Unraveling the Role of Interfaces on the Spall Failure of Cu/Ta Multilayered Systems.

Molecular dynamics (MD) simulations are carried out to investigate the effects of the type and spacing of FCC/BCC interfaces on the deformation and spall behavior. The simulations are carried out using model Cu/Ta multilayers with six different types of interfaces. The results suggest that interface type can significantly affect the structure and intensity of the incoming shock wave, change the activated slip systems, alter dislocation slip and twinning behavior, affect where and how voids are nucleated during spallation and the resulting spall strength. Moreover, the above aspects are significantly affected by the interface spacing. A transition from homogeneous to heterogeneous dislocation nucleation occurs as the interface spacing is decreased to 6 nm. Depending on interface type and spacing, damage (voids) nucleation and spall failure is observed to occur not only at the Cu/Ta interfaces, but also in the weaker Cu layer interior, or even in the stronger Ta layer interior, although different mechanisms underlie each of these three distinct failure modes. These findings point to the fact that, depending on the combination of interface type and spacing, interfaces can lead to both strengthening and weakening of the Cu/Ta multilayered microstructures

Graph Dynamical Networks for Unsupervised Learning of Atomic Scale Dynamics in Materials

Understanding the dynamical processes that govern the performance of functional materials is essential for the design of next generation materials to tackle global energy and environmental challenges. Many of these processes involve the dynamics of individual atoms or small molecules in condensed phases, e.g. lithium ions in electrolytes, water molecules in membranes, molten atoms at interfaces, etc., which are difficult to understand due to the complexity of local environments. In this work, we develop graph dynamical networks, an unsupervised learning approach for understanding atomic scale dynamics in arbitrary phases and environments from molecular dynamics simulations. We show that important dynamical information can be learned for various multi-component amorphous material systems, which is difficult to obtain otherwise. With the large amounts of molecular dynamics data generated everyday in nearly every aspect of materials design, this approach provides a broadly useful, automated tool to understand atomic scale dynamics in material systems.Comment: 25 + 7 pages, 5 + 3 figure

A New Phenomenon: Sub-Tg, Solid-State, Plasticity-Induced Bonding in Polymers

Polymer self-adhesion due to the interdiffusion of macromolecules has been an active area of research for several decades [70, 43, 62, 42, 72, 73, 41]. Here, we report a new phenomenon of sub-Tg, solid-state, plasticity-induced bonding; where amorphous polymeric films were bonded together in a period of time on the order of a second in the solid-state at ambient temperatures nearly 60 K below their glass transition temperature (Tg) by subjecting them to active plastic deformation. Despite the glassy regime, the bulk plastic deformation triggered the requisite molecular mobility of the polymer chains, causing interpenetration across the interfaces held in contact. Quantitative levels of adhesion and the morphologies of the fractured interfaces validated the sub-Tg, plasticity-induced, molecular mobilization causing bonding. No-bonding outcomes (i) during the compression of films in a near hydrostatic setting (which inhibited plastic flow) and (ii) between an 'elastic' and a 'plastic' film further established the explicit role of plastic deformation in this newly reported sub-Tg solid-state bonding

A Comprehensive Study of Hydrolyzed Polyacrylamide as a Binder for Silicon Anodes.

Silicon anodes have a high theoretical capacity for lithium storage, but current composite electrode formulations are not sufficiently stable under long-term electrochemical cycling. The choice of polymeric binder has been shown to impact stability and capacity of silicon anodes for electrochemical energy storage. While several promising polymeric binders have been identified, there is a knowledge gap in how various physicochemical properties-including adhesion, mechanical integrity, and ion diffusion-impact electrochemical stability and performance. In this work, we comprehensively investigate the physical properties and performance of a molecular-weight series (3-20 × 106 g/mol) of partially hydrolyzed polyacrylamide (HPAM) in silicon anodes. We quantify the mechanical strength, electrolyte uptake, adhesion to silicon, copper, and carbon, as well as electrochemical performance and stability and find that HPAM satisfies many of the properties generally believed to be favorable, including good adhesion, high strength, and electrochemical stability. HPAM does not show any electrolyte uptake regardless of any molecular weight studied, and thin films of mid- and high-molecular-weight HPAM on silicon surfaces suppress lithiation of silicon. The resulting composite electrodes exhibit an electrochemical storage capacity greater than 3000 mAh/g initially and 1639 mAh/g after 100 cycles. We attribute capacity fade to failure of mechanical properties of the binder or an excess of the solid electrolyte interphase layer being formed at the Si surface. While the highest-molecular-weight sample was expected to perform the best given its stronger adhesion and bulk mechanical properties, we found that HPAM of moderate molecular weight performed the best. We attribute this to a trade-off in mechanical strength and uniformity of the resulting electrode. This work demonstrates promising performance of a low-cost polymer as a binder for Si anodes and provides insight into the physical and chemical properties that influence binder performance