Magellan/Galileo solder joint failure analysis and recommendations

On or about November 10, 1988 an open circuit solder joint was discovered in the Magellan Radar digital unit (DFU) during integration testing at Kennedy Space Center (KSC). A detailed analysis of the cause of the failure was conducted at the Jet Propulsion Laboratory leading to the successful repair of many pieces of affected electronic hardware on both the Magellan and Galileo spacecraft. The problem was caused by the presence of high thermal coefficient of expansion heat sink and conformal coating materials located in the large (0.055 inch) gap between Dual Inline Packages (DIPS) and the printed wiring board. The details of the observed problems are described and recommendations are made for improved design and testing activities in the future

Ultra thin ultrafine-pitch chip-package interconnections for embedded chip last approach

Ever growing demands for portability and functionality have always governed the electronic technology innovations. IC downscaling with Moore s law and system miniaturization with System-On-Package (SOP) paradigm has resulted and will continue to result in ultraminiaturized systems with unprecedented functionality at reduced cost. The trend towards 3D silicon system integration is expected to downscale IC I/O pad pitches from 40µm to 1- 5 µm in future. Device- to- system board interconnections are typically accomplished today with either wire bonding or solders. Both of these are incremental and run into either electrical or mechanical barriers as they are extended to higher density of interconnections. Alternate interconnection approaches such as compliant interconnects typically require lengthy connections and are therefore limited in terms of electrical properties, although expected to meet the mechanical requirements. As supply currents will increase upto 220 A by 2012, the current density will exceed the maximum allowable current density of solders. The intrinsic delay and electromigration in solders are other daunting issues that become critical at nanometer size technology nodes. In addition, formation of intermetallics is also a bottleneck that poses significant mechanical issues. Recently, many research groups have investigated various techniques for copper-copper direct bonding. Typically, bonding is carried out at 400oC for 30 min followed by annealing for 30 min. High thermal budget in such process makes it less attractive for integrated systems because of the associated process incompatibilities. In the present study, copper-copper bonding at ultra fine-pitch using advanced nano-conductive and non-conductive adhesives is evaluated. The proposed copper-copper based interconnects using advanced conductive and non-conductive adhesives will be a new fundamental and comprehensive paradigm to solve all the four barriers: 1) I/O pitch 2) Electrical performance 3) Reliability and 4) Cost. This thesis investigates the mechanical integrity and reliability of copper-copper bonding using advanced adhesives through test vehicle fabrication and reliability testing. Test vehicles were fabricated using low cost electro-deposition techniques and assembled onto glass carrier. Experimental results show that proposed copper-copper bonding using advanced adhesives could potentially meet all the system performance requirements for the emerging micro/nano-systems.M.S.Committee Chair: Prof. Rao R Tummala; Committee Member: Dr. Jack Moon; Committee Member: Dr. P M Ra

Summary and recommendations on nuclear electric propulsion technology for the space exploration initiative

A project in Nuclear Electric Propulsion (NEP) technology is being established to develop the NEP technologies needed for advanced propulsion systems. A paced approach has been suggested which calls for progressive development of NEP component and subsystem level technologies. This approach will lead to major facility testing to achieve TRL-5 for megawatt NEP for SEI mission applications. This approach is designed to validate NEP power and propulsion technologies from kilowatt class to megawatt class ratings. Such a paced approach would have the benefit of achieving the development, testing, and flight of NEP systems in an evolutionary manner. This approach may also have the additional benefit of synergistic application with SEI extraterrestrial surface nuclear power applications

Investigation of low cost, high reliability sealing techniques for hybrid microcircuits, phase 1

A preliminary investigation was made to determine the feasibility of using adhesive package sealing for hybrid microcircuits. Major effort consisted of: (1) surveying representative hybrid manufacturers to assess the current use of adhesives for package sealing; (2) making a cost comparison of metallurgical versus adhesive package sealing; (3) determining the seal integrity of gold plated flatpack type packages sealed with selected adhesives, thermal shock, temperature cycling, mechanical shock, and constant acceleration test environments; and (4) defining a more comprehensive study to continue the evaluation of adhesives for package sealing. Results showed that 1.27 cm square gold plated flatpack type packages sealed with the film adhesives and the paste adhesive retained their seal integrity after all tests, and that similarly prepared 2.54 cm square packages retained their seal integrity after all tests except the 10,000 g's constant acceleration test. It is concluded that these results are encouraging, but by no means sufficient to establish the suitability of adhesives for sealing high reliability hybrid microcircuits

Modeling of a Single-Phase Liquid Cooling System for Power Electronics Applications

This work investigates the reliability of a single-phase, liquid cooling system used for the thermal management of a medium power level converter system. The system utilizes a plastic insert cold plate design to provide even cooling over the backside of a power electronics device by directing coolant through parallel serpentine channels. Material selection and compression set testing evaluated suitable elastomers for seals and polymers for the plastic insert. Computational fluid dynamics software was used to evaluate the thermal performance of the cooling system under ideal conditions as well as various wear out conditions (e.g. channel blockage, erosion of channel walls). Properties of used 50/50 ethylene glycol water coolant were evaluated to discover additional causes of reduced thermal performance. After completing the cooling system evaluation under initial and degraded conditions, the impact on a power module's operating temperature was correlated to an estimation of the device's reliability

Long life assurance study for manned spacecraft long life hardware. Volume 1: Summary of long life assurance guidelines

A long life assurance program for the development of design, process, test, and application guidelines for achieving reliable spacecraft hardware was conducted. The study approach consisted of a review of technical data performed concurrently with a survey of the aerospace industry. The data reviewed included design and operating characteristics, failure histories and solutions, and similar documents. The topics covered by the guidelines are reported. It is concluded that long life hardware is achieved through meticulous attention to many details and no simple set of rules can suffice