Design and Programming Methods for Reconfigurable Multi-Core Architectures using a Network-on-Chip-Centric Approach

A current trend in the semiconductor industry is the use of Multi-Processor Systems-on-Chip (MPSoCs) for a wide variety of applications such as image processing, automotive, multimedia, and robotic systems. Most applications gain performance advantages by executing parallel tasks on multiple processors due to the inherent parallelism. Moreover, heterogeneous structures provide high performance/energy efficiency, since application-specific processing elements (PEs) can be exploited. The increasing number of heterogeneous PEs leads to challenging communication requirements. To overcome this challenge, Networks-on-Chip (NoCs) have emerged as scalable on-chip interconnect. Nevertheless, NoCs have to deal with many design parameters such as virtual channels, routing algorithms and buffering techniques to fulfill the system requirements. This thesis highly contributes to the state-of-the-art of FPGA-based MPSoCs and NoCs. In the following, the three major contributions are introduced. As a first major contribution, a novel router concept is presented that efficiently utilizes communication times by performing sequences of arithmetic operations on the data that is transferred. The internal input buffers of the routers are exchanged with processing units that are capable of executing operations. Two different architectures of such processing units are presented. The first architecture provides multiply and accumulate operations which are often used in signal processing applications. The second architecture introduced as Application-Specific Instruction Set Routers (ASIRs) contains a processing unit capable of executing any operation and hence, it is not limited to multiply and accumulate operations. An internal processing core located in ASIRs can be developed in C/C++ using high-level synthesis. The second major contribution comprises application and performance explorations of the novel router concept. Models that approximate the achievable speedup and the end-to-end latency of ASIRs are derived and discussed to show the benefits in terms of performance. Furthermore, two applications using an ASIR-based MPSoC are implemented and evaluated on a Xilinx Zynq SoC. The first application is an image processing algorithm consisting of a Sobel filter, an RGB-to-Grayscale conversion, and a threshold operation. The second application is a system that helps visually impaired people by navigating them through unknown indoor environments. A Light Detection and Ranging (LIDAR) sensor scans the environment, while Inertial Measurement Units (IMUs) measure the orientation of the user to generate an audio signal that makes the distance as well as the orientation of obstacles audible. This application consists of multiple parallel tasks that are mapped to an ASIR-based MPSoC. Both applications show the performance advantages of ASIRs compared to a conventional NoC-based MPSoC. Furthermore, dynamic partial reconfiguration in terms of relocation and security aspects are investigated. The third major contribution refers to development and programming methodologies of NoC-based MPSoCs. A software-defined approach is presented that combines the design and programming of heterogeneous MPSoCs. In addition, a Kahn-Process-Network (KPN) –based model is designed to describe parallel applications for MPSoCs using ASIRs. The KPN-based model is extended to support not only the mapping of tasks to NoC-based MPSoCs but also the mapping to ASIR-based MPSoCs. A static mapping methodology is presented that assigns tasks to ASIRs and processors for a given KPN-model. The impact of external hardware components such as sensors, actuators and accelerators connected to the processors is also discussed which makes the approach of high interest for embedded systems

HERO: Heterogeneous Embedded Research Platform for Exploring RISC-V Manycore Accelerators on FPGA

Heterogeneous embedded systems on chip (HESoCs) co-integrate a standard host processor with programmable manycore accelerators (PMCAs) to combine general-purpose computing with domain-specific, efficient processing capabilities. While leading companies successfully advance their HESoC products, research lags behind due to the challenges of building a prototyping platform that unites an industry-standard host processor with an open research PMCA architecture. In this work we introduce HERO, an FPGA-based research platform that combines a PMCA composed of clusters of RISC-V cores, implemented as soft cores on an FPGA fabric, with a hard ARM Cortex-A multicore host processor. The PMCA architecture mapped on the FPGA is silicon-proven, scalable, configurable, and fully modifiable. HERO includes a complete software stack that consists of a heterogeneous cross-compilation toolchain with support for OpenMP accelerator programming, a Linux driver, and runtime libraries for both host and PMCA. HERO is designed to facilitate rapid exploration on all software and hardware layers: run-time behavior can be accurately analyzed by tracing events, and modifications can be validated through fully automated hard ware and software builds and executed tests. We demonstrate the usefulness of HERO by means of case studies from our research

Thermal Characterization of Next-Generation Workloads on Heterogeneous MPSoCs

Next-generation High-Performance Computing (HPC) applications need to tackle outstanding computational complexity while meeting latency and Quality-of-Service constraints. Heterogeneous Multi-Processor Systems-on-Chip (MPSoCs), equipped with a mix of general-purpose cores and reconfigurable fabric for custom acceleration of computational blocks, are key in providing the flexibility to meet the requirements of next-generation HPC. However, heterogeneity brings new challenges to efficient chip thermal management. In this context, accurate and fast thermal simulators are becoming crucial to understand and exploit the trade-offs brought by heterogeneous MPSoCs. In this paper, we first thermally characterize a next-generation HPC workload, the online video transcoding application, using a highly-accurate Infra-Red (IR) microscope. Second, we extend the 3D-ICE thermal simulation tool with a new generic heat spreader model capable of accurately reproducing package surface temperature, with an average error of 6.8% for the hot spots of the chip. Our model is used to characterize the thermal behaviour of the online transcoding application when running on a heterogeneous MPSoC. Moreover, by using our detailed thermal system characterization we are able to explore different application mappings as well as the thermal limits of such heterogeneous platforms