6,222 research outputs found
Inhomogeneous mechanical losses in micro-oscillators with high reflectivity coating
We characterize the mechanical quality factor of micro-oscillators covered by
a highly reflective coating. We test an approach to the reduction of mechanical
losses, that consists in limiting the size of the coated area to reduce the
strain and the consequent energy loss in this highly dissipative component.
Moreover, a mechanical isolation stage is incorporated in the device. The
results are discussed on the basis of an analysis of homogeneous and
non-homogeneous losses in the device and validated by a set of Finite-Element
models. The contributions of thermoelastic dissipation and coating losses are
separated and the measured quality factors are found in agreement with the
calculated values, while the absence of unmodeled losses confirms that the
isolation element integrated in the device efficiently uncouples the dynamics
of the mirror from the support system. Also the resonant frequencies evaluated
by Finite-Element models are in good agreement with the experimental data, and
allow the estimation of the Young modulus of the coating. The models that we
have developed and validated are important for the design of oscillating
micro-mirrors with high quality factor and, consequently, low thermal noise.
Such devices are useful in general for high sensitivity sensors, and in
particular for experiments of quantum opto-mechanics
Intelligent Mechatronics through Learning:from Gaussian Processes to Repetitive Control and Adaptive Feedforward
A Review of Bayesian Methods in Electronic Design Automation
The utilization of Bayesian methods has been widely acknowledged as a viable
solution for tackling various challenges in electronic integrated circuit (IC)
design under stochastic process variation, including circuit performance
modeling, yield/failure rate estimation, and circuit optimization. As the
post-Moore era brings about new technologies (such as silicon photonics and
quantum circuits), many of the associated issues there are similar to those
encountered in electronic IC design and can be addressed using Bayesian
methods. Motivated by this observation, we present a comprehensive review of
Bayesian methods in electronic design automation (EDA). By doing so, we hope to
equip researchers and designers with the ability to apply Bayesian methods in
solving stochastic problems in electronic circuits and beyond.Comment: 24 pages, a draft version. We welcome comments and feedback, which
can be sent to [email protected]
Learning for Advanced Motion Control
Iterative Learning Control (ILC) can achieve perfect tracking performance for
mechatronic systems. The aim of this paper is to present an ILC design tutorial
for industrial mechatronic systems. First, a preliminary analysis reveals the
potential performance improvement of ILC prior to its actual implementation.
Second, a frequency domain approach is presented, where fast learning is
achieved through noncausal model inversion, and safe and robust learning is
achieved by employing a contraction mapping theorem in conjunction with
nonparametric frequency response functions. The approach is demonstrated on a
desktop printer. Finally, a detailed analysis of industrial motion systems
leads to several shortcomings that obstruct the widespread implementation of
ILC algorithms. An overview of recently developed algorithms, including
extensions using machine learning algorithms, is outlined that are aimed to
facilitate broad industrial deployment.Comment: 8 pages, 15 figures, IEEE 16th International Workshop on Advanced
Motion Control, 202
Virtual metrology for plasma etch processes.
Plasma processes can present dicult control challenges due to time-varying dynamics
and a lack of relevant and/or regular measurements. Virtual metrology (VM) is the
use of mathematical models with accessible measurements from an operating process to
estimate variables of interest. This thesis addresses the challenge of virtual metrology
for plasma processes, with a particular focus on semiconductor plasma etch.
Introductory material covering the essentials of plasma physics, plasma etching, plasma
measurement techniques, and black-box modelling techniques is rst presented for readers
not familiar with these subjects. A comprehensive literature review is then completed
to detail the state of the art in modelling and VM research for plasma etch processes.
To demonstrate the versatility of VM, a temperature monitoring system utilising a
state-space model and Luenberger observer is designed for the variable specic impulse
magnetoplasma rocket (VASIMR) engine, a plasma-based space propulsion system. The
temperature monitoring system uses optical emission spectroscopy (OES) measurements
from the VASIMR engine plasma to correct temperature estimates in the presence of
modelling error and inaccurate initial conditions. Temperature estimates within 2% of
the real values are achieved using this scheme.
An extensive examination of the implementation of a wafer-to-wafer VM scheme to estimate
plasma etch rate for an industrial plasma etch process is presented. The VM
models estimate etch rate using measurements from the processing tool and a plasma
impedance monitor (PIM). A selection of modelling techniques are considered for VM
modelling, and Gaussian process regression (GPR) is applied for the rst time for VM
of plasma etch rate. Models with global and local scope are compared, and modelling
schemes that attempt to cater for the etch process dynamics are proposed. GPR-based
windowed models produce the most accurate estimates, achieving mean absolute percentage
errors (MAPEs) of approximately 1:15%. The consistency of the results presented
suggests that this level of accuracy represents the best accuracy achievable for
the plasma etch system at the current frequency of metrology.
Finally, a real-time VM and model predictive control (MPC) scheme for control of
plasma electron density in an industrial etch chamber is designed and tested. The VM
scheme uses PIM measurements to estimate electron density in real time. A predictive
functional control (PFC) scheme is implemented to cater for a time delay in the VM
system. The controller achieves time constants of less than one second, no overshoot,
and excellent disturbance rejection properties. The PFC scheme is further expanded by
adapting the internal model in the controller in real time in response to changes in the
process operating point
Virtual metrology for plasma etch processes.
Plasma processes can present dicult control challenges due to time-varying dynamics
and a lack of relevant and/or regular measurements. Virtual metrology (VM) is the
use of mathematical models with accessible measurements from an operating process to
estimate variables of interest. This thesis addresses the challenge of virtual metrology
for plasma processes, with a particular focus on semiconductor plasma etch.
Introductory material covering the essentials of plasma physics, plasma etching, plasma
measurement techniques, and black-box modelling techniques is rst presented for readers
not familiar with these subjects. A comprehensive literature review is then completed
to detail the state of the art in modelling and VM research for plasma etch processes.
To demonstrate the versatility of VM, a temperature monitoring system utilising a
state-space model and Luenberger observer is designed for the variable specic impulse
magnetoplasma rocket (VASIMR) engine, a plasma-based space propulsion system. The
temperature monitoring system uses optical emission spectroscopy (OES) measurements
from the VASIMR engine plasma to correct temperature estimates in the presence of
modelling error and inaccurate initial conditions. Temperature estimates within 2% of
the real values are achieved using this scheme.
An extensive examination of the implementation of a wafer-to-wafer VM scheme to estimate
plasma etch rate for an industrial plasma etch process is presented. The VM
models estimate etch rate using measurements from the processing tool and a plasma
impedance monitor (PIM). A selection of modelling techniques are considered for VM
modelling, and Gaussian process regression (GPR) is applied for the rst time for VM
of plasma etch rate. Models with global and local scope are compared, and modelling
schemes that attempt to cater for the etch process dynamics are proposed. GPR-based
windowed models produce the most accurate estimates, achieving mean absolute percentage
errors (MAPEs) of approximately 1:15%. The consistency of the results presented
suggests that this level of accuracy represents the best accuracy achievable for
the plasma etch system at the current frequency of metrology.
Finally, a real-time VM and model predictive control (MPC) scheme for control of
plasma electron density in an industrial etch chamber is designed and tested. The VM
scheme uses PIM measurements to estimate electron density in real time. A predictive
functional control (PFC) scheme is implemented to cater for a time delay in the VM
system. The controller achieves time constants of less than one second, no overshoot,
and excellent disturbance rejection properties. The PFC scheme is further expanded by
adapting the internal model in the controller in real time in response to changes in the
process operating point
Characterization and Compensation of Network-Level Anomalies in Mixed-Signal Neuromorphic Modeling Platforms
Advancing the size and complexity of neural network models leads to an ever
increasing demand for computational resources for their simulation.
Neuromorphic devices offer a number of advantages over conventional computing
architectures, such as high emulation speed or low power consumption, but this
usually comes at the price of reduced configurability and precision. In this
article, we investigate the consequences of several such factors that are
common to neuromorphic devices, more specifically limited hardware resources,
limited parameter configurability and parameter variations. Our final aim is to
provide an array of methods for coping with such inevitable distortion
mechanisms. As a platform for testing our proposed strategies, we use an
executable system specification (ESS) of the BrainScaleS neuromorphic system,
which has been designed as a universal emulation back-end for neuroscientific
modeling. We address the most essential limitations of this device in detail
and study their effects on three prototypical benchmark network models within a
well-defined, systematic workflow. For each network model, we start by defining
quantifiable functionality measures by which we then assess the effects of
typical hardware-specific distortion mechanisms, both in idealized software
simulations and on the ESS. For those effects that cause unacceptable
deviations from the original network dynamics, we suggest generic compensation
mechanisms and demonstrate their effectiveness. Both the suggested workflow and
the investigated compensation mechanisms are largely back-end independent and
do not require additional hardware configurability beyond the one required to
emulate the benchmark networks in the first place. We hereby provide a generic
methodological environment for configurable neuromorphic devices that are
targeted at emulating large-scale, functional neural networks
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