecture for Mixed Criticality Embedded Systems

Multi-core, Mixed Criticality Embedded (MCE) real-time systems require high timing precision and predictability to guarantee there will be no interference between tasks. These guarantees are necessary in application areas such as avionics and automotive, where task interference or missed deadlines could be catastrophic, and safety requirements are strict. In modern multi-core systems, the interconnect becomes a potential point of uncertainty, introducing major challenges in proving behaviour is always within specified constraints, limiting the means of growing system performance to add more tasks, or provide more computational resources to existing tasks. We present MCENoC, a Network-on-Chip (NoC) switching architecture that provides innovations to overcome this with predictable, formally verifiable timing behaviour that is consistent across the whole NoC. We show how the fundamental properties of Benes networks benefit MCE applications and meet our architecture requirements. Using SystemVerilog Assertions (SVA), formal properties are defined that aid the refinement of the specification of the design as well as enabling the implementation to be exhaustively formally verified. We demonstrate the performance of the design in terms of size, throughput and predictability, and discuss the application level considerations needed to exploit this architecture