Remote Sensing and Control of Phase Qubits

We demonstrate a remote sensing design of phase qubits by separating the control and readout circuits from the qubit loop. This design improves measurement reliability because the control readout chip can be fabricated using more robust materials and can be reused to test different qubit chips. Typical qubit measurements such as Rabi oscillations, spectroscopy, and excited-state energy relaxation are presented.Comment: 3 pages, 4 figure

Faraday Cup Array Integrated with a Readout IC and Method for Manufacture Thereof

A detector array and method for making the detector array. The array includes a substrate including a plurality of trenches formed therein, and includes a plurality of collectors electrically isolated from each other, formed on the walls of the trenches, and configured to collect charge particles incident on respective ones of the collectors and to output from said collectors signals indicative of charged particle collection. The array includes a plurality of readout circuits disposed on a side of the substrate opposite openings to the collectors. The readout circuits are configured to read charge collection signals from respective ones of the plurality of collectors

Single Event Effects in CMOS Image Sensors

In this work, 3T Active Pixel Sensors (APS) are exposed to heavy ions (N, Ar, Kr, Xe), and Single Event Effects (SEE) are studied. Devices were fully functional during exposure, no Single Event Latch-up (SEL) or Single Event Functional Interrupt (SEFI) happened. However Single Event Transient (SET) effects happened on frames: line disturbances, and half or full circular clusters of white pixels. The collection of charges in cluster was investigated with arrays of two pixel width (7 and 10 \textmu{}m), with bulk and epitaxial substrates. This paper shows technological and design parameters involved in the transient events. It also shows that STARDUST simulation software can predict cluster obtained for bulk substrate devices. However, the discrepancies in epitaxial layer devices are large - which shows the need for an improved model

Low-power LVDS for digital readout circuits

This paper presents a mixed-signal LVDS driver in 90 nm CMOS technology. The designed LVDS core is to be used as a data link between Infrared Focal Plane Array (IRFPA) detector end and microprocessor input. Parallel data from 220 pixels of IRFPA is serialized by LVDS driver and read out to microprocessor. It also offers a reduced power consumption rate, high data transmission speed and utilizes dense placement of devices for area efficiency. The entire output driver circuit including input buffer draws 5mA while the output swing is 500mV at power supply of 1.2V for data rate of 6.4Gbps. Total LVDS chip area is 0.79 mm(2). Due to these features, the designed LVDS driver is suitable for purposes such as portable, high-speed imaging

CMOS Quantum Computing: Toward A Quantum Computer System-on-Chip

Quantum computing is experiencing the transition from a scientific to an engineering field with the promise to revolutionize an extensive range of applications demanding high-performance computing. Many implementation approaches have been pursued for quantum computing systems, where currently the main streams can be identified based on superconducting, photonic, trapped-ion, and semiconductor qubits. Semiconductor-based quantum computing, specifically using CMOS technologies, is promising as it provides potential for the integration of qubits with their control and readout circuits on a single chip. This paves the way for the realization of a large-scale quantum computing system for solving practical problems. In this paper, we present an overview and future perspective of CMOS quantum computing, exploring developed semiconductor qubit structures, quantum gates, as well as control and readout circuits, with a focus on the promises and challenges of CMOS implementation

Report of the sensor readout electronics panel

The findings of the Sensor Readout Electronics Panel are summarized in regard to technology assessment and recommended development plans. In addition to two specific readout issues, cryogenic readouts and sub-electron noise, the panel considered three advanced technology areas that impact the ability to achieve large format sensor arrays. These are mega-pixel focal plane packaging issues, focal plane to data processing module interfaces, and event driven readout architectures. Development in each of these five areas was judged to have significant impact in enabling the sensor performance desired for the Astrotech 21 mission set. Other readout issues, such as focal plane signal processing or other high volume data acquisition applications important for Eos-type mapping, were determined not to be relevant for astrophysics science goals

Studies of the performance of different front-end systems for flat-panel multi-anode PMTs with CsI(Tl) scintillator arrays

We have studied the performance of two different types of front-end systems for our gamma camera based on Hamamatsu H8500 (flat-panel 64 channels multi-anode PSPMT) with a CsI(Tl) scintillator array. The array consists of 64 pixels of $6\times6\times20{\rm mm}^3$ which corresponds to the anode pixels of H8500. One of the system is based on commercial ASIC chips in order to readout every anode. The others are based on resistive charge divider network between anodes to reduce readout channels. In both systems, each pixel (6mm) was clearly resolved by flood field irradiation of $^{137}$Cs. We also investigated the energy resolution of these systems and showed the performance of the cascade connection of resistive network between some PMTs for large area detectors.Comment: 9 pages, 6 figures, proceedings of the 7th International Workshop on Radiation Imaging Detectors (IWORID7), submitted to NIM

SNDR Limits of Oscillator-Based Sensor Readout Circuits.

This paper analyzes the influence of phase noise and distortion on the performance of oscillator-based sensor data acquisition systems. Circuit noise inherent to the oscillator circuit manifests as phase noise and limits the SNR. Moreover, oscillator nonlinearity generates distortion for large input signals. Phase noise analysis of oscillators is well known in the literature, but the relationship between phase noise and the SNR of an oscillator-based sensor is not straightforward. This paper proposes a model to estimate the influence of phase noise in the performance of an oscillator-based system by reflecting the phase noise to the oscillator input. The proposed model is based on periodic steady-state analysis tools to predict the SNR of the oscillator. The accuracy of this model has been validated by both simulation and experiment in a 130 nm CMOS prototype. We also propose a method to estimate the SNDR and the dynamic range of an oscillator-based readout circuit that improves by more than one order of magnitude the simulation time compared to standard time domain simulations. This speed up enables the optimization and verification of this kind of systems with iterative algorithms.This work has been funded by projects 610484 FP7-IAPP of the European Union and TEC2014-56879-R of CICYT, Spain. The authors would like to thank Roberto Nonis and Pedro Amaral from Infineon Technologies Austria AG for helpful discussions