Improving timing verification and delay testing methodologies for IC designs

textThe task of ensuring the correct temporal behavior of IC designs, both before and after fabrication, is extremely important. It is becoming even more imperative as the demand for performance increases and process technology advances into the deep sub-micron region. This dissertation tackles the key issues in the timing verification and delay testing methodologies. An efficient methodology is presented to identify false timing paths in the timing verification methodology which utilizes ATPG technique and timing information from an ordered list of timing paths according to the delay information. This dissertation also presents a speed binning methodology which utilizes structural delay tests successfully instead of functional tests. In addition, it establishes a methodology which quantifies the correlation between the timing verification prediction and actual silicon measurement of timing paths. This quantification methodology lays the foundation for further research to study the impact of deep submicron effects on design performanceElectrical and Computer Engineerin

Product assurance technology for custom LSI/VLSI electronics

The technology for obtaining custom integrated circuits from CMOS-bulk silicon foundries using a universal set of layout rules is presented. The technical efforts were guided by the requirement to develop a 3 micron CMOS test chip for the Combined Release and Radiation Effects Satellite (CRRES). This chip contains both analog and digital circuits. The development employed all the elements required to obtain custom circuits from silicon foundries, including circuit design, foundry interfacing, circuit test, and circuit qualification

Design-for-delay-testability techniques for high-speed digital circuits

The importance of delay faults is enhanced by the ever increasing clock rates and decreasing geometry sizes of nowadays' circuits. This thesis focuses on the development of Design-for-Delay-Testability (DfDT) techniques for high-speed circuits and embedded cores. The rising costs of IC testing and in particular the costs of Automatic Test Equipment are major concerns for the semiconductor industry. To reverse the trend of rising testing costs, DfDT is\ud getting more and more important

Techniques for Improving Security and Trustworthiness of Integrated Circuits

The integrated circuit (IC) development process is becoming increasingly vulnerable to malicious activities because untrusted parties could be involved in this IC development flow. There are four typical problems that impact the security and trustworthiness of ICs used in military, financial, transportation, or other critical systems: (i) Malicious inclusions and alterations, known as hardware Trojans, can be inserted into a design by modifying the design during GDSII development and fabrication. Hardware Trojans in ICs may cause malfunctions, lower the reliability of ICs, leak confidential information to adversaries or even destroy the system under specifically designed conditions. (ii) The number of circuit-related counterfeiting incidents reported by component manufacturers has increased significantly over the past few years with recycled ICs contributing the largest percentage of the total reported counterfeiting incidents. Since these recycled ICs have been used in the field before, the performance and reliability of such ICs has been degraded by aging effects and harsh recycling process. (iii) Reverse engineering (RE) is process of extracting a circuit’s gate-level netlist, and/or inferring its functionality. The RE causes threats to the design because attackers can steal and pirate a design (IP piracy), identify the device technology, or facilitate other hardware attacks. (iv) Traditional tools for uniquely identifying devices are vulnerable to non-invasive or invasive physical attacks. Securing the ID/key is of utmost importance since leakage of even a single device ID/key could be exploited by an adversary to hack other devices or produce pirated devices. In this work, we have developed a series of design and test methodologies to deal with these four challenging issues and thus enhance the security, trustworthiness and reliability of ICs. The techniques proposed in this thesis include: a path delay fingerprinting technique for detection of hardware Trojans, recycled ICs, and other types counterfeit ICs including remarked, overproduced, and cloned ICs with their unique identifiers; a Built-In Self-Authentication (BISA) technique to prevent hardware Trojan insertions by untrusted fabrication facilities; an efficient and secure split manufacturing via Obfuscated Built-In Self-Authentication (OBISA) technique to prevent reverse engineering by untrusted fabrication facilities; and a novel bit selection approach for obtaining the most reliable bits for SRAM-based physical unclonable function (PUF) across environmental conditions and silicon aging effects

Convergence of Intelligent Data Acquisition and Advanced Computing Systems

This book is a collection of published articles from the Sensors Special Issue on "Convergence of Intelligent Data Acquisition and Advanced Computing Systems". It includes extended versions of the conference contributions from the 10th IEEE International Conference on Intelligent Data Acquisition and Advanced Computing Systems: Technology and Applications (IDAACS’2019), Metz, France, as well as external contributions

EMPIRICAL ASSESSMENT OF THE IMPACT OF USING AUTOMATIC STATIC ANALYSIS ON CODE QUALITY

Automatic static analysis (ASA) tools analyze the source or compiled code looking for violations of recommended programming practices (called issues) that might cause faults or might degrade some dimensions of software quality. Antonio Vetro' has focused his PhD in studying how applying ASA impacts software quality, taking as reference point the different quality dimensions specified by the standard ISO/IEC 25010. The epistemological approach he used is that one of empirical software engineering. During his three years PhD, he's been conducting experiments and case studies on three main areas: Functionality/Reliability, Performance and Maintainability. He empirically proved that specific ASA issues had impact on these quality characteristics in the contexts under study: thus, removing them from the code resulted in a quality improvement. Vetro' has also investigated and proposed new research directions for this field: using ASA to improve software energy efficiency and to detect the problems deriving from the interaction of multiple languages. The contribution is enriched with the final recommendation of a generalized process for researchers and practitioners with a twofold goal: improve software quality through ASA and create a body of knowledge on the impact of using ASA on specific software quality dimensions, based on empirical evidence. This thesis represents a first step towards this goa

Secure Split Test for Preventing IC Piracy by Un-Trusted Foundry and Assembly

In the era of globalization, integrated circuit design and manufacturing is spread across different continents. This has posed several hardware intrinsic security issues. The issues are related to overproduction of chips without knowledge of designer or OEM, insertion of hardware Trojans at design and fabrication phase, faulty chips getting into markets from test centers, etc. In this thesis work, we have addressed the problem of counterfeit IC‟s getting into the market through test centers. The problem of counterfeit IC has different dimensions. Each problem related to counterfeiting has different solutions. Overbuilding of chips at overseas foundry can be addressed using passive or active metering. The solution to avoid faulty chips getting into open markets from overseas test centers is secure split test (SST). The further improvement to SST is also proposed by other researchers and is known as Connecticut Secure Split Test (CSST). In this work, we focus on improvements to CSST techniques in terms of security, test time and area. In this direction, we have designed all the required sub-blocks required for CSST architecture, namely, RSA, TRNG, Scrambler block, study of benchmark circuits like S38417, adding scan chains to benchmarks is done. Further, as a security measure, we add, XOR gate at the output of the scan chains to obfuscate the signal coming out of the scan chains. Further, we have improved the security of the design by using the PUF circuit instead of TRNG and avoid the use of the memory circuits. This use of PUF not only eliminates the use of memory circuits, but also it provides the way for functional testing also. We have carried out the hamming distance analysis for introduced security measure and results show that security design is reasonably good.Further, as a future work we can focus on: • Developing the circuit which is secuered for the whole semiconductor supply chain with reasonable hamming distance and less area overhead

High Quality Delay Testing Scheme for a Self-Timed Microprocessor

RÉSUMÉ La popularité d’internet et la quantité toujours croissante de données qui transitent à travers ses terminaux nécessite d’importantes infrastructures de serveurs qui consomment énormément d’énergie. Par conséquent, et puisqu’une augmentation de la consommation d’énergie se traduit par une augmentation des coûts, la demande pour des processeurs efficaces en énergie est en forte hausse. Une manière d’augmenter l’efficacité énergétique des processeurs consiste à moduler la fréquence d’opération du système en fonction de la charge de travail. Les processeurs endochrones et asynchrones sont une des solutions mettant en œuvre ce principe de modulation de l’activité à la demande. Cependant, les méthodes de conception non conventionnelles qui leur sont associées, en particulier en termes de testabilité et d’automation, sont un frein au développement de ce type de systèmes. Ce travail s’intéresse au développement d’une méthode de test de haute qualité adressée aux pannes de retards dans une architecture de processeur endochrone spécifique, appelée AnARM. La méthode proposée consiste à détecter les pannes à faibles retards (PFR) dans l’AnARM en tirant profit des lignes à délais configurables intégrées. Ces pannes sont connues pour passer au travers des modèles de pannes de retards utilisés habituellement (les pannes de retards de portes). Ce travail s’intéresse principalement aux PFR qui échappent à la détection des pannes de retards de portes mais qui sont suffisamment longues pour provoquer des erreurs dans des conditions normales d’opération. D’autre part, la détection de pannes à très faibles retards est évitée, autant que possible, afin de limiter le nombre de faux positifs. Pour réaliser un test de haute qualité, ce travail propose, dans un premier temps, une métrique de test dédiée aux PFR, qui est mieux adaptée aux circuits endochrones, puis, dans un second temps, une méthode de test des pannes de retards basée sur la modulation de la vitesse des lignes à délais intégrés, qui s’adapte à un jeu de vecteurs de test préexistant.Ce travail présente une métrique de test ciblant les PFR, appelée pourcentage de marges pondérées (PoMP), ainsi qu’un nouveau modèle de test pour les PFR (appelé test de PFR idéal).----------ABSTRACT The popularity of the Internet and the huge amount of data that is transfered between devices nowadays requires very powerful servers that demand lots of power. Since higher power consumptions mean more expenses to companies, there is an increase in demand for power eÿcient processors. One of the ways to increase the power eÿciency of processors is to adapt the processing speeds and chip activity according the needed computation load. Self-timed or asynchronous processors are one of the solutions that apply this principle of activity on demand. However, their unconventional design methodology introduces several challenges in terms of testability and design automation. This work focuses on developing a high quality delay test for a specific architecture of self-timed processors called the AnARM. The proposed delay test focuses on catching e˙ective small-delay defects (SDDs) in the AnARM by taking advantage of built-in configurable delay lines. Those defects are known to escape one of the most commonly used delay fault models (the transition delay fault model). This work mainly focuses on e˙ective SDDs which can escape transition delay fault testing and are large enough to fail the circuit under normal operating conditions. At the same time, catching very small delay defects is avoided, when possible, to avoid falsely failing functional chips. To build the high quality delay test, this work develops an SDD test quality metric that is better suited for circuits with adaptable speeds. Then, it builds a delay test optimizer that adapts the built-in delay lines speeds to a preexisting at-speed pattern set to create a high quality SDD test. This work presents a novel SDD test quality metric called the weighted slack percentage (WeSPer), along with a new SDD testing model (named the ideal SDD test model). WeSPer is built to be a flexible metric capable of adapting to the availability of information about the circuit under test and the test environment. Since the AnARM can use multiple test speeds, WeSPer computation takes special care of assessing the effects of test frequency changes on the test quality. Specifically, special care is taken into avoiding overtesting the circuit. Overtesting will cause circuits under test to fail due to defects that are too small to affect the functionality of these circuits in their present state. A computation framework is built to compute WeSPer and compare it with other existing metrics in the literature over a large sets of process-voltage-temperature computation points. Simulations are done on a selected set of known benchmark circuits synthesized in the 28nm FD-SOI technology from STMicroelectronics

Integrated circuit outlier identification by multiple parameter correlation

Semiconductor manufacturers must ensure that chips conform to their specifications before they are shipped to customers. This is achieved by testing various parameters of a chip to determine whether it is defective or not. Separating defective chips from fault-free ones is relatively straightforward for functional or other Boolean tests that produce a go/no-go type of result. However, making this distinction is extremely challenging for parametric tests. Owing to continuous distributions of parameters, any pass/fail threshold results in yield loss and/or test escapes. The continuous advances in process technology, increased process variations and inaccurate fault models all make this even worse. The pass/fail thresholds for such tests are usually set using prior experience or by a combination of visual inspection and engineering judgment. Many chips have parameters that exceed certain thresholds but pass Boolean tests. Owing to the imperfect nature of tests, to determine whether these chips (called "outliers") are indeed defective is nontrivial. To avoid wasted investment in packaging or further testing it is important to screen defective chips early in a test flow. Moreover, if seemingly strange behavior of outlier chips can be explained with the help of certain process parameters or by correlating additional test data, such chips can be retained in the test flow before they are proved to be fatally flawed. In this research, we investigate several methods to identify true outliers (defective chips, or chips that lead to functional failure) from apparent outliers (seemingly defective, but fault-free chips). The outlier identification methods in this research primarily rely on wafer-level spatial correlation, but also use additional test parameters. These methods are evaluated and validated using industrial test data. The potential of these methods to reduce burn-in is discussed