Placement driven retiming with a coupled edge timing model

Retiming is a widely investigated technique for performance optimization. It performs powerful modifications on a circuit netlist. However, often it is not clear, whether the predicted performance improvement will still be valid after placement has been performed. This paper presents a new retiming algorithm using a highly accurate timing model taking into account the effect of retiming on capacitive loads of single wires as well as fanout systems. We propose the integration of retiming into a timing-driven standard cell placement environment based on simulated annealing. Retiming is used as an optimization technique throughout the whole placement process. The experimental results show the benefit of the proposed approach. In comparison with the conventional design flow based on standard FEAS our approach achieved an improvement in cycle time of up to 34% and 17% on the average

Fast algorithms for retiming large digital circuits

The increasing complexity of VLSI systems and shrinking time to market requirements demand good optimization tools capable of handling large circuits. Retiming is a powerful transformation that preserves functionality, and can be used to optimize sequential circuits for a wide range of objective functions by judiciously relocating the memory elements. Leiserson and Saxe, who introduced the concept, presented algorithms for period optimization (minperiod retiming) and area optimization (minarea retiming). The ASTRA algorithm proposed an alternative view of retiming using the equivalence between retiming and clock skew optimization;The first part of this thesis defines the relationship between the Leiserson-Saxe and the ASTRA approaches and utilizes it for efficient minarea retiming of large circuits. The new algorithm, Minaret, uses the same linear program formulation as the Leiserson-Saxe approach. The underlying philosophy of the ASTRA approach is incorporated to reduce the number of variables and constraints in this linear program. This allows minarea retiming of circuits with over 56,000 gates in under fifteen minutes;The movement of flip-flops in control logic changes the state encoding of finite state machines, requiring the preservation of initial (reset) states. In the next part of this work the problem of minimizing the number of flip-flops in control logic subject to a specified clock period and with the guarantee of an equivalent initial state, is formulated as a mixed integer linear program. Bounds on the retiming variables are used to guarantee an equivalent initial state in the retimed circuit. These bounds lead to a simple method for calculating an equivalent initial state for the retimed circuit;The transparent nature of level sensitive latches enables level-clocked circuits to operate faster and require less area. However, this transparency makes the operation of level-clocked circuits very complex, and optimization of level-clocked circuits is a difficult task. This thesis also presents efficient algorithms for retiming large level-clocked circuits. The relationship between retiming and clock skew optimization for level-clocked circuits is defined and utilized to develop efficient retiming algorithms for period and area optimization. Using these algorithms a circuit with 56,000 gates could be retimed for minimum period in under twenty seconds and for minimum area in under 1.5 hours

Rewired retiming for flip-flop reduction and low power without delay penalty.

Jiang, Mingqi.Thesis (M.Phil.)--Chinese University of Hong Kong, 2009.Includes bibliographical references (leaves [49]-51).Abstract also in Chinese.Abstract --- p.iAcknowledgement --- p.iiiChapter 1 --- Introduction --- p.1Chapter 2 --- Rewiring Background --- p.4Chapter 2.1 --- REWIRE --- p.6Chapter 2.2 --- GBAW --- p.7Chapter 3 --- Retiming --- p.9Chapter 3.1 --- Min-Clock Period Retiming --- p.9Chapter 3.2 --- Min-Area Retiming --- p.17Chapter 3.3 --- Retiming for Low Power --- p.18Chapter 3.4 --- Retiming with Interconnect Delay --- p.22Chapter 4 --- Rewired Retiming for Flip-flop Reduction --- p.26Chapter 4.1 --- Motivation and Problem Formulation --- p.26Chapter 4.2 --- Retiming Indication --- p.29Chapter 4.3 --- Target Wire Selection --- p.31Chapter 4.4 --- Incremental Placement Update --- p.33Chapter 4.5 --- Optimization Flow --- p.36Chapter 4.6 --- Experimental Results --- p.38Chapter 5 --- Power Analysis for Rewired Retiming --- p.41Chapter 5.1 --- Power Model --- p.41Chapter 5.2 --- Experimental Results --- p.44Chapter 6 --- Conclusion --- p.47Bibliography --- p.5

Arbitrary Hardware/Software Trade Offs

This paper discusses a novel transformation-based design methodology and its use in the design of complex programmable VLSI systems. During the life-cycle of a complex system, the optimal trade-off between partially implementing in hardware or software is changing. This is due to varying system requirements (short time-to-market, low-cost, low-power, etc.) and improving the device technology. The proposed methodology allows such redesigns to be made using different hardware-software trade-offs, in a guaranteed correct wa

Custom Integrated Circuits

Contains reports on nine research projects.Analog Devices, Inc.International Business Machines CorporationJoint Services Electronics Program Contract DAAL03-89-C-0001U.S. Air Force - Office of Scientific Research Contract AFOSR 86-0164BDuPont CorporationNational Science Foundation Grant MIP 88-14612U.S. Navy - Office of Naval Research Contract N00014-87-K-0825American Telephone and TelegraphDigital Equipment CorporationNational Science Foundation Grant MIP 88-5876

Precomputation-based sequential logic optimization for low power

Thesis (M.S.)--Massachusetts Institute of Technology, Dept. of Electrical Engineering and Computer Science, 1994.Includes bibliographical references (leaves 69-71).by Mazhar Murtaza Alidina.M.S

Benchmarking for high-level synthesis

This paper discusses issues in benchmarking for synthesis, and suggests techniques for the comparison of benchmark descriptions, the synthesis tools used, as well as the synthesized designs finally generated. We propose a classification scheme for the assumptions made for the comparison of different synthesis tools, and present an Assumptions Chart that can be used to visualize different benchmarks, tools and synthesis results. We illustrate application of this Assumptions Chart using synthesis experiments that were conducted on some sample High-Level Synthesis Workshop bench-marks

Design-for-Test and Test Optimization Techniques for TSV-based 3D Stacked ICs

<p>As integrated circuits (ICs) continue to scale to smaller dimensions, long interconnects</p><p>have become the dominant contributor to circuit delay and a significant component of</p><p>power consumption. In order to reduce the length of these interconnects, 3D integration</p><p>and 3D stacked ICs (3D SICs) are active areas of research in both academia and industry.</p><p>3D SICs not only have the potential to reduce average interconnect length and alleviate</p><p>many of the problems caused by long global interconnects, but they can offer greater design</p><p>flexibility over 2D ICs, significant reductions in power consumption and footprint in</p><p>an era of mobile applications, increased on-chip data bandwidth through delay reduction,</p><p>and improved heterogeneous integration.</p><p>Compared to 2D ICs, the manufacture and test of 3D ICs is significantly more complex.</p><p>Through-silicon vias (TSVs), which constitute the dense vertical interconnects in a</p><p>die stack, are a source of additional and unique defects not seen before in ICs. At the same</p><p>time, testing these TSVs, especially before die stacking, is recognized as a major challenge.</p><p>The testing of a 3D stack is constrained by limited test access, test pin availability,</p><p>power, and thermal constraints. Therefore, efficient and optimized test architectures are</p><p>needed to ensure that pre-bond, partial, and complete stack testing are not prohibitively</p><p>expensive.</p><p>Methods of testing TSVs prior to bonding continue to be a difficult problem due to test</p><p>access and testability issues. Although some built-in self-test (BIST) techniques have been</p><p>proposed, these techniques have numerous drawbacks that render them impractical. In this dissertation, a low-cost test architecture is introduced to enable pre-bond TSV test through</p><p>TSV probing. This has the benefit of not needing large analog test components on the die,</p><p>which is a significant drawback of many BIST architectures. Coupled with an optimization</p><p>method described in this dissertation to create parallel test groups for TSVs, test time for</p><p>pre-bond TSV tests can be significantly reduced. The pre-bond probing methodology is</p><p>expanded upon to allow for pre-bond scan test as well, to enable both pre-bond TSV and</p><p>structural test to bring pre-bond known-good-die (KGD) test under a single test paradigm.</p><p>The addition of boundary registers on functional TSV paths required for pre-bond</p><p>probing results in an increase in delay on inter-die functional paths. This cost of test</p><p>architecture insertion can be a significant drawback, especially considering that one benefit</p><p>of 3D integration is that critical paths can be partitioned between dies to reduce their delay.</p><p>This dissertation derives a retiming flow that is used to recover the additional delay added</p><p>to TSV paths by test cell insertion.</p><p>Reducing the cost of test for 3D-SICs is crucial considering that more tests are necessary</p><p>during 3D-SIC manufacturing. To reduce test cost, the test architecture and test</p><p>scheduling for the stack must be optimized to reduce test time across all necessary test</p><p>insertions. This dissertation examines three paradigms for 3D integration - hard dies, firm</p><p>dies, and soft dies, that give varying degrees of control over 2D test architectures on each</p><p>die while optimizing the 3D test architecture. Integer linear programming models are developed</p><p>to provide an optimal 3D test architecture and test schedule for the dies in the 3D</p><p>stack considering any or all post-bond test insertions. Results show that the ILP models</p><p>outperform other optimization methods across a range of 3D benchmark circuits.</p><p>In summary, this dissertation targets testing and design-for-test (DFT) of 3D SICs.</p><p>The proposed techniques enable pre-bond TSV and structural test while maintaining a</p><p>relatively low test cost. Future work will continue to enable testing of 3D SICs to move</p><p>industry closer to realizing the true potential of 3D integration.</p>Dissertatio