HIGH PERFORMANCE CLOCK DISTRIBUTION FOR HIGH-SPEED VLSI SYSTEMS

Tohoku University堀口 進課

Through-silicon-via-aware prediction and physical design for multi-granularity 3D integrated circuits

The main objective of this research is to predict the wirelength, area, delay, and power of multi-granularity three-dimensional integrated circuits (3D ICs), to develop physical design methodologies and algorithms for the design of multi-granularity 3D ICs, and to investigate the impact of through-silicon vias (TSVs) on the quality of 3D ICs. This dissertation supports these objectives by addressing six research topics. The first pertains to analytical models that predict the interconnects of multi-granularity 3D ICs, and the second focuses on the development of analytical models of the capacitive coupling of TSVs. The third and the fourth topics present design methodologies and algorithms for the design of gate- and block-level 3D ICs, and the fifth topic pertains to the impact of TSVs on the quality of 3D ICs. The final topic addresses topography variation in 3D ICs. The first section of this dissertation presents TSV-aware interconnect prediction models for multi-granularity 3D ICs. As previous interconnect prediction models for 3D ICs did not take TSV area into account, they were not capable of predicting many important characteristics of 3D ICs related to TSVs. This section will present several previous interconnect prediction models that have been improved so that the area occupied by TSVs is taken into account. The new models show numerous important predictions such as the existence of the number of TSVs minimizing wirelength. The second section presents fast estimation of capacitive coupling of TSVs and wires. Since TSV-to-TSV and TSV-to-wire coupling capacitance is dependent on their relative locations, fast estimation of the coupling capacitance of a TSV is essential for the timing optimization of 3D ICs. Simulation results show that the analytical models presented in this section are sufficiently accurate for use at various design steps that require the computation of TSV capacitance. The third and fourth sections present design methodologies and algorithms for gate- and block-level 3D ICs. One of the biggest differences in the design of 2D and 3D ICs is that the latter requires TSV insertion. Since no widely-accepted design methodology designates when, where, and how TSVs are inserted, this work develops and presents several design methodologies for gate- and block-level 3D ICs and physical design algorithms supporting them. Simulation results based on GDSII-level layouts validate the design methodologies and present evidence of their effectiveness. The fifth section explores the impact of TSVs on the quality of 3D ICs. As TSVs become smaller, devices are shrinking, too. Since the relative size of TSVs and devices is more critical to the quality of 3D ICs than the absolute size of TSVs and devices, TSVs and devices should be taken into account in the study of the impact of TSVs on the quality of 3D ICs. In this section, current and future TSVs and devices are combined to produce 3D IC layouts and the impact of TSVs on the quality of 3D ICs is investigated. The final section investigates topography variation in 3D ICs. Since landing pads fabricated in the bottommost metal layer are attached to TSVs, they are larger than TSVs, so they could result in serious topography variation. Therefore, topography variation, especially in the bottommost metal layer, is investigated and two layout optimization techniques are applied to a global placement algorithm that minimizes the topography variation of the bottommost metal layer of 3D ICs.PhDCommittee Chair: Lim, Sung Kyu; Committee Member: Bakir, Muhannad; Committee Member: Kim, Hyesoon; Committee Member: Lee, Hsien-Hsin Sean; Committee Member: Mukhopadhyay, Saiba

Performance assessment of multi-walled carbon nanotube interconnects using advanced polynomial chaos schemes

2019 Spring.Includes bibliographical references.With the continuous miniaturization in the latest VLSI technologies, manufacturing uncertainties at nanoscale processes and operations are unpredictable at the chip level, packaging level and at board levels of integrated systems. To overcome such issues, simulation solvers to model forward propagation of uncertainties or variations in random processes at the device level to the network response are required. Polynomial Chaos Expansion (PCE) of the random variables is the most common technique to model the unpredictability in the systems. Existing methods for uncertainty quantification have a major drawback that as the number of random variables in a system increases, its computational cost and time increases in a polynomial fashion. In order to alleviate the poor scalability of standard PC approaches, predictor-corrector polynomial chaos scheme and hyperbolic polynomial chaos expansion (HPCE) scheme are being proposed in this dissertation. In the predictor-corrector polynomial scheme, low-fidelity meta-model is generated using Equivalent Single Conductor (ESC) approximation model and then its accuracy is enhanced using low order multi-conductor circuit (MCC) model called a corrector model. In HPCE, sparser polynomial expansion is generated based on the hyperbolic criterion. These schemes result in an immense reduction in CPU cost and speed. This dissertation presents the novel approach to quantify the uncertainties in multi-walled carbon nano-tubes using these schemes. The accuracy and validation of these schemes are shown using various numerical examples

Integrated Circuits Parasitic Capacitance Extraction Using Machine Learning and its Application to Layout Optimization

The impact of parasitic elements on the overall circuit performance keeps increasing from one technology generation to the next. In advanced process nodes, the parasitic effects dominate the overall circuit performance. As a result, the accuracy requirements of parasitic extraction processes significantly increased, especially for parasitic capacitance extraction. Existing parasitic capacitance extraction tools face many challenges to cope with such new accuracy requirements that are set by semiconductor foundries (\u3c 5% error). Although field-solver methods can meet such requirements, they are very slow and have a limited capacity. The other alternative is the rule-based parasitic capacitance extraction methods, which are faster and have a high capacity; however, they cannot consistently provide good accuracy as they use a pre-characterized library of capacitance formulas that cover a limited number of layout patterns. On the other hand, the new parasitic extraction accuracy requirements also added more challenges on existing parasitic-aware routing optimization methods, where simplified parasitic models are used to optimize layouts. This dissertation provides new solutions for interconnect parasitic capacitance extraction and parasitic-aware routing optimization methodologies in order to cope with the new accuracy requirements of advanced process nodes as follows. First, machine learning compact models are developed in rule-based extractors to predict parasitic capacitances of cross-section layout patterns efficiently. The developed models mitigate the problems of the pre-characterized library approach, where each compact model is designed to extract parasitic capacitances of cross-sections of arbitrary distributed metal polygons that belong to a specific set of metal layers (i.e., layer combination) efficiently. Therefore, the number of covered layout patterns significantly increased. Second, machine learning compact models are developed to predict parasitic capacitances of middle-end-of-line (MEOL) layers around FINFETs and MOSFETs. Each compact model extracts parasitic capacitances of 3D MEOL patterns of a specific device type regardless of its metal polygons distribution. Therefore, the developed MEOL models can replace field-solvers in extracting MEOL patterns. Third, a novel accuracy-based hybrid parasitic capacitance extraction method is developed. The proposed hybrid flow divides a layout into windows and extracts the parasitic capacitances of each window using one of three parasitic capacitance extraction methods that include: 1) rule-based; 2) novel deep-neural-networks-based; and 3) field-solver methods. This hybrid methodology uses neural-networks classifiers to determine an appropriate extraction method for each window. Moreover, as an intermediate parasitic capacitance extraction method between rule-based and field-solver methods, a novel deep-neural-networks-based extraction method is developed. This intermediate level of accuracy and speed is needed since using only rule-based and field-solver methods (for hybrid extraction) results in using field-solver most of the time for any required high accuracy extraction. Eventually, a parasitic-aware layout routing optimization and analysis methodology is implemented based on an incremental parasitic extraction and a fast optimization methodology. Unlike existing flows that do not provide a mechanism to analyze the impact of modifying layout geometries on a circuit performance, the proposed methodology provides novel sensitivity circuit models to analyze the integrity of signals in layout routes. Such circuit models are based on an accurate matrix circuit representation, a cost function, and an accurate parasitic sensitivity extraction. The circuit models identify critical parasitic elements along with the corresponding layout geometries in a certain route, where they measure the sensitivity of a route’s performance to corresponding layout geometries very fast. Moreover, the proposed methodology uses a nonlinear programming technique to optimize problematic routes with pre-determined degrees of freedom using the proposed circuit models. Furthermore, it uses a novel incremental parasitic extraction method to extract parasitic elements of modified geometries efficiently, where the incremental extraction is used as a part of the routing optimization process to improve the optimization runtime and increase the optimization accuracy

로직 및 피지컬 합성에서의 타이밍 분석과 최적화

학위논문 (박사) -- 서울대학교 대학원 : 공과대학 전기·정보공학부, 2020. 8. 김태환.Timing analysis is one of the necessary steps in the development of a semiconductor circuit. In addition, it is increasingly important in the advanced process technologies due to various factors, including the increase of process–voltage–temperature variation. This dissertation addresses three problems related to timing analysis and optimization in logic and physical synthesis. Firstly, most static timing analysis today are based on conventional fixed flip-flop timing models, in which every flip-flop is assumed to have a fixed clock-to-Q delay. However, setup and hold skews affect the clock-to-Q delay in reality. In this dissertation, I propose a mathematical formulation to solve the problem and apply it to the clock skew scheduling problems as well as to the analysis of a given circuit, with a scalable speedup technique. Secondly, near-threshold computing is one of the promising concepts for energy-efficient operation of VLSI systems, but wide performance variation and nonlinearity to process variations block the proliferation. To cope with this, I propose a holistic hardware performance monitoring methodology for accurate timing prediction in a near-threshold voltage regime and advanced process technology. Lastly, an asynchronous circuit is one of the alternatives to the conventional synchronous style, and asynchronous pipeline circuit especially attractive because of its small design effort. This dissertation addresses the synthesis problem of lightening two-phase bundled-data asynchronous pipeline controllers, in which delay buffers are essential for guaranteeing the correct handshaking operation but incurs considerable area increase.타이밍 분석은 반도체 회로 개발 필수 과정 중 하나로, 최신 공정일수록 공정-전압-온도 변이 증가를 포함한 다양한 요인으로 하여금 그 중요성이 커지고 있다. 본 논문에서는 로직 및 피지컬 합성과 관련하여 세 가지 타이밍 분석 및 최적화 문제에 대해 다룬다. 첫째로, 오늘날 대부분의 정적 타이밍 분석은 모든 플립-플롭의 클럭-출력 딜레이가 고정된 값이라는 가정을 바탕으로 이루어졌다. 하지만 실제 클럭-출력 딜레이는 해당 플립-플롭의 셋업 및 홀드 스큐에 영향을 받는다. 본 논문에서는 이러한 특성을 수학적으로 정리하였으며, 이를 확장 가능한 속도 향상 기법과 더불어 주어진 회로의 타이밍 분석 및 클럭 스큐 스케쥴링 문제에 적용하였다. 둘째로, 유사 문턱 연산은 초고집적 회로 동작의 에너지 효율을 끌어 올릴 수 있다는 점에서 각광받지만, 큰 폭의 성능 변이 및 비선형성 때문에 널리 활용되고 있지 않다. 이를 해결하기 위해 유사 문턱 전압 영역 및 최신 공정 노드에서 보다 정확한 타이밍 예측을 위한 하드웨어 성능 모니터링 방법론 전반을 제안하였다. 마지막으로, 비동기 회로는 기존 동기 회로의 대안 중 하나로, 그 중에서도 비동기 파이프라인 회로는 비교적 적은 설계 노력만으로도 구현 가능하다는 장점이 있다. 본 논문에서는 2위상 묶음 데이터 프로토콜 기반 비동기 파이프라인 컨트롤러 상에서, 정확한 핸드셰이킹 통신을 위해 삽입된 딜레이 버퍼에 의한 면적 증가를 완화할 수 있는 합성 기법을 제시하였다.1 INTRODUCTION 1 1.1 Flexible Flip-Flop Timing Model 1 1.2 Hardware Performance Monitoring Methodology 4 1.3 Asynchronous Pipeline Controller 10 1.4 Contributions of this Dissertation 15 2 ANALYSIS AND OPTIMIZATION CONSIDERING FLEXIBLE FLIP-FLOP TIMING MODEL 17 2.1 Preliminaries 17 2.1.1 Terminologies 17 2.1.2 Timing Analysis 20 2.1.3 Clock-to-Q Delay Surface Modeling 21 2.2 Clock-to-Q Delay Interval Analysis 22 2.2.1 Derivation 23 2.2.2 Additional Constraints 26 2.2.3 Analysis: Finding Minimum Clock Period 28 2.2.4 Optimization: Clock Skew Scheduling 30 2.2.5 Scalable Speedup Technique 33 2.3 Experimental Results 37 2.3.1 Application to Minimum Clock Period Finding 37 2.3.2 Application to Clock Skew Scheduling 39 2.3.3 Efficacy of Scalable Speedup Technique 43 2.4 Summary 44 3 HARDWARE PERFORMANCE MONITORING METHODOLOGY AT NTC AND ADVANCED TECHNOLOGY NODE 45 3.1 Overall Flow of Proposed HPM Methodology 45 3.2 Prerequisites to HPM Methodology 47 3.2.1 BEOL Process Variation Modeling 47 3.2.2 Surrogate Model Preparation 49 3.3 HPM Methodology: Design Phase 52 3.3.1 HPM2PV Model Construction 52 3.3.2 Optimization of Monitoring Circuits Configuration 54 3.3.3 PV2CPT Model Construction 58 3.4 HPM Methodology: Post-Silicon Phase 60 3.4.1 Transfer Learning in Silicon Characterization Step 60 3.4.2 Procedures in Volume Production Phase 61 3.5 Experimental Results 62 3.5.1 Experimental Setup 62 3.5.2 Exploration of Monitoring Circuits Configuration 64 3.5.3 Effectiveness of Monitoring Circuits Optimization 66 3.5.4 Considering BEOL PVs and Uncertainty Learning 68 3.5.5 Comparison among Different Prediction Flows 69 3.5.6 Effectiveness of Prediction Model Calibration 71 3.6 Summary 73 4 LIGHTENING ASYNCHRONOUS PIPELINE CONTROLLER 75 4.1 Preliminaries and State-of-the-Art Work 75 4.1.1 Bundled-data vs. Dual-rail Asynchronous Circuits 75 4.1.2 Two-phase vs. Four-phase Bundled-data Protocol 76 4.1.3 Conventional State-of-the-Art Pipeline Controller Template 77 4.2 Delay Path Sharing for Lightening Pipeline Controller Template 78 4.2.1 Synthesizing Sharable Delay Paths 78 4.2.2 Validating Logical Correctness for Sharable Delay Paths 80 4.2.3 Reformulating Timing Constraints of Controller Template 81 4.2.4 Minimally Allocating Delay Buffers 87 4.3 In-depth Pipeline Controller Template Synthesis with Delay Path Reusing 88 4.3.1 Synthesizing Delay Path Units 88 4.3.2 Validating Logical Correctness of Delay Path Units 89 4.3.3 Updating Timing Constraints for Delay Path Units 91 4.3.4 In-depth Synthesis Flow Utilizing Delay Path Units 95 4.4 Experimental Results 99 4.4.1 Environment Setup 99 4.4.2 Piecewise Linear Modeling of Delay Path Unit Area 99 4.4.3 Comparison of Power, Performance, and Area 102 4.5 Summary 107 5 CONCLUSION 109 5.1 Chapter 2 109 5.2 Chapter 3 110 5.3 Chapter 4 110 Abstract (In Korean) 127Docto

Variability-Aware VLSI Design Automation For Nanoscale Technologies

As technology scaling enters the nanometer regime, design of large scale ICs gets more challenging due to shrinking feature sizes and increasing design complexity. Aggressive scaling causes significant degradation in reliability, increased susceptibility to fabrication and environmental randomness and increased dynamic and leakage power dissipation. In this work, we investigate these scaling issues in large scale integrated systems. This dissertation proposes to develop variability-aware design methodologies by proposing design analysis, design-time optimization, post-silicon tunability and runtime-adaptivity based optimization techniques for handling variability. We discuss our research in the area of variability-aware analysis, specifically focusing on the problem of statistical timing analysis. The first technique presents the concept of error budgeting that achieves significant runtime speedups during statistical timing analysis. The second work presents a general framework for non-linear non-Gaussian statistical timing analysis considering correlations. Further, we present our work on design-time optimization schemes that are applicable during physical synthesis. Firstly, we present a buffer insertion technique that considers wire-length uncertainty and proposes algorithms to perform probabilistic buffer insertion. Secondly, we present a stochastic optimization framework based on Monte-Carlo technique considering fabrication variability. This optimization framework can be applied to problems that can be modeled as linear programs without without imposing any assumptions on the nature of the variability. Subsequently, we present our work on post-silicon tunability based design optimization. This work presents a design management framework that can be used to balance the effort spent on pre-silicon (through gate sizing) and post-silicon optimization (through tunable clock-tree buffers) while maximizing the yield gains. Lastly, we present our work on variability-aware runtime optimization techniques. We look at the problem of runtime supply voltage scaling for dynamic power optimization, and propose a framework to consider the impact of variability on the reliability of such designs. We propose a probabilistic design synthesis technique where reliability of the design is a primary optimization metric

Using ant colony optimization for routing in microprocesors

Power consumption is an important constraint on VLSI systems. With the advancement in technology, it is now possible to pack a large range of functionalities into VLSI devices. Hence it is important to find out ways to utilize these functionalities with optimized power consumption. This work focuses on curbing power consumption at the design stage. This work emphasizes minimizing active power consumption by minimizing the load capacitance of the chip. Capacitance of wires and vias can be minimized using Ant Colony Optimization (ACO) algorithms. ACO provides a multi agent framework for combinatorial optimization problems and hence is used to handle multiple constraints of minimizing wire-length and vias to achieve the goal of minimizing capacitance and hence power consumption. The ACO developed here is able to achieve an 8% reduction of wire-length and 7% reduction in vias thereby providing a 7% reduction in total capacitance, compared to other state of the art routers

Network-on-Chip

Addresses the Challenges Associated with System-on-Chip Integration Network-on-Chip: The Next Generation of System-on-Chip Integration examines the current issues restricting chip-on-chip communication efficiency, and explores Network-on-chip (NoC), a promising alternative that equips designers with the capability to produce a scalable, reusable, and high-performance communication backbone by allowing for the integration of a large number of cores on a single system-on-chip (SoC). This book provides a basic overview of topics associated with NoC-based design: communication infrastructure design, communication methodology, evaluation framework, and mapping of applications onto NoC. It details the design and evaluation of different proposed NoC structures, low-power techniques, signal integrity and reliability issues, application mapping, testing, and future trends. Utilizing examples of chips that have been implemented in industry and academia, this text presents the full architectural design of components verified through implementation in industrial CAD tools. It describes NoC research and developments, incorporates theoretical proofs strengthening the analysis procedures, and includes algorithms used in NoC design and synthesis. In addition, it considers other upcoming NoC issues, such as low-power NoC design, signal integrity issues, NoC testing, reconfiguration, synthesis, and 3-D NoC design. This text comprises 12 chapters and covers: The evolution of NoC from SoC—its research and developmental challenges NoC protocols, elaborating flow control, available network topologies, routing mechanisms, fault tolerance, quality-of-service support, and the design of network interfaces The router design strategies followed in NoCs The evaluation mechanism of NoC architectures The application mapping strategies followed in NoCs Low-power design techniques specifically followed in NoCs The signal integrity and reliability issues of NoC The details of NoC testing strategies reported so far The problem of synthesizing application-specific NoCs Reconfigurable NoC design issues Direction of future research and development in the field of NoC Network-on-Chip: The Next Generation of System-on-Chip Integration covers the basic topics, technology, and future trends relevant to NoC-based design, and can be used by engineers, students, and researchers and other industry professionals interested in computer architecture, embedded systems, and parallel/distributed systems

Exploration and Design of Power-Efficient Networked Many-Core Systems

Multiprocessing is a promising solution to meet the requirements of near future applications. To get full benefit from parallel processing, a manycore system needs efficient, on-chip communication architecture. Networkon- Chip (NoC) is a general purpose communication concept that offers highthroughput, reduced power consumption, and keeps complexity in check by a regular composition of basic building blocks. This thesis presents power efficient communication approaches for networked many-core systems. We address a range of issues being important for designing power-efficient manycore systems at two different levels: the network-level and the router-level. From the network-level point of view, exploiting state-of-the-art concepts such as Globally Asynchronous Locally Synchronous (GALS), Voltage/ Frequency Island (VFI), and 3D Networks-on-Chip approaches may be a solution to the excessive power consumption demanded by today’s and future many-core systems. To this end, a low-cost 3D NoC architecture, based on high-speed GALS-based vertical channels, is proposed to mitigate high peak temperatures, power densities, and area footprints of vertical interconnects in 3D ICs. To further exploit the beneficial feature of a negligible inter-layer distance of 3D ICs, we propose a novel hybridization scheme for inter-layer communication. In addition, an efficient adaptive routing algorithm is presented which enables congestion-aware and reliable communication for the hybridized NoC architecture. An integrated monitoring and management platform on top of this architecture is also developed in order to implement more scalable power optimization techniques. From the router-level perspective, four design styles for implementing power-efficient reconfigurable interfaces in VFI-based NoC systems are proposed. To enhance the utilization of virtual channel buffers and to manage their power consumption, a partial virtual channel sharing method for NoC routers is devised and implemented. Extensive experiments with synthetic and real benchmarks show significant power savings and mitigated hotspots with similar performance compared to latest NoC architectures. The thesis concludes that careful codesigned elements from different network levels enable considerable power savings for many-core systems.Siirretty Doriast