1,403 research outputs found

    Damage identification in structural health monitoring: a brief review from its implementation to the Use of data-driven applications

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    The damage identification process provides relevant information about the current state of a structure under inspection, and it can be approached from two different points of view. The first approach uses data-driven algorithms, which are usually associated with the collection of data using sensors. Data are subsequently processed and analyzed. The second approach uses models to analyze information about the structure. In the latter case, the overall performance of the approach is associated with the accuracy of the model and the information that is used to define it. Although both approaches are widely used, data-driven algorithms are preferred in most cases because they afford the ability to analyze data acquired from sensors and to provide a real-time solution for decision making; however, these approaches involve high-performance processors due to the high computational cost. As a contribution to the researchers working with data-driven algorithms and applications, this work presents a brief review of data-driven algorithms for damage identification in structural health-monitoring applications. This review covers damage detection, localization, classification, extension, and prognosis, as well as the development of smart structures. The literature is systematically reviewed according to the natural steps of a structural health-monitoring system. This review also includes information on the types of sensors used as well as on the development of data-driven algorithms for damage identification.Peer ReviewedPostprint (published version

    Optimal and Robust Design Method for Two-Chip Out-of-Plane Microaccelerometers

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    In this paper, an optimal and robust design method to implement a two-chip out-of-plane microaccelerometer system is presented. The two-chip microsystem consists of a MEMS chip for sensing the external acceleration and a CMOS chip for signal processing. An optimized design method to determine the device thickness, the sacrificial gap, and the vertical gap length of the M EMS sensing element is applied to minimize the fundamental noise level and also to achieve the robustness to the fabrication variations. In order to cancel out the offset and gain variations due to parasitic capacitances and process variations, a digitally trimmable architecture consisting of an 11 bit capacitor array is adopted in the analog front-end of the CMOS capacitive readout circuit. The out-of-plane microaccelerometer has the scale factor of 372 mV/g∼389 mV/g, the output nonlinearity of 0.43% FSO∼0.60% FSO, the input range of ±2 g and a bias instability of 122 μg∼229 μg. The signal-to-noise ratio and the noise equivalent resolution are measured to be 74.00 dB∼75.23 dB and 180 μg/rtHz∼190 μg/rtHz, respectively. The in-plane cross-axis sensitivities are measured to be 1.1%∼1.9% and 0.3%∼0.7% of the out-of-plane sensitivity, respectively. The results show that the optimal and robust design method for the MEMS sensing element and the highly trimmable capacity of the CMOS capacitive readout circuit are suitable to enhance the die-to-die uniformity of the packaged microsystem, without compromising the performance characteristics

    Self-Calibration Technique with Lightweight Algorithm for Thermal Drift Compensation in MEMS Accelerometers

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    Capacitive MEMS accelerometers have a high thermal sensitivity that drifts the output when subjected to changes in temperature. To improve their performance in applications with thermal variations, it is necessary to compensate for these effects. These drifts can be compensated using a lightweight algorithm by knowing the characteristic thermal parameters of the accelerometer (Temperature Drift of Bias and Temperature Drift of Scale Factor). These parameters vary in each accelerometer and axis, making an individual calibration necessary. In this work, a simple and fast calibration method that allows the characteristic parameters of the three axes to be obtained simultaneously through a single test is proposed. This method is based on the study of two specific orientations, each at two temperatures. By means of the suitable selection of the orientations and the temperature points, the data obtained can be extrapolated to the entire working range of the accelerometer. Only a mechanical anchor and a heat source are required to perform the calibration. This technique can be scaled to calibrate multiple accelerometers simultaneously. A lightweight algorithm is used to analyze the test data and obtain the compensation parameters. This algorithm stores only the most relevant data, reducing memory and computing power requirements. This allows it to be run in real time on a low-cost microcontroller during testing to obtain compensation parameters immediately. This method is aimed at mass factory calibration, where individual calibration with traditional methods may not be an adequate option. The proposed method has been compared with a traditional calibration using a six tests in orthogonal directions and a thermal chamber with a relative error difference of 0.3%

    Lightweight thermal compensation technique for MEMS capacitive accelerometer oriented to quasi-static measurements

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    The application of MEMS capacitive accelerometers is limited by its thermal dependence, and each accelerometer must be individually calibrated to improve its performance. In this work, a light calibration method based on theoretical studies is proposed to obtain two characteristic parameters of the sensor’s operation: the temperature drift of bias and the temperature drift of scale factor. This method requires less data to obtain the characteristic parameters, allowing a faster calibration. Furthermore, using an equation with fewer parameters reduces the computational cost of compensation. After studying six accelerometers, model LIS3DSH, their characteristic parameters are obtained in a temperature range between 15 °C and 55 °C. It is observed that the Temperature Drift of Bias (TDB) is the parameter with the greatest influence on thermal drift, reaching 1.3 mg/°C. The Temperature Drift of Scale Factor (TDSF) is always negative and ranges between 0 and −400 ppm/°C. With these parameters, the thermal drifts are compensated in tests with 20 °C of thermal variation. An average improvement of 47% was observed. In the axes where the thermal drift was greater than 1 mg/°C, the improvement was greater than 80%. Other sensor behaviors have also been analyzed, such as temporal drift (up to 1 mg/h for three hours) and self-heating (2–3 °C in the first hours with the corresponding drift). Thermal compensation has been found to reduce the effect of the latter in the first hours after power-up of the sensor by 43%

    A magneto-mechanical accelerometer based on magnetic tunnel junctions

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    Accelerometers have widespread applications and are an essential component in many areas such as automotive, consumer electronics and industrial applications. Most commercial accelerometers are based on micro-electromechanical system (MEMS) that are limited in downscaling and power consumption. Spintronics-based accelerometers have been proposed as alternatives, however, current proposals suffer from design limitations that result in reliability issues and high cost. Here we propose spintronic accelerometers with magnetic tunnel junctions (MTJs) as building block, which map accelerations into a measurable voltage across the MTJ terminals. The device exploits elastic and dipolar coupling as a sensing mechanism and the spintronic diode effect for the direct read out of the acceleration. The proposed technology represents a potentially competitive and scalable solution to current capacitive MEMS-based approaches that could lead to a step forward in many of the commercial applications.Comment: main document with 4 figures + supplemental informatio

    Performance Evaluation of an IoT Sensor Node for Health Monitoring of Artwork and Ancient Wooden Structures

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    In this paper, an IoT sensor node, based on smart Bluetooth low energy (BLE), for the health monitoring of artworks and large wooden structures is presented. The measurements from sensors on board the node are collected in real-time and sent to a remote gateway. The sensor node allows for the monitoring of environmental parameters, in particular, temperature and humidity, with accurate and robust integrated sensors. The developed node also embeds an accelerometer, which also allows other mechanical quantities (such as tilt) to be derived. This feature can be exploited to perform structural monitoring, exploiting the processing of data history to detect permanent displacements or deformations. The node is triggered by acceleration transients; therefore, it can also generate alarms related to shocks. This feature is crucial, for instance, in the case of transportation. The developed device is low-cost and has very good performance in terms of power consumption and compactness. A reliability assessment showed excellent durability, and experimental tests proved very satisfactory robustness against working condition variations. The presented results confirm that the developed device allows for the realization of pervasive monitoring systems, in the context of the IoT paradigm, with sensor nodes devoted to the monitoring of each artwork present in a museum or in a church

    Mems based bridge monitoring supported by image-assisted total station

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    In this study, the feasibility of Micro-Electro-Mechanical System (MEMS) accelerometers and an image-assisted total station (IATS) for short-and long-term deformation monitoring of bridge structures is investigated. The MEMS sensors of type BNO055 from Bosch as part of a geo-sensor network are mounted at different positions of the bridge structure. In order to degrade the impact of systematic errors on the acceleration measurements, the deterministic calibration parameters are determined for fixed positions using a KUKA youBot in a climate chamber over certain temperature ranges. The measured acceleration data, with a sampling frequency of 100 Hz, yields accurate estimates of the modal parameters over short time intervals but suffer from accuracy degradation for absolute position estimates with time. To overcome this problem, video frames of a passive target, attached in the vicinity of one of the MEMS sensors, are captured from an embedded on-axis telescope camera of the IATS of type Leica Nova MS50 MultiStation with a practical sampling frequency of 10 Hz. To identify the modal parameters such as eigenfrequencies and modal damping for both acceleration and displacement time series, a damped harmonic oscillation model is employed together with an autoregressive (AR) model of coloured measurement noise. The AR model is solved by means of a generalized expectation maximization (GEM) algorithm. Subsequently, the estimated model parameters from the IATS are used for coordinate updates of the MEMS sensor within a Kalman filter approach. The experiment was performed for a synthetic bridge and the analysis shows an accuracy level of sub-millimetre for amplitudes and much better than 0.1 Hz for the frequencies. © 2019 M. Omidalizarandi et al

    MEMS Accelerometers

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    Micro-electro-mechanical system (MEMS) devices are widely used for inertia, pressure, and ultrasound sensing applications. Research on integrated MEMS technology has undergone extensive development driven by the requirements of a compact footprint, low cost, and increased functionality. Accelerometers are among the most widely used sensors implemented in MEMS technology. MEMS accelerometers are showing a growing presence in almost all industries ranging from automotive to medical. A traditional MEMS accelerometer employs a proof mass suspended to springs, which displaces in response to an external acceleration. A single proof mass can be used for one- or multi-axis sensing. A variety of transduction mechanisms have been used to detect the displacement. They include capacitive, piezoelectric, thermal, tunneling, and optical mechanisms. Capacitive accelerometers are widely used due to their DC measurement interface, thermal stability, reliability, and low cost. However, they are sensitive to electromagnetic field interferences and have poor performance for high-end applications (e.g., precise attitude control for the satellite). Over the past three decades, steady progress has been made in the area of optical accelerometers for high-performance and high-sensitivity applications but several challenges are still to be tackled by researchers and engineers to fully realize opto-mechanical accelerometers, such as chip-scale integration, scaling, low bandwidth, etc
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