Thermal Characterization of Next-Generation Workloads on Heterogeneous MPSoCs

Next-generation High-Performance Computing (HPC) applications need to tackle outstanding computational complexity while meeting latency and Quality-of-Service constraints. Heterogeneous Multi-Processor Systems-on-Chip (MPSoCs), equipped with a mix of general-purpose cores and reconfigurable fabric for custom acceleration of computational blocks, are key in providing the flexibility to meet the requirements of next-generation HPC. However, heterogeneity brings new challenges to efficient chip thermal management. In this context, accurate and fast thermal simulators are becoming crucial to understand and exploit the trade-offs brought by heterogeneous MPSoCs. In this paper, we first thermally characterize a next-generation HPC workload, the online video transcoding application, using a highly-accurate Infra-Red (IR) microscope. Second, we extend the 3D-ICE thermal simulation tool with a new generic heat spreader model capable of accurately reproducing package surface temperature, with an average error of 6.8% for the hot spots of the chip. Our model is used to characterize the thermal behaviour of the online transcoding application when running on a heterogeneous MPSoC. Moreover, by using our detailed thermal system characterization we are able to explore different application mappings as well as the thermal limits of such heterogeneous platforms

Runtime Energy Savings Based on Machine Learning Models for Multicore Applications

To improve the power consumption of parallel applications at the runtime, modern processors provide frequency scaling and power limiting capabilities. In this work, a runtime strategy is proposed to maximize energy savings under a given performance degradation. Machine learning techniques were utilized to develop performance models which would provide accurate performance prediction with change in operating core-uncore frequency. Experiments, performed on a node (28 cores) of a modern computing platform showed significant energy savings of as much as 26% with performance degradation of as low as 5% under the proposed strategy compared with the execution in the unlimited power case

Thermal-Aware System-Level Modeling and Management for Multi-Processor Systems-on-Chip

Multi-Processor Systems-on-Chip (MPSoCs) are penetrating the electronics market as a powerful, yet commercially viable, solution to answer the strong and steadily growing demand for scalable and high performance systems, at limited design complexity. However, it is critical to develop dedicated system-level design methodologies for multi-core architectures that seamlessly address their thermal modeling, analysis and management. In this work, we first formulate the problem of system-level thermal modeling and link it to produce a global thermal management formulation as a discrete-time optimal control problem, which can be solved using finite-horizon model-predictive control (MPC) techniques, while adapting to the actual time-varying unbalanced MPSoC workload requirements. Finally, we compare the system-level MPC-based thermal modeling and management approaches on an industrial 8-core MPSoC design and show their different trade-offs regarding performance while respecting operating temperature bounds

Convex-Based Thermal Management for 3D MPSoCs Using DVFS and Variable-Flow Liquid Cooling

In this work, we propose a novel online thermal management approach based on model predictive control for 3D multi-processors system on chip (MPSoCs) using microfluidic cooling. The controller uses dynamic voltage and frequency scaling (DVFS) for the computational cores and adjusts the liquid flow rate to meet the desired performance requirements and to minimize the overall MPSoC energy consumption (MPSoC power consumption+cooling power consumption). Our experimental results illustrate that our policy satisfies performance requirements and maintains the temperature below the specified threshold, while reducing cooling energy by up to 50% compared with traditional state-of-the-art liquid cooling techniques. The proposed policy also keeps the thermal profile up to 18°C lower compared with state of the art 3D thermal management using variable-flow liquid cooling

A Survey of Prediction and Classification Techniques in Multicore Processor Systems

In multicore processor systems, being able to accurately predict the future provides new optimization opportunities, which otherwise could not be exploited. For example, an oracle able to predict a certain application\u27s behavior running on a smart phone could direct the power manager to switch to appropriate dynamic voltage and frequency scaling modes that would guarantee minimum levels of desired performance while saving energy consumption and thereby prolonging battery life. Using predictions enables systems to become proactive rather than continue to operate in a reactive manner. This prediction-based proactive approach has become increasingly popular in the design and optimization of integrated circuits and of multicore processor systems. Prediction transforms from simple forecasting to sophisticated machine learning based prediction and classification that learns from existing data, employs data mining, and predicts future behavior. This can be exploited by novel optimization techniques that can span across all layers of the computing stack. In this survey paper, we present a discussion of the most popular techniques on prediction and classification in the general context of computing systems with emphasis on multicore processors. The paper is far from comprehensive, but, it will help the reader interested in employing prediction in optimization of multicore processor systems

Online Convex Optimization-Based Algorithm for Thermal Management of MPSoCs

Meeting the temperature constraints and reducing the hot-spots are critical for achieving reliable and efficient operation of complex multi-core systems. The goal of thermal management is to meet maximum operating temperature constraints, while tracking timevarying performance requirements. Current approaches avoid thermal violations by forcing abrupt operating points changes, which cause sharp performance degradation. In this paper we aim at achieving an online smooth thermal control action, that minimizes the tracking error. We formulate this problem as a discrete-time optimal control problem, which can be solved via online by using an embedded convex optimization solver using a receding horizon approach. The optimization problem considers the thermal profile of the system, its evolution over time, current and past time-varying workload requirements. We perform experiments on a model of the 8-core Niagara-1 multicore architecture, which show that the proposed method outperforms state-of-the-art thermal management approaches by enabling performance speed-ups of up to 2:5£ and improvements up to 12x and 3.4x in relation to frequency and temperature variations over time, respectively

Hierarchical Thermal Management Policy for High-Performance 3D Systems with Liquid Cooling

3-Dimensional integrated circuits and systems are expected to be present in electronic products in the short term. We consider specifically 3-D multi-processor systems-onchip (MPSoCs), realized by stacking silicon CMOS chips and interconnecting them by means of through-silicon vias (TSVs). Because of the high power density of devices and interconnect in the 3D stack, thermal issues pose critical challenges, such as hot-spot avoidance and thermal gradient reduction. Thermal management is achieved by a combination of active control of on-chip switching rates as well as active interlayer cooling with pressurized fluids. In this paper, we propose a novel online thermal management policy for high-performance 3D systems with liquid cooling. Our proposed controller uses a hierarchical approach with a global controller regulating the active cooling and local controllers (on each layer) performing dynamic voltage and frequency scaling (DVFS) and interacting with the global controller. Then, the online control is achieved by policies that are computed off-line by solving an optimization problem that considers the thermal profile of 3D-MPSoCs, its evolution over time and current time-varying workload requirements. The proposed hierarchical scheme is scalable to complex (and heterogeneous) 3D chip stacks. We perform experiments on a 3D-MPSoC case study with different interlayer cooling structures, using benchmarks ranging from web-accessing to playing multimedia. Results show significant advantages in terms of energy savings that reaches values up to 50% versus state-of-the-art thermal control techniques for liquid cooling, and thermal balance with differences of less than 10oC per layer

Online Thermal Control Methods for Multi-Processor Systems

With technological advances, the number of cores integrated on a chip is increasing. This, in turn is leading to thermal constraints and thermal design challenges. Temperature gradients and hot-spots not only affect the performance of the system, but also lead to unreliable circuit operation and affect the life-time of the chip. Meeting temperature constraints and reducing hot-spots are critical for achieving reliable and efficient operation of complex multi-core systems. In this article we analyze the use of four of the most promising families of online control techniques for thermal management of multi-processors system-on-chip (MPSoC). In particular, in our exploration we aim at achieving an online smooth thermal control action that minimizes the performance loss as well as the computational and hardware overhead of embedding a thermal management system inside the MPSoC. The definition of the optimization problem to tackle in this work considers the thermal profile of the system, its evolution over time and current time-varying workload requirements. Thus, this problem is formulated as a finite-horizon optimal control problem and we analyze the control features of different on-line thermal control approaches. In addition, we implemented the policies on an MPSoC hardware simulation platform and performed experiments on a cycle-accurate model of the 8-core Niagara multi-core architecture using benchmarks ranging from web-accessing to playing multimedia. Results show different trade-offs among the analyzed techniques regarding the thermal profile, the frequency setting, the power consumption and the implementation complexity