402 research outputs found
A survey on scheduling and mapping techniques in 3D Network-on-chip
Network-on-Chips (NoCs) have been widely employed in the design of
multiprocessor system-on-chips (MPSoCs) as a scalable communication solution.
NoCs enable communications between on-chip Intellectual Property (IP) cores and
allow those cores to achieve higher performance by outsourcing their
communication tasks. Mapping and Scheduling methodologies are key elements in
assigning application tasks, allocating the tasks to the IPs, and organising
communication among them to achieve some specified objectives. The goal of this
paper is to present a detailed state-of-the-art of research in the field of
mapping and scheduling of applications on 3D NoC, classifying the works based
on several dimensions and giving some potential research directions
Design and Implementation of High QoS 3D-NoC using Modified Double Particle Swarm Optimization on FPGA
One technique to overcome the exponential growth bottleneck is to increase the number of cores on a processor, although having too many cores might cause issues including chip overheating and communication blockage. The problem of the communication bottleneck on the chip is presently effectively resolved by networks-on-chip (NoC). A 3D stack of chips is now possible, thanks to recent developments in IC manufacturing techniques, enabling to reduce of chip area while increasing chip throughput and reducing power consumption. The automated process associated with mapping applications to form three-dimensional NoC architectures is a significant new path in 3D NoC research. This work proposes a 3D NoC partitioning approach that can identify the 3D NoC region that has to be mapped. A double particle swarm optimization (DPSO) inspired algorithmic technique, which may combine the characteristics having neighbourhood search and genetic architectures, also addresses the challenge of a particle swarm algorithm descending into local optimal solutions. Experimental evidence supports the claim that this hybrid optimization algorithm based on Double Particle Swarm Optimisation outperforms the conventional heuristic technique in terms of output rate and loss in energy. The findings demonstrate that in a network of the same size, the newly introduced router delivers the lowest loss on the longest path. Three factors, namely energy, latency or delay, and throughput, are compared between the suggested 3D mesh ONoC and its 2D version. When comparing power consumption between 3D ONoC and its electronic and 2D equivalents, which both have 512 IP cores, it may save roughly 79.9% of the energy used by the electronic counterpart and 24.3% of the energy used by the latter. The network efficiency of the 3D mesh ONoC is simulated by DPSO in a variety of configurations. The outcomes also demonstrate an increase in performance over the 2D ONoC. As a flexible communication solution, Network-On-Chips (NoCs) have been frequently employed in the development of multiprocessor system-on-chips (MPSoCs). By outsourcing their communication activities, NoCs permit on-chip Intellectual Property (IP) cores to communicate with one another and function at a better level. The important components in assigning application duties, distributing the work to the IPs, and coordinating communication among them are mapping and scheduling methods. This study aims to present an entirely advanced form of research in the area of 3D NoC mapping and scheduling applications, grouping the results according to various parameters and offering several suggestions for further research
Physical parameter-aware Networks-on-Chip design
PhD ThesisNetworks-on-Chip (NoCs) have been proposed as a scalable, reliable
and power-efficient communication fabric for chip multiprocessors
(CMPs) and multiprocessor systems-on-chip (MPSoCs). NoCs determine
both the performance and the reliability of such systems, with a
significant power demand that is expected to increase due to developments
in both technology and architecture. In terms of architecture, an
important trend in many-core systems architecture is to increase the
number of cores on a chip while reducing their individual complexity.
This trend increases communication power relative to computation
power. Moreover, technology-wise, power-hungry wires are dominating
logic as power consumers as technology scales down. For these
reasons, the design of future very large scale integration (VLSI) systems
is moving from being computation-centric to communication-centric.
On the other hand, chip’s physical parameters integrity, especially
power and thermal integrity, is crucial for reliable VLSI systems. However,
guaranteeing this integrity is becoming increasingly difficult with
the higher scale of integration due to increased power density and operating
frequencies that result in continuously increasing temperature
and voltage drops in the chip. This is a challenge that may prevent
further shrinking of devices. Thus, tackling the challenge of power
and thermal integrity of future many-core systems at only one level
of abstraction, the chip and package design for example, is no longer
sufficient to ensure the integrity of physical parameters. New designtime
and run-time strategies may need to work together at different
levels of abstraction, such as package, application, network, to provide
the required physical parameter integrity for these large systems. This
necessitates strategies that work at the level of the on-chip network
with its rising power budget.
This thesis proposes models, techniques and architectures to improve
power and thermal integrity of Network-on-Chip (NoC)-based
many-core systems. The thesis is composed of two major parts: i)
minimization and modelling of power supply variations to improve
power integrity; and ii) dynamic thermal adaptation to improve thermal
integrity. This thesis makes four major contributions. The first is
a computational model of on-chip power supply variations in NoCs.
The proposed model embeds a power delivery model, an NoC activity
simulator and a power model. The model is verified with SPICE simulation
and employed to analyse power supply variations in synthetic
and real NoC workloads. Novel observations regarding power supply
noise correlation with different traffic patterns and routing algorithms
are found. The second is a new application mapping strategy aiming
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to minimize power supply noise in NoCs. This is achieved by defining
a new metric, switching activity density, and employing a force-based
objective function that results in minimizing switching density. Significant
reductions in power supply noise (PSN) are achieved with a low
energy penalty. This reduction in PSN also results in a better link timing
accuracy. The third contribution is a new dynamic thermal-adaptive
routing strategy to effectively diffuse heat from the NoC-based threedimensional
(3D) CMPs, using a dynamic programming (DP)-based distributed
control architecture. Moreover, a new approach for efficient extension
of two-dimensional (2D) partially-adaptive routing algorithms
to 3D is presented. This approach improves three-dimensional networkon-
chip (3D NoC) routing adaptivity while ensuring deadlock-freeness.
Finally, the proposed thermal-adaptive routing is implemented in
field-programmable gate array (FPGA), and implementation challenges,
for both thermal sensing and the dynamic control architecture are addressed.
The proposed routing implementation is evaluated in terms
of both functionality and performance.
The methodologies and architectures proposed in this thesis open a
new direction for improving the power and thermal integrity of future
NoC-based 2D and 3D many-core architectures
Network-on-Chip
Addresses the Challenges Associated with System-on-Chip Integration Network-on-Chip: The Next Generation of System-on-Chip Integration examines the current issues restricting chip-on-chip communication efficiency, and explores Network-on-chip (NoC), a promising alternative that equips designers with the capability to produce a scalable, reusable, and high-performance communication backbone by allowing for the integration of a large number of cores on a single system-on-chip (SoC). This book provides a basic overview of topics associated with NoC-based design: communication infrastructure design, communication methodology, evaluation framework, and mapping of applications onto NoC. It details the design and evaluation of different proposed NoC structures, low-power techniques, signal integrity and reliability issues, application mapping, testing, and future trends. Utilizing examples of chips that have been implemented in industry and academia, this text presents the full architectural design of components verified through implementation in industrial CAD tools. It describes NoC research and developments, incorporates theoretical proofs strengthening the analysis procedures, and includes algorithms used in NoC design and synthesis. In addition, it considers other upcoming NoC issues, such as low-power NoC design, signal integrity issues, NoC testing, reconfiguration, synthesis, and 3-D NoC design. This text comprises 12 chapters and covers: The evolution of NoC from SoC—its research and developmental challenges NoC protocols, elaborating flow control, available network topologies, routing mechanisms, fault tolerance, quality-of-service support, and the design of network interfaces The router design strategies followed in NoCs The evaluation mechanism of NoC architectures The application mapping strategies followed in NoCs Low-power design techniques specifically followed in NoCs The signal integrity and reliability issues of NoC The details of NoC testing strategies reported so far The problem of synthesizing application-specific NoCs Reconfigurable NoC design issues Direction of future research and development in the field of NoC Network-on-Chip: The Next Generation of System-on-Chip Integration covers the basic topics, technology, and future trends relevant to NoC-based design, and can be used by engineers, students, and researchers and other industry professionals interested in computer architecture, embedded systems, and parallel/distributed systems
Design of complex integrated systems based on networks-on-chip: Trading off performance, power and reliability
The steady advancement of microelectronics is associated with an escalating number of challenges for design engineers due to both the tiny dimensions and the enormous complexity of integrated systems. Against this background, this work deals with Network-On-Chip (NOC) as the emerging design paradigm to cope with diverse issues of nanotechnology. The detailed investigations within the chapters focus on the communication-centric aspects of multi-core-systems, whereas performance, power consumption as well as reliability are considered likewise as the essential design criteria
Driving the Network-on-Chip Revolution to Remove the Interconnect Bottleneck in Nanoscale Multi-Processor Systems-on-Chip
The sustained demand for faster, more powerful chips has been met by the
availability of chip manufacturing processes allowing for the integration of increasing
numbers of computation units onto a single die. The resulting outcome,
especially in the embedded domain, has often been called SYSTEM-ON-CHIP
(SoC) or MULTI-PROCESSOR SYSTEM-ON-CHIP (MP-SoC).
MPSoC design brings to the foreground a large number of challenges, one of
the most prominent of which is the design of the chip interconnection. With a
number of on-chip blocks presently ranging in the tens, and quickly approaching
the hundreds, the novel issue of how to best provide on-chip communication
resources is clearly felt.
NETWORKS-ON-CHIPS (NoCs) are the most comprehensive and scalable
answer to this design concern. By bringing large-scale networking concepts to
the on-chip domain, they guarantee a structured answer to present and future
communication requirements. The point-to-point connection and packet switching
paradigms they involve are also of great help in minimizing wiring overhead
and physical routing issues. However, as with any technology of recent inception,
NoC design is still an evolving discipline. Several main areas of interest
require deep investigation for NoCs to become viable solutions:
• The design of the NoC architecture needs to strike the best tradeoff among
performance, features and the tight area and power constraints of the onchip
domain.
• Simulation and verification infrastructure must be put in place to explore,
validate and optimize the NoC performance.
• NoCs offer a huge design space, thanks to their extreme customizability in
terms of topology and architectural parameters. Design tools are needed
to prune this space and pick the best solutions.
• Even more so given their global, distributed nature, it is essential to evaluate
the physical implementation of NoCs to evaluate their suitability for
next-generation designs and their area and power costs.
This dissertation performs a design space exploration of network-on-chip architectures,
in order to point-out the trade-offs associated with the design of
each individual network building blocks and with the design of network topology
overall. The design space exploration is preceded by a comparative analysis
of state-of-the-art interconnect fabrics with themselves and with early networkon-
chip prototypes. The ultimate objective is to point out the key advantages
that NoC realizations provide with respect to state-of-the-art communication
infrastructures and to point out the challenges that lie ahead in order to make
this new interconnect technology come true. Among these latter, technologyrelated
challenges are emerging that call for dedicated design techniques at all
levels of the design hierarchy. In particular, leakage power dissipation, containment
of process variations and of their effects. The achievement of the above
objectives was enabled by means of a NoC simulation environment for cycleaccurate
modelling and simulation and by means of a back-end facility for the
study of NoC physical implementation effects. Overall, all the results provided
by this work have been validated on actual silicon layout
Exploration and Design of Power-Efficient Networked Many-Core Systems
Multiprocessing is a promising solution to meet the requirements of near future applications. To get full benefit from parallel processing, a manycore system needs efficient, on-chip communication architecture. Networkon- Chip (NoC) is a general purpose communication concept that offers highthroughput, reduced power consumption, and keeps complexity in check by a regular composition of basic building blocks. This thesis presents power efficient communication approaches for networked many-core systems. We address a range of issues being important for designing power-efficient manycore systems at two different levels: the network-level and the router-level.
From the network-level point of view, exploiting state-of-the-art concepts such as Globally Asynchronous Locally Synchronous (GALS), Voltage/ Frequency Island (VFI), and 3D Networks-on-Chip approaches may be a solution to the excessive power consumption demanded by today’s and future many-core systems. To this end, a low-cost 3D NoC architecture, based on high-speed GALS-based vertical channels, is proposed to mitigate high peak temperatures, power densities, and area footprints of vertical interconnects in 3D ICs. To further exploit the beneficial feature of a negligible inter-layer distance of 3D ICs, we propose a novel hybridization scheme for inter-layer communication. In addition, an efficient adaptive routing algorithm is presented which enables congestion-aware and reliable communication for the hybridized NoC architecture. An integrated monitoring and management platform on top of this architecture is also developed in order to implement more scalable power optimization techniques.
From the router-level perspective, four design styles for implementing power-efficient reconfigurable interfaces in VFI-based NoC systems are proposed. To enhance the utilization of virtual channel buffers and to manage their power consumption, a partial virtual channel sharing method for NoC routers is devised and implemented.
Extensive experiments with synthetic and real benchmarks show significant power savings and mitigated hotspots with similar performance compared to latest NoC architectures. The thesis concludes that careful codesigned elements from different network levels enable considerable power savings for many-core systems.Siirretty Doriast
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