Test-Delivery Optimization in Manycore SOCs

We present two test-data delivery optimization algorithms for system-on-chip (SOC) designs with hundreds of cores, where a network-on-chip (NOC) is used as the interconnection fabric. We first present an e ective algorithm based on a subsetsum formulation to solve the test-delivery problem in NOCs with arbitrary topology that use dedicated routing. We further propose an algorithm for the important class of NOCs with grid topology and XY routing. The proposed algorithm is the first to co-optimize the number of access points, access-point locations, pin distribution to access points, and assignment of cores to access points for optimal test resource utilization of such NOCs. Testtime minimization is modeled as an NOC partitioning problem and solved with dynamic programming in polynomial time. Both the proposed methods yield high-quality results and are scalable to large SOCs with many cores. We present results on synthetic grid topology NOC-based SOCs constructed using cores from the ITC’02 benchmark, and demonstrate the scalability of our approach for two SOCs of the future, one with nearly 1,000 cores and the other with 1,600 cores. Test scheduling under power constraints is also incorporated in the optimization framework

Rapid SoC Design: On Architectures, Methodologies and Frameworks

Modern applications like machine learning, autonomous vehicles, and 5G networking require an order of magnitude boost in processing capability. For several decades, chip designers have relied on Moore’s Law - the doubling of transistor count every two years to deliver improved performance, higher energy efficiency, and an increase in transistor density. With the end of Dennard’s scaling and a slowdown in Moore’s Law, system architects have developed several techniques to deliver on the traditional performance and power improvements we have come to expect. More recently, chip designers have turned towards heterogeneous systems comprised of more specialized processing units to buttress the traditional processing units. These specialized units improve the overall performance, power, and area (PPA) metrics across a wide variety of workloads and applications. While the GPU serves as a classical example, accelerators for machine learning, approximate computing, graph processing, and database applications have become commonplace. This has led to an exponential growth in the variety (and count) of these compute units found in modern embedded and high-performance computing platforms. The various techniques adopted to combat the slowing of Moore’s Law directly translates to an increase in complexity for modern system-on-chips (SoCs). This increase in complexity in turn leads to an increase in design effort and validation time for hardware and the accompanying software stacks. This is further aggravated by fabrication challenges (photo-lithography, tooling, and yield) faced at advanced technology nodes (below 28nm). The inherent complexity in modern SoCs translates into increased costs and time-to-market delays. This holds true across the spectrum, from mobile/handheld processors to high-performance data-center appliances. This dissertation presents several techniques to address the challenges of rapidly birthing complex SoCs. The first part of this dissertation focuses on foundations and architectures that aid in rapid SoC design. It presents a variety of architectural techniques that were developed and leveraged to rapidly construct complex SoCs at advanced process nodes. The next part of the dissertation focuses on the gap between a completed design model (in RTL form) and its physical manifestation (a GDS file that will be sent to the foundry for fabrication). It presents methodologies and a workflow for rapidly walking a design through to completion at arbitrary technology nodes. It also presents progress on creating tools and a flow that is entirely dependent on open-source tools. The last part presents a framework that not only speeds up the integration of a hardware accelerator into an SoC ecosystem, but emphasizes software adoption and usability.PHDElectrical and Computer EngineeringUniversity of Michigan, Horace H. Rackham School of Graduate Studieshttp://deepblue.lib.umich.edu/bitstream/2027.42/168119/1/ajayi_1.pd

Scalability of broadcast performance in wireless network-on-chip

Networks-on-Chip (NoCs) are currently the paradigm of choice to interconnect the cores of a chip multiprocessor. However, conventional NoCs may not suffice to fulfill the on-chip communication requirements of processors with hundreds or thousands of cores. The main reason is that the performance of such networks drops as the number of cores grows, especially in the presence of multicast and broadcast traffic. This not only limits the scalability of current multiprocessor architectures, but also sets a performance wall that prevents the development of architectures that generate moderate-to-high levels of multicast. In this paper, a Wireless Network-on-Chip (WNoC) where all cores share a single broadband channel is presented. Such design is conceived to provide low latency and ordered delivery for multicast/broadcast traffic, in an attempt to complement a wireline NoC that will transport the rest of communication flows. To assess the feasibility of this approach, the network performance of WNoC is analyzed as a function of the system size and the channel capacity, and then compared to that of wireline NoCs with embedded multicast support. Based on this evaluation, preliminary results on the potential performance of the proposed hybrid scheme are provided, together with guidelines for the design of MAC protocols for WNoC.Peer ReviewedPostprint (published version

Design for Reliability and Low Power in Emerging Technologies

Die fortlaufende Verkleinerung von Transistor-Strukturgrößen ist einer der wichtigsten Antreiber für das Wachstum in der Halbleitertechnologiebranche. Seit Jahrzehnten erhöhen sich sowohl Integrationsdichte als auch Komplexität von Schaltkreisen und zeigen damit einen fortlaufenden Trend, der sich über alle modernen Fertigungsgrößen erstreckt. Bislang ging das Verkleinern von Transistoren mit einer Verringerung der Versorgungsspannung einher, was zu einer Reduktion der Leistungsaufnahme führte und damit eine gleichbleibenden Leistungsdichte sicherstellte. Doch mit dem Beginn von Strukturgrößen im Nanometerbreich verlangsamte sich die fortlaufende Skalierung. Viele Schwierigkeiten, sowie das Erreichen von physikalischen Grenzen in der Fertigung und Nicht-Idealitäten beim Skalieren der Versorgungsspannung, führten zu einer Zunahme der Leistungsdichte und, damit einhergehend, zu erschwerten Problemen bei der Sicherstellung der Zuverlässigkeit. Dazu zählen, unter anderem, Alterungseffekte in Transistoren sowie übermäßige Hitzeentwicklung, nicht zuletzt durch stärkeres Auftreten von Selbsterhitzungseffekten innerhalb der Transistoren. Damit solche Probleme die Zuverlässigkeit eines Schaltkreises nicht gefährden, werden die internen Signallaufzeiten üblicherweise sehr pessimistisch kalkuliert. Durch den so entstandenen zeitlichen Sicherheitsabstand wird die korrekte Funktionalität des Schaltkreises sichergestellt, allerdings auf Kosten der Performance. Alternativ kann die Zuverlässigkeit des Schaltkreises auch durch andere Techniken erhöht werden, wie zum Beispiel durch Null-Temperatur-Koeffizienten oder Approximate Computing. Wenngleich diese Techniken einen Großteil des üblichen zeitlichen Sicherheitsabstandes einsparen können, bergen sie dennoch weitere Konsequenzen und Kompromisse. Bleibende Herausforderungen bei der Skalierung von CMOS Technologien führen außerdem zu einem verstärkten Fokus auf vielversprechende Zukunftstechnologien. Ein Beispiel dafür ist der Negative Capacitance Field-Effect Transistor (NCFET), der eine beachtenswerte Leistungssteigerung gegenüber herkömmlichen FinFET Transistoren aufweist und diese in Zukunft ersetzen könnte. Des Weiteren setzen Entwickler von Schaltkreisen vermehrt auf komplexe, parallele Strukturen statt auf höhere Taktfrequenzen. Diese komplexen Modelle benötigen moderne Power-Management Techniken in allen Aspekten des Designs. Mit dem Auftreten von neuartigen Transistortechnologien (wie zum Beispiel NCFET) müssen diese Power-Management Techniken neu bewertet werden, da sich Abhängigkeiten und Verhältnismäßigkeiten ändern. Diese Arbeit präsentiert neue Herangehensweisen, sowohl zur Analyse als auch zur Modellierung der Zuverlässigkeit von Schaltkreisen, um zuvor genannte Herausforderungen auf mehreren Designebenen anzugehen. Diese Herangehensweisen unterteilen sich in konventionelle Techniken ((a), (b), (c) und (d)) und unkonventionelle Techniken ((e) und (f)), wie folgt: $\textbf{(a)}$ Analyse von Leistungszunahmen in Zusammenhang mit der Maximierung von Leistungseffizienz beim Betrieb nahe der Transistor Schwellspannung, insbesondere am optimalen Leistungspunkt. Das genaue Ermitteln eines solchen optimalen Leistungspunkts ist eine besondere Herausforderung bei Multicore Designs, da dieser sich mit den jeweiligen Optimierungszielsetzungen und der Arbeitsbelastung verschiebt. $\textbf{(b)}$ Aufzeigen versteckter Interdependenzen zwischen Alterungseffekten bei Transistoren und Schwankungen in der Versorgungsspannung durch „IR-drops“. Eine neuartige Technik wird vorgestellt, die sowohl Über- als auch Unterschätzungen bei der Ermittlung des zeitlichen Sicherheitsabstands vermeidet und folglich den kleinsten, dennoch ausreichenden Sicherheitsabstand ermittelt. $\textbf{(c)}$ Eindämmung von Alterungseffekten bei Transistoren durch „Graceful Approximation“, eine Technik zur Erhöhung der Taktfrequenz bei Bedarf. Der durch Alterungseffekte bedingte zeitlich Sicherheitsabstand wird durch Approximate Computing Techniken ersetzt. Des Weiteren wird Quantisierung verwendet um ausreichend Genauigkeit bei den Berechnungen zu gewährleisten. $\textbf{(d)}$ Eindämmung von temperaturabhängigen Verschlechterungen der Signallaufzeit durch den Betrieb nahe des Null-Temperatur Koeffizienten (N-ZTC). Der Betrieb bei N-ZTC minimiert temperaturbedingte Abweichungen der Performance und der Leistungsaufnahme. Qualitative und quantitative Vergleiche gegenüber dem traditionellen zeitlichen Sicherheitsabstand werden präsentiert. $\textbf{(e)}$ Modellierung von Power-Management Techniken für NCFET-basierte Prozessoren. Die NCFET Technologie hat einzigartige Eigenschaften, durch die herkömmliche Verfahren zur Spannungs- und Frequenzskalierungen zur Laufzeit (DVS/DVFS) suboptimale Ergebnisse erzielen. Dies erfordert NCFET-spezifische Power-Management Techniken, die in dieser Arbeit vorgestellt werden. $\textbf{(f)}$ Vorstellung eines neuartigen heterogenen Multicore Designs in NCFET Technologie. Das Design beinhaltet identische Kerne; Heterogenität entsteht durch die Anwendung der individuellen, optimalen Konfiguration der Kerne. Amdahls Gesetz wird erweitert, um neue system- und anwendungsspezifische Parameter abzudecken und die Vorzüge des neuen Designs aufzuzeigen. Die Auswertungen der vorgestellten Techniken werden mithilfe von Implementierungen und Simulationen auf Schaltkreisebene (gate-level) durchgeführt. Des Weiteren werden Simulatoren auf Systemebene (system-level) verwendet, um Multicore Designs zu implementieren und zu simulieren. Zur Validierung und Bewertung der Effektivität gegenüber dem Stand der Technik werden analytische, gate-level und system-level Simulationen herangezogen, die sowohl synthetische als auch reale Anwendungen betrachten

OrthoNoC: a broadcast-oriented dual-plane wireless network-on-chip architecture

© 2017 IEEE. Personal use of this material is permitted. Permission from IEEE must be obtained for all other uses, in any current or future media, including reprinting/republishing this material for advertising or promotional purposes,creating new collective works, for resale or redistribution to servers or lists, or reuse of any copyrighted component of this work in other worksOn-chip communication remains as a key research issue at the gates of the manycore era. In response to this, novel interconnect technologies have opened the door to new Network-on-Chip (NoC) solutions towards greater scalability and architectural flexibility. Particularly, wireless on-chip communication has garnered considerable attention due to its inherent broadcast capabilities, low latency, and system-level simplicity. This work presents ORTHONOC, a wired-wireless architecture that differs from existing proposals in that both network planes are decoupled and driven by traffic steering policies enforced at the network interfaces. With these and other design decisions, ORTHONOC seeks to emphasize the ordered broadcast advantage offered by the wireless technology. The performance and cost of ORTHONOC are first explored using synthetic traffic, showing substantial improvements with respect to other wired-wireless designs with a similar number of antennas. Then, the applicability of ORTHONOC in the multiprocessor scenario is demonstrated through the evaluation of a simple architecture that implements fast synchronization via ordered broadcast transmissions. Simulations reveal significant execution time speedups and communication energy savings for 64-threaded benchmarks, proving that the value of ORTHONOC goes beyond simply improving the performance of the on-chip interconnect.Peer ReviewedPostprint (author's final draft

A survey on scheduling and mapping techniques in 3D Network-on-chip

Network-on-Chips (NoCs) have been widely employed in the design of multiprocessor system-on-chips (MPSoCs) as a scalable communication solution. NoCs enable communications between on-chip Intellectual Property (IP) cores and allow those cores to achieve higher performance by outsourcing their communication tasks. Mapping and Scheduling methodologies are key elements in assigning application tasks, allocating the tasks to the IPs, and organising communication among them to achieve some specified objectives. The goal of this paper is to present a detailed state-of-the-art of research in the field of mapping and scheduling of applications on 3D NoC, classifying the works based on several dimensions and giving some potential research directions

Longevity Framework: Leveraging Online Integrated Aging-Aware Hierarchical Mapping and VF-Selection for Lifetime Reliability Optimization in Manycore Processors

Rapid device aging in the nano era threatens system lifetime reliability, posing a major intrinsic threat to system functionality. Traditional techniques to overcome the aging-induced device slowdown, such as guardbanding are static and incur performance, power, and area penalties. In a manycore processor, the system-level design abstraction offers dynamic opportunities through the control of task-to-core mappings and per-core operation frequency towards more balanced core aging profile across the chip, optimizing the system lifetime reliability while meeting the application performance requirements. This article presents Longevity Framework (LF) that leverages online integrated aging-aware hierarchical mapping and voltage frequency (VF)-selection for lifetime reliability optimization in manycore processors. The mapping exploration is hierarchical to achieve scalability. The VF-selection builds on the trade-offs involved between power, performance, and aging as the VF is scaled while leveraging the per-core DVFS capabilities. The methodology takes the chip-wide process variation into account. Extensive experimentation, comparing the proposed approach with two state-of-the-art methods, for 64-core and 256-core systems running applications from PARSEC and SPLASH-2 benchmark suites, show an improvement of up to 3.2 years in the system lifetime reliability and 4× improvement in the average core health

Massive Data-Centric Parallelism in the Chiplet Era

Traditionally, massively parallel applications are executed on distributed systems, where computing nodes are distant enough that the parallelization schemes must minimize communication and synchronization to achieve scalability. Mapping communication-intensive workloads to distributed systems requires complicated problem partitioning and dataset pre-processing. With the current AI-driven trend of having thousands of interconnected processors per chip, there is an opportunity to re-think these communication-bottlenecked workloads. This bottleneck often arises from data structure traversals, which cause irregular memory accesses and poor cache locality. Recent works have introduced task-based parallelization schemes to accelerate graph traversal and other sparse workloads. Data structure traversals are split into tasks and pipelined across processing units (PUs). Dalorex demonstrated the highest scalability (up to thousands of PUs on a single chip) by having the entire dataset on-chip, scattered across PUs, and executing the tasks at the PU where the data is local. However, it also raised questions on how to scale to larger datasets when all the memory is on chip, and at what cost. To address these challenges, we propose a scalable architecture composed of a grid of Data-Centric Reconfigurable Array (DCRA) chiplets. Package-time reconfiguration enables creating chip products that optimize for different target metrics, such as time-to-solution, energy, or cost, while software reconfigurations avoid network saturation when scaling to millions of PUs across many chip packages. We evaluate six applications and four datasets, with several configurations and memory technologies, to provide a detailed analysis of the performance, power, and cost of data-local execution at scale. Our parallelization of Breadth-First-Search with RMAT-26 across a million PUs reaches 3323 GTEPS

A RISC-V Vector Processor With Simultaneous-Switching Switched-Capacitor DC-DC Converters in 28 nm FDSOI

This work demonstrates a RISC-V vector microprocessor implemented in 28 nm FDSOI with fully integrated simultaneous-switching switched-capacitor DC-DC (SC DC-DC) converters and adaptive clocking that generates four on-chip voltages between 0.45 and 1 V using only 1.0 V core and 1.8 V IO voltage inputs. The converters achieve high efficiency at the system level by switching simultaneously to avoid charge-sharing losses and by using an adaptive clock to maximize performance for the resulting voltage ripple. Details about the implementation of the DC-DC switches, DC-DC controller, and adaptive clock are provided, and the sources of conversion loss are analyzed based on measured results. This system pushes the capabilities of dynamic voltage scaling by enabling fast transitions (20 ns), simple packaging (no off-chip passives), low area overhead (16%), high conversion efficiency (80%-86%), and high energy efficiency (26.2 DP GFLOPS/W) for mobile devices