Gestión de jerarquías de memoria híbridas a nivel de sistema

Tesis inédita de la Universidad Complutense de Madrid, Facultad de Informática, Departamento de Arquitectura de Computadoras y Automática y de Ku Leuven, Arenberg Doctoral School, Faculty of Engineering Science, leída el 11/05/2017.In electronics and computer science, the term ‘memory’ generally refers to devices that are used to store information that we use in various appliances ranging from our PCs to all hand-held devices, smart appliances etc. Primary/main memory is used for storage systems that function at a high speed (i.e. RAM). The primary memory is often associated with addressable semiconductor memory, i.e. integrated circuits consisting of silicon-based transistors, used for example as primary memory but also other purposes in computers and other digital electronic devices. The secondary/auxiliary memory, in comparison provides program and data storage that is slower to access but offers larger capacity. Examples include external hard drives, portable flash drives, CDs, and DVDs. These devices and media must be either plugged in or inserted into a computer in order to be accessed by the system. Since secondary storage technology is not always connected to the computer, it is commonly used for backing up data. The term storage is often used to describe secondary memory. Secondary memory stores a large amount of data at lesser cost per byte than primary memory; this makes secondary storage about two orders of magnitude less expensive than primary storage. There are two main types of semiconductor memory: volatile and nonvolatile. Examples of non-volatile memory are ‘Flash’ memory (sometimes used as secondary, sometimes primary computer memory) and ROM/PROM/EPROM/EEPROM memory (used for firmware such as boot programs). Examples of volatile memory are primary memory (typically dynamic RAM, DRAM), and fast CPU cache memory (typically static RAM, SRAM, which is fast but energy-consuming and offer lower memory capacity per are a unit than DRAM). Non-volatile memory technologies in Si-based electronics date back to the 1990s. Flash memory is widely used in consumer electronic products such as cellphones and music players and NAND Flash-based solid-state disks (SSDs) are increasingly displacing hard disk drives as the primary storage device in laptops, desktops, and even data centers. The integration limit of Flash memories is approaching, and many new types of memory to replace conventional Flash memories have been proposed. The rapid increase of leakage currents in Silicon CMOS transistors with scaling poses a big challenge for the integration of SRAM memories. There is also the case of susceptibility to read/write failure with low power schemes. As a result of this, over the past decade, there has been an extensive pooling of time, resources and effort towards developing emerging memory technologies like Resistive RAM (ReRAM/RRAM), STT-MRAM, Domain Wall Memory and Phase Change Memory(PRAM). Emerging non-volatile memory technologies promise new memories to store more data at less cost than the expensive-to build silicon chips used by popular consumer gadgets including digital cameras, cell phones and portable music players. These new memory technologies combine the speed of static random-access memory (SRAM), the density of dynamic random-access memory (DRAM), and the non-volatility of Flash memory and so become very attractive as another possibility for future memory hierarchies. The research and information on these Non-Volatile Memory (NVM) technologies has matured over the last decade. These NVMs are now being explored thoroughly nowadays as viable replacements for conventional SRAM based memories even for the higher levels of the memory hierarchy. Many other new classes of emerging memory technologies such as transparent and plastic, three-dimensional(3-D), and quantum dot memory technologies have also gained tremendous popularity in recent years...En el campo de la informática, el término ‘memoria’ se refiere generalmente a dispositivos que son usados para almacenar información que posteriormente será usada en diversos dispositivos, desde computadoras personales (PC), móviles, dispositivos inteligentes, etc. La memoria principal del sistema se utiliza para almacenar los datos e instrucciones de los procesos que se encuentre en ejecución, por lo que se requiere que funcionen a alta velocidad (por ejemplo, DRAM). La memoria principal está implementada habitualmente mediante memorias semiconductoras direccionables, siendo DRAM y SRAM los principales exponentes. Por otro lado, la memoria auxiliar o secundaria proporciona almacenaje(para ficheros, por ejemplo); es más lenta pero ofrece una mayor capacidad. Ejemplos típicos de memoria secundaria son discos duros, memorias flash portables, CDs y DVDs. Debido a que estos dispositivos no necesitan estar conectados a la computadora de forma permanente, son muy utilizados para almacenar copias de seguridad. La memoria secundaria almacena una gran cantidad de datos aun coste menor por bit que la memoria principal, siendo habitualmente dos órdenes de magnitud más barata que la memoria primaria. Existen dos tipos de memorias de tipo semiconductor: volátiles y no volátiles. Ejemplos de memorias no volátiles son las memorias Flash (algunas veces usadas como memoria secundaria y otras veces como memoria principal) y memorias ROM/PROM/EPROM/EEPROM (usadas para firmware como programas de arranque). Ejemplos de memoria volátil son las memorias DRAM (RAM dinámica), actualmente la opción predominante a la hora de implementar la memoria principal, y las memorias SRAM (RAM estática) más rápida y costosa, utilizada para los diferentes niveles de cache. Las tecnologías de memorias no volátiles basadas en electrónica de silicio se remontan a la década de1990. Una variante de memoria de almacenaje por carga denominada como memoria Flash es mundialmente usada en productos electrónicos de consumo como telefonía móvil y reproductores de música mientras NAND Flash solid state disks(SSDs) están progresivamente desplazando a los dispositivos de disco duro como principal unidad de almacenamiento en computadoras portátiles, de escritorio e incluso en centros de datos. En la actualidad, hay varios factores que amenazan la actual predominancia de memorias semiconductoras basadas en cargas (capacitivas). Por un lado, se está alcanzando el límite de integración de las memorias Flash, lo que compromete su escalado en el medio plazo. Por otra parte, el fuerte incremento de las corrientes de fuga de los transistores de silicio CMOS actuales, supone un enorme desafío para la integración de memorias SRAM. Asimismo, estas memorias son cada vez más susceptibles a fallos de lectura/escritura en diseños de bajo consumo. Como resultado de estos problemas, que se agravan con cada nueva generación tecnológica, en los últimos años se han intensificado los esfuerzos para desarrollar nuevas tecnologías que reemplacen o al menos complementen a las actuales. Los transistores de efecto campo eléctrico ferroso (FeFET en sus siglas en inglés) se consideran una de las alternativas más prometedores para sustituir tanto a Flash (por su mayor densidad) como a DRAM (por su mayor velocidad), pero aún está en una fase muy inicial de su desarrollo. Hay otras tecnologías algo más maduras, en el ámbito de las memorias RAM resistivas, entre las que cabe destacar ReRAM (o RRAM), STT-RAM, Domain Wall Memory y Phase Change Memory (PRAM)...Depto. de Arquitectura de Computadores y AutomáticaFac. de InformáticaTRUEunpu

DeepNVM++: Cross-Layer Modeling and Optimization Framework of Non-Volatile Memories for Deep Learning

Non-volatile memory (NVM) technologies such as spin-transfer torque magnetic random access memory (STT-MRAM) and spin-orbit torque magnetic random access memory (SOT-MRAM) have significant advantages compared to conventional SRAM due to their non-volatility, higher cell density, and scalability features. While previous work has investigated several architectural implications of NVM for generic applications, in this work we present DeepNVM++, a framework to characterize, model, and analyze NVM-based caches in GPU architectures for deep learning (DL) applications by combining technology-specific circuit-level models and the actual memory behavior of various DL workloads. We present both iso-capacity and iso-area performance and energy analysis for systems whose last-level caches rely on conventional SRAM and emerging STT-MRAM and SOT-MRAM technologies. In the iso-capacity case, STT-MRAM and SOT-MRAM provide up to 3.8x and 4.7x energy-delay product (EDP) reduction and 2.4x and 2.8x area reduction compared to conventional SRAM, respectively. Under iso-area assumptions, STT-MRAM and SOT-MRAM provide up to 2x and 2.3x EDP reduction and accommodate 2.3x and 3.3x cache capacity when compared to SRAM, respectively. We also perform a scalability analysis and show that STT-MRAM and SOT-MRAM achieve orders of magnitude EDP reduction when compared to SRAM for large cache capacities. Our comprehensive cross-layer framework is demonstrated on STT-/SOT-MRAM technologies and can be used for the characterization, modeling, and analysis of any NVM technology for last-level caches in GPUs for DL applications.Comment: 12 pages, 10 figure

Performance impact of a slower main memory: a case study of STT-MRAM in HPC

In high-performance computing (HPC), significant effort is invested in research and development of novel memory technologies. One of them is Spin Transfer Torque Magnetic Random Access Memory (STT-MRAM) --- byte-addressable, high-endurance non-volatile memory with slightly higher access time than DRAM. In this study, we conduct a preliminary assessment of HPC system performance impact with STT-MRAM main memory with recent industry estimations. Reliable timing parameters of STT-MRAM devices are unavailable, so we also perform a sensitivity analysis that correlates overall system slowdown trend with respect to average device latency. Our results demonstrate that the overall system performance of large HPC clusters is not particularly sensitive to main-memory latency. Therefore, STT-MRAM, as well as any other emerging non-volatile memories with comparable density and access time, can be a viable option for future HPC memory system design.This work was supported by the Collaboration Agreement between Samsung Electronics Co., Ltd. and BSC, Spanish Government through Programa Severo Ochoa (SEV-2015-0493), by the Spanish Ministry of Science and Technology through TIN2015-65316-P project and by the Generalitat de Catalunya (contracts 2014-SGR-1051 and 2014-SGR-1272). This work has also received funding from the European Union's Horizon 2020 research and innovation programme under ExaNoDe project (grant agreement No 671578).Peer ReviewedPostprint (author's final draft

Computing with Spintronics: Circuits and architectures

This thesis makes the following contributions towards the design of computing platforms with spintronic devices. 1) It explores the use of spintronic memories in the design of a domain-specific processor for an emerging class of data-intensive applications, namely recognition, mining and synthesis (RMS). Two different spintronic memory technologies — Domain Wall Memory (DWM) and STT-MRAM — are utilized to realize the different levels in the memory hierarchy of the domain-specific processor, based on their respective access characteristics. Architectural tradeoffs created by the use of spintronic memories are analyzed. The proposed design achieves 1.5X-4X improvements in energy-delay product compared to a CMOS baseline. 2) It describes the first attempt to use DWM in the cache hierarchy of general-purpose processors. DWM promises unparalleled density by packing several bits of data into each bit-cell. TapeCache, the proposed DWM-based cache architecture, utilizes suitable circuit and architectural optimizations to address two key challenges (i) the high energy and latency requirement of write operations and (ii) the need for shift operations to access the data stored in each DWM bit-cell. At the circuit level, DWM bit-cells that are tailored to the distinct design requirements of different levels in the cache hierarchy are proposed. At the architecture level, TapeCache proposes suitable cache organization and management policies to alleviate the performance impact of shift operations required to access data stored in DWM bit-cells. TapeCache achieves more than 7X improvements in both cache area and energy with virtually identical performance compared to an SRAM-based cache hierarchy. 3) It investigates the design of the on-chip memory hierarchy of general-purpose graphics processing units (GPGPUs)—massively parallel processors that are optimized for data-intensive high-throughput workloads—using DWM. STAG, a high density, energy-efficient Spintronic- Tape Architecture for GPGPU cache hierarchies is described. STAG utilizes different DWM bit-cells to realize different memory arrays in the GPGPU cache hierarchy. To address the challenge of high access latencies due to shifts, STAG predicts upcoming cache accesses by leveraging unique characteristics of GPGPU architectures and workloads, and prefetches data that are both likely to be accessed and require large numbers of shift operations. STAG achieves 3.3X energy reduction and 12.1% performance improvement over CMOS SRAM under iso-area conditions. 4) While the potential of spintronic devices for memories is widely recognized, their utility in realizing logic is much less clear. The thesis presents Spintastic, a new paradigm that utilizes Stochastic Computing (SC) to realize spintronic logic. In SC, data is encoded in the form of pseudo-random bitstreams, such that the probability of a \u271\u27 in a bitstream corresponds to the numerical value that it represents. SC can enable compact, low-complexity logic implementations of various arithmetic functions. Spintastic establishes the synergy between stochastic computing and spin-based logic by demonstrating that they mutually alleviate each other\u27s limitations. On the one hand, various building blocks of SC, which incur significant overheads in CMOS implementations, can be efficiently realized by exploiting the physical characteristics of spin devices. On the other hand, the reduced logic complexity and low logic depth of SC circuits alleviates the shortcomings of spintronic logic. Based on this insight, the design of spin-based stochastic arithmetic circuits, bitstream generators, bitstream permuters and stochastic-to-binary converter circuits are presented. Spintastic achieves 7.1X energy reduction over CMOS implementations for a wide range of benchmarks from the image processing, signal processing, and RMS application domains. 5) In order to evaluate the proposed spintronic designs, the thesis describes various device-to-architecture modeling frameworks. Starting with devices models that are calibrated to measurements, the characteristics of spintronic devices are successively abstracted into circuit-level and architectural models, which are incorporated into suitable simulation frameworks. (Abstract shortened by UMI.

Evaluation of STT-MRAM main memory for HPC and real-time systems

It is questionable whether DRAM will continue to scale and will meet the needs of next-generation systems. Therefore, significant effort is invested in research and development of novel memory technologies. One of the candidates for nextgeneration memory is Spin-Transfer Torque Magnetic Random Access Memory (STT-MRAM). STT-MRAM is an emerging non-volatile memory with a lot of potential that could be exploited for various requirements of different computing systems. Being a novel technology, STT-MRAM devices are already approaching DRAM in terms of capacity, frequency and device size. Special STT-MRAM features such as intrinsic radiation hardness, non-volatility, zero stand-by power and capability to function in extreme temperatures also make it particularly suitable for aerospace, avionics and automotive applications. Despite of being a conceivable alternative for main memory technology, to this day, academic research of STT-MRAM main memory remains marginal. This is mainly due to the unavailability of publicly available detailed timing parameters of this novel technology, which are required to perform a cycle accurate main memory simulation. Some researchers adopt simplistic memory models to simulate main memory, but such models can introduce significant errors in the analysis of the overall system performance. Therefore, detailed timing parameters are a must-have for any evaluation or architecture exploration study of STT-MRAM main memory. These detailed parameters are not publicly available because STT-MRAM manufacturers are reluctant to release any delicate information on the technology. This thesis demonstrates an approach to perform a cycle accurate simulation of STT-MRAM main memory, being the first to release detailed timing parameters of this technology from academia, essentially enabling researchers to conduct reliable system level simulation of STT-MRAM using widely accepted existing simulation infrastructure. Our results show that, in HPC domain STT-MRAM provide performance comparable to DRAM. Results from the power estimation indicates that STT-MRAM power consumption increases significantly for Activation/Precharge power while Burst power increases moderately and Background power does not deviate much from DRAM. The thesis includes detailed STT-MRAM main memory timing parameters to the main repositories of DramSim2 and Ramulator, two of the most widely used and accepted state-of-the-art main memory simulators. The STT-MRAM timing parameters that has been originated as a part of this thesis, are till date the only reliable and publicly available timing information on this memory technology published from academia. Finally, the thesis analyzes the feasibility of using STT-MRAM in real-time embedded systems by investigating STT-MRAM main memory impact on average system performance and WCET. STT-MRAM's suitability for the real-time embedded systems is validated on benchmarks provided by the European Space Agency (ESA), EEMBC Autobench and MediaBench suite by analyzing performance and WCET impact. In quantitative terms, our results show that STT-MRAM main memory in real-time embedded systems provides performance and WCET comparable to conventional DRAM, while opening up opportunities to exploit various advantages.Es cuestionable si DRAM continuará escalando y cumplirá con las necesidades de los sistemas de la próxima generación. Por lo tanto, se invierte un esfuerzo significativo en la investigación y el desarrollo de nuevas tecnologías de memoria. Uno de los candidatos para la memoria de próxima generación es la Spin-Transfer Torque Magnetic Random Access Memory (STT-MRAM). STT-MRAM es una memoria no volátil emergente con un gran potencial que podría ser explotada para diversos requisitos de diferentes sistemas informáticos. Al ser una tecnología novedosa, los dispositivos STT-MRAM ya se están acercando a la DRAM en términos de capacidad, frecuencia y tamaño del dispositivo. Las características especiales de STTMRAM, como la dureza intrínseca a la radiación, la no volatilidad, la potencia de reserva cero y la capacidad de funcionar en temperaturas extremas, también lo hacen especialmente adecuado para aplicaciones aeroespaciales, de aviónica y automotriz. A pesar de ser una alternativa concebible para la tecnología de memoria principal, hasta la fecha, la investigación académica de la memoria principal de STT-MRAM sigue siendo marginal. Esto se debe principalmente a la falta de disponibilidad de los parámetros de tiempo detallados públicamente disponibles de esta nueva tecnología, que se requieren para realizar un ciclo de simulación de memoria principal precisa. Algunos investigadores adoptan modelos de memoria simplistas para simular la memoria principal, pero tales modelos pueden introducir errores significativos en el análisis del rendimiento general del sistema. Por lo tanto, los parámetros de tiempo detallados son indispensables para cualquier evaluación o estudio de exploración de la arquitectura de la memoria principal de STT-MRAM. Estos parámetros detallados no están disponibles públicamente porque los fabricantes de STT-MRAM son reacios a divulgar información delicada sobre la tecnología. Esta tesis demuestra un enfoque para realizar un ciclo de simulación precisa de la memoria principal de STT-MRAM, siendo el primero en lanzar parámetros de tiempo detallados de esta tecnología desde la academia, lo que esencialmente permite a los investigadores realizar una simulación confiable a nivel de sistema de STT-MRAM utilizando una simulación existente ampliamente aceptada infraestructura. Nuestros resultados muestran que, en el dominio HPC, STT-MRAM proporciona un rendimiento comparable al de la DRAM. Los resultados de la estimación de potencia indican que el consumo de potencia de STT-MRAM aumenta significativamente para la activation/Precharge power, mientras que la Burst power aumenta moderadamente y la Background power no se desvía mucho de la DRAM. La tesis incluye parámetros detallados de temporización memoria principal de STT-MRAM a los repositorios principales de DramSim2 y Ramulator, dos de los simuladores de memoria principal más avanzados y más utilizados y aceptados. Los parámetros de tiempo de STT-MRAM que se han originado como parte de esta tesis, son hasta la fecha la única información de tiempo confiable y disponible al público sobre esta tecnología de memoria publicada desde la academia. Finalmente, la tesis analiza la viabilidad de usar STT-MRAM en real-time embedded systems mediante la investigación del impacto de la memoria principal de STT-MRAM en el rendimiento promedio del sistema y WCET. La idoneidad de STTMRAM para los real-time embedded systems se valida en los applicaciones proporcionados por la European Space Agency (ESA), EEMBC Autobench y MediaBench, al analizar el rendimiento y el impacto de WCET. En términos cuantitativos, nuestros resultados muestran que la memoria principal de STT-MRAM en real-time embedded systems proporciona un desempeño WCET comparable al de una memoria DRAM convencional, al tiempo que abre oportunidades para explotar varias ventajas

Enabling a reliable STT-MRAM main memory simulation

STT-MRAM is a promising new memory technology with very desirable set of properties such as non-volatility, byte-addressability and high endurance. It has the potential to become the universal memory that could be incorporated to all levels of memory hierarchy. Although STT-MRAM technology got significant attention of various major memory manufacturers, to this day, academic research of STT-MRAM main memory remains marginal. This is mainly due to the unavailability of publicly available detailed timing parameters which are required to perform a cycle accurate main memory simulation. Our study presents a detailed analysis of STT-MRAM main memory timing and propose an approach to perform a reliable system level simulation of the memory technology. We seamlessly incorporate STT-MRAM timing parameters into DRAMSim2 memory simulator and use it as a part of the simulation infrastructure of the high-performance computing (HPC) systems. Our results suggests that, STT-MRAM main memory would provide performance comparable to DRAM, while opening up various opportunities for HPC system improvements. Most importantly, our study enables researchers to conduct reliable system level research on STT-MRAM main memory, and to explore the opportunities that this technology has to offer.This work was supported by BSC, Spanish Government through Programa Severo Ochoa (SEV-2015-0493), by the Spanish Ministry of Science and Technology through TIN2015-65316-P project and by the Generalitat de Catalunya (contracts 2014-SGR-1051 and 2014-SGR-1272). This work has also received funding from the European Union's Horizon 2020 research and innovation programme under ExaNoDe project (grant agreement No 671578). The authors wish to thank Terry Hulett, Duncan Bennett and Ben Cooke from Everspin Technologies Inc., for their technical support.Peer ReviewedPostprint (author's final draft

A Study on Performance and Power Efficiency of Dense Non-Volatile Caches in Multi-Core Systems

In this paper, we present a novel cache design based on Multi-Level Cell Spin-Transfer Torque RAM (MLC STTRAM) that can dynamically adapt the set capacity and associativity to use efficiently the full potential of MLC STTRAM. We exploit the asymmetric nature of the MLC storage scheme to build cache lines featuring heterogeneous performances, that is, half of the cache lines are read-friendly, while the other is write-friendly. Furthermore, we propose to opportunistically deactivate ways in underutilized sets to convert MLC to Single-Level Cell (SLC) mode, which features overall better performance and lifetime. Our ultimate goal is to build a cache architecture that combines the capacity advantages of MLC and performance/energy advantages of SLC. Our experiments show an improvement of 43% in total numbers of conflict misses, 27% in memory access latency, 12% in system performance, and 26% in LLC access energy, with a slight degradation in cache lifetime (about 7%) compared to an SLC cache

HOPE: Holistic STT-RAM Architecture Exploration Framework for Future Cross-Platform Analysis

Spin Transfer Torque Random Access Memory (STT-RAM) is an emerging Non-Volatile Memory (NVM) technology that has garnered attention to overcome the drawbacks of conventional CMOS-based technologies. However, such technologies must be evaluated before deployment under real workloads and architecture. But there is a lack of available open-source STT-RAM-based system evaluation framework, which hampers research and experimentation and impacts the adoption of STT- RAM in a system. This paper proposes a novel, extendable STT-RAM memory controller design integrated inside the gem5 simulator. Our framework enables understanding various aspects of STT-RAM, i.e., power, delay, clock cycles, energy, and system throughput. We will open-source our HOPE framework, which will fuel research and aid in accelerating the development of future system architectures based on STT-RAM. It will also facilitate the user for further tool enhancement