Design and modelling of variability tolerant on-chip communication structures for future high performance system on chip designs

The incessant technology scaling has enabled the integration of functionally complex System-on-Chip (SoC) designs with a large number of heterogeneous systems on a single chip. The processing elements on these chips are integrated through on-chip communication structures which provide the infrastructure necessary for the exchange of data and control signals, while meeting the strenuous physical and design constraints. The use of vast amounts of on chip communications will be central to future designs where variability is an inherent characteristic. For this reason, in this thesis we investigate the performance and variability tolerance of typical on-chip communication structures. Understanding of the relationship between variability and communication is paramount for the designers; i.e. to devise new methods and techniques for designing performance and power efficient communication circuits in the forefront of challenges presented by deep sub-micron (DSM) technologies. The initial part of this work investigates the impact of device variability due to Random Dopant Fluctuations (RDF) on the timing characteristics of basic communication elements. The characterization data so obtained can be used to estimate the performance and failure probability of simple links through the methodology proposed in this work. For the Statistical Static Timing Analysis (SSTA) of larger circuits, a method for accurate estimation of the probability density functions of different circuit parameters is proposed. Moreover, its significance on pipelined circuits is highlighted. Power and area are one of the most important design metrics for any integrated circuit (IC) design. This thesis emphasises the consideration of communication reliability while optimizing for power and area. A methodology has been proposed for the simultaneous optimization of performance, area, power and delay variability for a repeater inserted interconnect. Similarly for multi-bit parallel links, bandwidth driven optimizations have also been performed. Power and area efficient semi-serial links, less vulnerable to delay variations than the corresponding fully parallel links are introduced. Furthermore, due to technology scaling, the coupling noise between the link lines has become an important issue. With ever decreasing supply voltages, and the corresponding reduction in noise margins, severe challenges are introduced for performing timing verification in the presence of variability. For this reason an accurate model for crosstalk noise in an interconnection as a function of time and skew is introduced in this work. This model can be used for the identification of skew condition that gives maximum delay noise, and also for efficient design verification

A Multiple-objective ILP based Global Routing Approach for VLSI ASIC Design

A VLSI chip can today contain hundreds of millions transistors and is expected to contain more than 1 billion transistors in the next decade. In order to handle this rapid growth in integration technology, the design procedure is therefore divided into a sequence of design steps. Circuit layout is the design step in which a physical realization of a circuit is obtained from its functional description. Global routing is one of the key subproblems of the circuit layout which involves finding an approximate path for the wires connecting the elements of the circuit without violating resource constraints. The global routing problem is NP-hard, therefore, heuristics capable of producing high quality routes with little computational effort are required as we move into the Deep Sub-Micron (DSM) regime. In this thesis, different approaches for global routing problem are first reviewed. The advantages and disadvantages of these approaches are also summarized. According to this literature review, several mathematical programming based global routing models are fully investigated. Quality of solution obtained by these models are then compared with traditional Maze routing technique. The experimental results show that the proposed model can optimize several global routing objectives simultaneously and effectively. Also, it is easy to incorporate new objectives into the proposed global routing model. To speedup the computation time of the proposed ILP based global router, several hierarchical methods are combined with the flat ILP based global routing approach. The experimental results indicate that the bottom-up global routing method can reduce the computation time effectively with a slight increase of maximum routing density. In addition to wire area, routability, and vias, performance and low power are also important goals in global routing, especially in deep submicron designs. Previous efforts that focused on power optimization for global routing are hindered by excessively long run times or the routing of a subset of the nets. Accordingly, a power efficient multi-pin global routing technique (PIRT) is proposed in this thesis. This integer linear programming based techniques strives to find a power efficient global routing solution. The results indicate that an average power savings as high as 32\% for the 130-nm technology can be achieved with no impact on the maximum chip frequency

Throughput-Centric Wave-Pipelined Interconnect Circuits for Gigascale Integration

The central thesis of this research is that VLSI interconnect design strategies should shift from using global wires that can support only a single binary transition during the latency of the line to global wires that can sustain multiple bits traveling simultaneously along the length of the line. It is shown in this thesis that such throughput-centric multibit transmission can be achieved by wave-pipelining the interconnects using repeaters. A holistic analysis of wave-pipelined interconnect circuits, along with the full-custom optimization of these circuits, is performed in this research. With the help of models and methodologies developed in this thesis, the design rules for repeater insertion are crafted to simultaneously optimize performance, power, and area of VLSI global interconnect networks through a simultaneous application of voltage scaling and wire sizing. A qualitative analysis of latency, throughput, signal integrity, power dissipation, and area is performed that compares the results of design optimizations in this work to those of conventional global interconnect circuits. The objective of this thesis is to study the circuit- and system-level opportunities of voltage scaling, wire sizing, and repeater insertion in wave-pipelined global interconnect networks that are implemented in deep submicron technologies.Ph.D.Committee Chair: Davis, Jeffrey; Committee Member: Kohl, Paul; Committee Member: Meindl, James; Committee Member: Swaminathan, Madhavan; Committee Member: Wills, D. Scot