Current sharing control strategy for IGBTs connected in parallel

This work focuses on current sharing between punch-through insulated gate bipolar transistors (IGBTs) connected in parallel and evaluates the mechanisms that allow overall current balancing. Two different control strategies are presented. These strategies are based on the modification of transistor gate-emitter control voltage VGE by using an active gate driver circuit. The first strategy relies on the calculation of the average value of the current flowing through all parallel-connected IGBTs. The second strategy is proposed by the authors on the basis of a current cross reference control scheme. Finally, the simulation and experimental results of the application of the two current sharing control algorithms are presented.Peer ReviewedPostprint (published version

Characterization and evaluation of a 6.5-kV silicon carbide bipolar diode module

This work presents a 6.5-kV 1-kA SiC bipolar diode module for megawatt-range medium voltage converters. The study comprises a review of SiC devices and bipolar diodes, a description of the die and module technology, device characterization and modelling and benchmark of the device at converter level. The effects of current change rate, temperature variation, and different insulated-gate bipolar transistor (IGBT) modules for the switching cell, as well as parasitic oscillations are discussed. A comparison of the results with a commercial Si diode (6.5 kV and 1.2 kA) is included. The benchmark consists of an estimation of maximum converter output power, maximum switching frequency, losses and efficiency in a three level (3L) neutral point clamped (NPC) voltage-source converter (VSC) operating with SiC and Si diodes. The use of a model predictive control (MPC) algorithm to achieve higher efficiency levels is also discussed. The analysed diode module exhibits a very good performance regarding switching loss reduction, which allows an increase of at least 10 % in the output power of a 6-MVA converter. Alternatively, the switching frequency can be increased by 41 %.:1 Introduction 2 State of the art of SiC devices and medium-voltage diodes 2.1 Silicon carbide diodes and medium-voltage modules 2.2 Medium-voltage power diodes 3 Characterization of the SiC PiN diode module 37 3.1 Introduction 3.2 Experimental setup 3.3 Experimental results: static behaviour 3.4 Experimental results: switching behaviour 3.5 Comparison with 6.5-kV silicon diode 3.6 Oscillations in the SiC diode 3.7 Summary 4 Comparison at converter level 4.1 Introduction 4.2 Power device modelling 4.3 Determination of maximum converter power rating 4.4 Analysis 4.5 Increased efficiency through model predictive control 4.6 Summary 5 Conclusio

New gate drive unit concepts for IGBTs and reverse conducting IGBTs

This work presents different novel gate drive unit (GDU) concepts for IGBT and reverse conducting IGBT (RC-IGBT). They have been experimentally tested with medium voltage class IGBT modules (1200...1700V/650…1400A) and a RC-IGBT module (1200V/200A). The switching behaviour of the RC-IGBT was investigated, and a new trigger pulse pattern to drive the RC-IGBT was developed, designed and implemented. The experimental results showed that the switching losses were reduced by 20% in the RC-IGBT compared to the switching losses of a standard diode. Two novel schemes are introduced to estimate the collector current through the IGBT, based on the measurement of the voltage across the internal stray inductance of the IGBT module. Furthermore, a GDU concept was derived to balance the on-state collector currents of parallel-connected IGBTs, reducing the current imbalance to 5%. Also, a new fast short circuit protection method (FSCP) for IGBT modules was developed, designed and implemented in another GDU, allowing turning-off the considered IGBT in less than 1μs, reducing the IGBT stress. Another scheme implemented in a GDU features an improved gate current switching profile of the IGBT, which reduces the switching losses by 25% compared to the standard switching method. In order to reduce the conduction losses, a GDU with an increased turn-on gate-emitter voltage (larger than 20 V) was investigated. In the investigated IGBT, the on-state losses were reduced by 18% when a gate-emitter voltage of 35V is used compared to when a gate-emitter voltage of 15V is used. All these new GDU concepts have been implemented with a simple and inexpensive electronic circuitry, which is an important feature for a possible industrial implementation

Mechanismen und Ursachen von Stromfehlverteilungen zwischen parallelen Hochvolt-IGBT

Zwischen parallelen IGBT treten Stromfehlverteilungen auf. Diese Fehlverteilungen haben einen Einfluss auf die Leistungsfähigkeit der Parallelschaltung. In dieser Arbeit werden für verschiedene Situation Mechanismen beschrieben, die zu Stromfehlverteilungen führen. Die betrachteten Situationen sind der Durchlass bei statischem und veränderlichem Laststrom, das Ein- sowie Ausschalten der Halbleiter, die Kurzschlussfälle I und II und das Abschalten eines Kurzschlussstroms. Für diese Situationen werden, neben der Beschreibung der Mechanismen, untersucht, wodurch diese ausgelöst werden.Current imbalances occur between paralleled IGBTs. Those imbalances affect the performance of the parallel operation. This thesis describes mechanisms which lead to such imbalances for different situations. The considered situations are on-state with static and varying load currents, the turn-on and -off of the semiconductors, short circuit types I and II and the turn-off of short circuit currents. In addition to the mechanisms which lead to current imbalances in those situations, their causes are described