2,608 research outputs found

    Design for testability of high-order OTA-C filters

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    Copyright © 2016 John Wiley & Sons, Ltd.A study of oscillation-based test for high-order Operational Transconductance Amplifier-C (OTA-C) filters is presented. The method is based on partition of a high-order filter into second-order filter functions. The opening Q-loop and adding positive feedback techniques are developed to convert the second-order filter section into a quadrature oscillator. These techniques are based on an open-loop configuration and an additional positive feedback configuration. Implementation of the two testability design methods for nth-order cascade, IFLF and leapfrog (LF) filters is presented, and the area overhead of the modified circuits is also discussed. The performances of the presented techniques are investigated. Fourth-order cascade, inverse follow-the-leader feedback (IFLF) and LF OTA-C filters were designed and simulated for analysis of fault coverage using the adding positive feedback method based on an analogue multiplexer. Simulation results show that the oscillation-based test method using positive feedback provides high fault coverage of around 97%, 96% and 95% for the cascade, IFLF and LF OTA-C filters, respectively. Copyright ÂPeer reviewe

    A performance evaluation of oscillation based test in continuous time filters

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    This work evaluates the ability of OBT for detecting parametric faults in continuous-time filters. To this end, we adopt two filters with quite different topologies as cases of study and a previously reported statistical fault model. In addition, we explore the behavior of the test schemes when a particular test condition is changed. The new data reported here, obtained from a fault simulation process, reveal a lower performance of OBT not observed in previous work using single-deviation faults, even under the change in the test condition.publishedVersionFil: Romero, Eduardo Abel. Universidad Tecnológica Nacional. Facultad Regional Villa María; Argentina.Fil: Romero, Eduardo Abel. Universidad Nacional de Córdoba. Facultad de Matemática, Astronomía y Física; Argentina.Fil: Costamagna, Marcelo. Universidad Tecnológica Nacional. Facultad Regional Villa María; Argentina.Fil: Peretti, Gabriela Marta. Universidad Tecnológica Nacional. Facultad Regional Villa María; Argentina.Fil: Peretti, Gabriela Marta. Universidad Nacional de Córdoba. Facultad de Matemática, Astronomía y Física; Argentina.Fil: Marqués, Carlos Alberto. Universidad Nacional de Córdoba. Facultad de Matemática, Astronomía y Física; Argentina.Otras Ingeniería Eléctrica, Ingeniería Electrónica e Ingeniería de la Informació

    Production Test Technique For RF Circuits Using Embedded Test Sensors

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    A single test stimulus and a simple test configuration with embedded envelope detectors are used to estimate all the specification values of interest for an RF circuit under test in an integrated circuit chip. Envelope detectors are deployed as sensors inside the circuit under test. Where more than one circuit is in an RF device in the integrated circuit, each RF circuit in the device may have its own envelope detector. A signal having, for example, time-varying envelopes is used as an optimized test stimulus. The test uses the time-varying and low frequency envelope of the test response. The circuit's response under test to the optimized test stimulus has features highly correlated with the specifications of interest. The test stimulus is optimized for a set of training circuits, and each training circuit in the set is selected to provide one of a spectrum of test responses to the stimulus.Georgia Tech Research Corporatio

    Analog Defect Injection and Fault Simulation Techniques: A Systematic Literature Review

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    Since the last century, the exponential growth of the semiconductor industry has led to the creation of tiny and complex integrated circuits, e.g., sensors, actuators, and smart power. Innovative techniques are needed to ensure the correct functionality of analog devices that are ubiquitous in every smart system. The ISO 26262 standard for functional safety in the automotive context specifies that fault injection is necessary to validate all electronic devices. For decades, standardization of defect modeling and injection mainly focused on digital circuits and, in a minor part, on analog ones. An initial attempt is being made with the IEEE P2427 draft standard that started to give a structured and formal organization to the analog testing field. Various methods have been proposed in the literature to speed up the fault simulation of the defect universe for an analog circuit. A more limited number of papers seek to reduce the overall simulation time by reducing the number of defects to be simulated. This literature survey describes the state-of-the-art of analog defect injection and fault simulation methods. The survey is based on the Preferred Reporting Items for Systematic Reviews and Meta-Analyses (PRISMA) methodological flow, allowing for a systematic and complete literature survey. Each selected paper has been categorized and presented to provide an overview of all the available approaches. In addition, the limitations of the various approaches are discussed by showing possible future directions

    Assessing the effectiveness of different test approaches for power devices in a PCB

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    Power electronic systems employing Printed Circuit Boards (PCBs) are broadly used in many applications, including some safety-critical ones. Several standards (e.g., ISO26262 for the automotive sector and DO-178 for avionics) mandate the adoption of effective test procedures for all electronic systems. However, the metrics to be used to compute the effectiveness of the adopted test procedures are not so clearly defined for power devices and systems. In the last years, some commercial fault simulation tools (e.g., DefectSim by Mentor Graphics and TestMAX by Synopsys) for analog circuits have been introduced, together with some new fault models. With these new tools, systematic analog fault simulation finally became practically feasible. The aim of this paper is twofold: first, we propose a method to extend the usage of the new analog fault models to power devices, thus allowing to compute a Fault Coverage figure for a given test. Secondly, we adopt the method on a case study, for which we quantitatively evaluate the effectiveness of some test procedures commonly used at the PCB level for the detection of faults inside power devices. A typical Power Supply Unit (PSU) used in industrial products, including power transistors and power diodes, is considered. The analysis of the gathered results shows that using the new method we can identify the main points of strength / weakness of the different test solutions in a quantitative and deterministic manner, and pinpoint the faults escaping to each one

    Constraint-driven RF test stimulus generation and built-in test

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    With the explosive growth in wireless applications, the last decade witnessed an ever-increasing test challenge for radio frequency (RF) circuits. While the design community has pushed the envelope far into the future, by expanding CMOS process to be used with high-frequency wireless devices, test methodology has not advanced at the same pace. Consequently, testing such devices has become a major bottleneck in high-volume production, further driven by the growing need for tighter quality control. RF devices undergo testing during the prototype phase and during high-volume manufacturing (HVM). The benchtop test equipment used throughout prototyping is very precise yet specialized for a subset of functionalities. HVM calls for a different kind of test paradigm that emphasizes throughput and sufficiency, during which the projected performance parameters are measured one by one for each device by automated test equipment (ATE) and compared against defined limits called specifications. The set of tests required for each product differs greatly in terms of the equipment required and the time taken to test individual devices. Together with signal integrity, precision, and repeatability concerns, the initial cost of RF ATE is prohibitively high. As more functionality and protocols are integrated into a single RF device, the required number of specifications to be tested also increases, adding to the overall cost of testing, both in terms of the initial and recurring operating costs. In addition to the cost problem, RF testing proposes another challenge when these components are integrated into package-level system solutions. In systems-on-packages (SOP), the test problems resulting from signal integrity, input/output bandwidth (IO), and limited controllability and observability have initiated a paradigm shift in high-speed analog testing, favoring alternative approaches such as built-in tests (BIT) where the test functionality is brought into the package. This scheme can make use of a low-cost external tester connected through a low-bandwidth link in order to perform demanding response evaluations, as well as make use of the analog-to-digital converters and the digital signal processors available in the package to facilitate testing. Although research on analog built-in test has demonstrated hardware solutions for single specifications, the paradigm shift calls for a rather general approach in which a single methodology can be applied across different devices, and multiple specifications can be verified through a single test hardware unit, minimizing the area overhead. Specification-based alternate test methodology provides a suitable and flexible platform for handling the challenges addressed above. In this thesis, a framework that integrates ATE and system constraints into test stimulus generation and test response extraction is presented for the efficient production testing of high-performance RF devices using specification-based alternate tests. The main components of the presented framework are as follows: Constraint-driven RF alternate test stimulus generation: An automated test stimulus generation algorithm for RF devices that are evaluated by a specification-based alternate test solution is developed. The high-level models of the test signal path define constraints in the search space of the optimized test stimulus. These models are generated in enough detail such that they inherently define limitations of the low-cost ATE and the I/O restrictions of the device under test (DUT), yet they are simple enough that the non-linear optimization problem can be solved empirically in a reasonable amount of time. Feature extractors for BIT: A methodology for the built-in testing of RF devices integrated into SOPs is developed using additional hardware components. These hardware components correlate the high-bandwidth test response to low bandwidth signatures while extracting the test-critical features of the DUT. Supervised learning is used to map these extracted features, which otherwise are too complicated to decipher by plain mathematical analysis, into the specifications under test. Defect-based alternate testing of RF circuits: A methodology for the efficient testing of RF devices with low-cost defect-based alternate tests is developed. The signature of the DUT is probabilistically compared with a class of defect-free device signatures to explore possible corners under acceptable levels of process parameter variations. Such a defect filter applies discrimination rules generated by a supervised classifier and eliminates the need for a library of possible catastrophic defects.Ph.D.Committee Chair: Chatterjee, Abhijit; Committee Member: Durgin, Greg; Committee Member: Keezer, David; Committee Member: Milor, Linda; Committee Member: Sitaraman, Sures

    Wavelet Transform in Fault Diagnosis of Analogue Electronic Circuits

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    Design-for-Test of Mixed-Signal Integrated Circuits

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    On-line Testing Field Programmable Analog Array Circuits

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    This work presents an efficient methodology to on-line test field programmable analog array (FPAA) circuits. It proposes to partition the FPAA circuit under test into sub circuits. Each sub circuit is tested by replicating the sub circuit with programmable resources on FPAAs, and comparing the outputs of the original partitioned sub circuit and its replication. The advantages of this approach includes: low implementation cost, enhanced testability, and flexible testing schedules. This work also presents circuit techniques to address stability problems which are often encountered in the proposed on-line testing approach. In addition, the impact of performing circuit partition on testability is investigated in this work. It shows that testability is generally improved in partitioned circuits. Finally, experimental results are presented to demonstrate the feasibility and effectiveness of the proposed techniques
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