Rapid mapping of digital integrated circuit logic gates via multi-spectral backside imaging

Modern semiconductor integrated circuits are increasingly fabricated at untrusted third party foundries. There now exist myriad security threats of malicious tampering at the hardware level and hence a clear and pressing need for new tools that enable rapid, robust and low-cost validation of circuit layouts. Optical backside imaging offers an attractive platform, but its limited resolution and throughput cannot cope with the nanoscale sizes of modern circuitry and the need to image over a large area. We propose and demonstrate a multi-spectral imaging approach to overcome these obstacles by identifying key circuit elements on the basis of their spectral response. This obviates the need to directly image the nanoscale components that define them, thereby relaxing resolution and spatial sampling requirements by 1 and 2 - 4 orders of magnitude respectively. Our results directly address critical security needs in the integrated circuit supply chain and highlight the potential of spectroscopic techniques to address fundamental resolution obstacles caused by the need to image ever shrinking feature sizes in semiconductor integrated circuits

Dependable Digitally-Assisted Mixed-Signal IPs Based on Integrated Self-Test & Self-Calibration

Heterogeneous SoC devices, including sensors, analogue and mixed-signal front-end circuits and the availability of massive digital processing capability, are being increasingly used in safety-critical applications like in the automotive, medical, and the security arena. Already a significant amount of attention has been paid in literature with respect to the dependability of the digital parts in heterogeneous SoCs. This is in contrast to especially the sensors and front-end mixed-signal electronics; these are however particular sensitive to external influences over time and hence determining their dependability. This paper provides an integrated SoC/IP approach to enhance the dependability. It will give an example of a digitally-assisted mixed-signal front-end IP which is being evaluated under its mission profile of an automotive tyre pressure monitoring system. It will be shown how internal monitoring and digitally-controlled adaptation by using embedded processors can help in terms of improving the dependability of this mixed-signal part under harsh conditions for a long time

Continuous maintenance and the future – Foundations and technological challenges

High value and long life products require continuous maintenance throughout their life cycle to achieve required performance with optimum through-life cost. This paper presents foundations and technologies required to offer the maintenance service. Component and system level degradation science, assessment and modelling along with life cycle ‘big data’ analytics are the two most important knowledge and skill base required for the continuous maintenance. Advanced computing and visualisation technologies will improve efficiency of the maintenance and reduce through-life cost of the product. Future of continuous maintenance within the Industry 4.0 context also identifies the role of IoT, standards and cyber security

Dependable reconfigurable multi-sensor poles for security

Wireless sensor network poles for security monitoring under harsh environments require a very high dependability as they are safety-critical [1]. An example of a multi-sensor pole is shown. Crucial attribute in these systems for security, especially in harsh environment, is a high robustness and guaranteed availability during lifetime. This environment could include molest. In this paper, two approaches are used which are applied simultaneously but are developed in different projects. \u