Ensuring a High Quality Digital Device through Design for Testability

An electronic device is reliable if it is available for use most of the times throughout its life. The reliability can be affected by mishandling and use under abnormal operating conditions. High quality product cannot be achieved without proper verification and testing during the product development cycle. If the design is difficult to test, then it is very likely that most of the faults will not be detected before it is shipped to the customer. This paper describes how product quality can be improved by making the hardware design testable. Various designs for testability techniqueswere discussed. A three bit counter circuit was used to illustrate the benefits of design for testability by using scan chain methodology

Evolution of Test Programs Exploiting a FSM Processor Model

Microprocessor testing is becoming a challenging task, due to the increasing complexity of modern architectures. Nowadays, most architectures are tackled with a combination of scan chains and Software-Based Self-Test (SBST) methodologies. Among SBST techniques, evolutionary feedback-based ones prove effective in microprocessor testing: their main disadvantage, however, is the considerable time required to generate suitable test programs. A novel evolutionary-based approach, able to appreciably reduce the generation time, is presented. The proposed method exploits a high-level representation of the architecture under test and a dynamically built Finite State Machine (FSM) model to assess fault coverage without resorting to time-expensive simulations on low-level models. Experimental results, performed on an OpenRISC processor, show that the resulting test obtains a nearly complete fault coverage against the targeted fault mode

Innovative Techniques for Testing and Diagnosing SoCs

We rely upon the continued functioning of many electronic devices for our everyday welfare, usually embedding integrated circuits that are becoming even cheaper and smaller with improved features. Nowadays, microelectronics can integrate a working computer with CPU, memories, and even GPUs on a single die, namely System-On-Chip (SoC). SoCs are also employed on automotive safety-critical applications, but need to be tested thoroughly to comply with reliability standards, in particular the ISO26262 functional safety for road vehicles. The goal of this PhD. thesis is to improve SoC reliability by proposing innovative techniques for testing and diagnosing its internal modules: CPUs, memories, peripherals, and GPUs. The proposed approaches in the sequence appearing in this thesis are described as follows: 1. Embedded Memory Diagnosis: Memories are dense and complex circuits which are susceptible to design and manufacturing errors. Hence, it is important to understand the fault occurrence in the memory array. In practice, the logical and physical array representation differs due to an optimized design which adds enhancements to the device, namely scrambling. This part proposes an accurate memory diagnosis by showing the efforts of a software tool able to analyze test results, unscramble the memory array, map failing syndromes to cell locations, elaborate cumulative analysis, and elaborate a final fault model hypothesis. Several SRAM memory failing syndromes were analyzed as case studies gathered on an industrial automotive 32-bit SoC developed by STMicroelectronics. The tool displayed defects virtually, and results were confirmed by real photos taken from a microscope. 2. Functional Test Pattern Generation: The key for a successful test is the pattern applied to the device. They can be structural or functional; the former usually benefits from embedded test modules targeting manufacturing errors and is only effective before shipping the component to the client. The latter, on the other hand, can be applied during mission minimally impacting on performance but is penalized due to high generation time. However, functional test patterns may benefit for having different goals in functional mission mode. Part III of this PhD thesis proposes three different functional test pattern generation methods for CPU cores embedded in SoCs, targeting different test purposes, described as follows: a. Functional Stress Patterns: Are suitable for optimizing functional stress during I Operational-life Tests and Burn-in Screening for an optimal device reliability characterization b. Functional Power Hungry Patterns: Are suitable for determining functional peak power for strictly limiting the power of structural patterns during manufacturing tests, thus reducing premature device over-kill while delivering high test coverage c. Software-Based Self-Test Patterns: Combines the potentiality of structural patterns with functional ones, allowing its execution periodically during mission. In addition, an external hardware communicating with a devised SBST was proposed. It helps increasing in 3% the fault coverage by testing critical Hardly Functionally Testable Faults not covered by conventional SBST patterns. An automatic functional test pattern generation exploiting an evolutionary algorithm maximizing metrics related to stress, power, and fault coverage was employed in the above-mentioned approaches to quickly generate the desired patterns. The approaches were evaluated on two industrial cases developed by STMicroelectronics; 8051-based and a 32-bit Power Architecture SoCs. Results show that generation time was reduced upto 75% in comparison to older methodologies while increasing significantly the desired metrics. 3. Fault Injection in GPGPU: Fault injection mechanisms in semiconductor devices are suitable for generating structural patterns, testing and activating mitigation techniques, and validating robust hardware and software applications. GPGPUs are known for fast parallel computation used in high performance computing and advanced driver assistance where reliability is the key point. Moreover, GPGPU manufacturers do not provide design description code due to content secrecy. Therefore, commercial fault injectors using the GPGPU model is unfeasible, making radiation tests the only resource available, but are costly. In the last part of this thesis, we propose a software implemented fault injector able to inject bit-flip in memory elements of a real GPGPU. It exploits a software debugger tool and combines the C-CUDA grammar to wisely determine fault spots and apply bit-flip operations in program variables. The goal is to validate robust parallel algorithms by studying fault propagation or activating redundancy mechanisms they possibly embed. The effectiveness of the tool was evaluated on two robust applications: redundant parallel matrix multiplication and floating point Fast Fourier Transform

Towards Multidimensional Verification: Where Functional Meets Non-Functional

Trends in advanced electronic systems' design have a notable impact on design verification technologies. The recent paradigms of Internet-of-Things (IoT) and Cyber-Physical Systems (CPS) assume devices immersed in physical environments, significantly constrained in resources and expected to provide levels of security, privacy, reliability, performance and low power features. In recent years, numerous extra-functional aspects of electronic systems were brought to the front and imply verification of hardware design models in multidimensional space along with the functional concerns of the target system. However, different from the software domain such a holistic approach remains underdeveloped. The contributions of this paper are a taxonomy for multidimensional hardware verification aspects, a state-of-the-art survey of related research works and trends towards the multidimensional verification concept. The concept is motivated by an example for the functional and power verification dimensions.Comment: 2018 IEEE Nordic Circuits and Systems Conference (NORCAS): NORCHIP and International Symposium of System-on-Chip (SoC

The Art of Fault Injection

Classical greek philosopher considered the foremost virtues to be temperance, justice, courage, and prudence. In this paper we relate these cardinal virtues to the correct methodological approaches that researchers should follow when setting up a fault injection experiment. With this work we try to understand where the "straightforward pathway" lies, in order to highlight those common methodological errors that deeply influence the coherency and the meaningfulness of fault injection experiments. Fault injection is like an art, where the success of the experiments depends on a very delicate balance between modeling, creativity, statistics, and patience

Case Study: First-Time Success ASIC Design Methodology Applied to a Multi-Processor System-on-Chip

Achieving first-time success is crucial in the ASIC design league considering the soaring cost, tight time-to-market window, and competitive business environment. One key factor in ensuring first-time success is a well-defined ASIC design methodology. Here we propose a novel ASIC design methodology that has been proven for the RUMPS401 (Rahman University Multi-Processor System 401) Multiprocessor System-on-Chip (MPSoC) project. The MPSoC project is initiated by Universiti Tunku Abdul Rahman (UTAR) VLSI design center. The proposed methodology includes the use of Universal Verification Methodology (UVM). The use of electronic design automation (EDA) software during each step of the design methodology is also presented. The first-time success RUMPS401 demonstrates the use of the proposed ASIC design methodology and the good of using one. Especially this project is carried on in educational environment that is even more limited in budget, resources and know-how, compared to the business and industrial counterparts. Here a novel ASIC design methodology that is tailored to first-time success MPSoC is presented

Testability considerations for implementing an embedded memory subsystem

textThere are a number of testability considerations for VLSI design, but test coverage, test time, accuracy of test patterns and correctness of design information for DFD (Design for debug) are the most important ones in design with embedded memories. The goal of DFT (Design-for-Test) is to achieve zero defects. When it comes to the memory subsystem in SOCs (system on chips), many flavors of memory BIST (built-in self test) are able to get high test coverage in a memory, but often, no proper attention is given to the memory interface logic (shadow logic). Functional testing and BIST are the most prevalent tests for this logic, but functional testing is impractical for complicated SOC designs. As a result, industry has widely used at-speed scan testing to detect delay induced defects. Compared with functional testing, scan-based testing for delay faults reduces overall pattern generation complexity and cost by enhancing both controllability and observability of flip-flops. However, without proper modeling of memory, Xs are generated from memories. Also, when the design has chip compression logic, the number of ATPG patterns is increased significantly due to Xs from memories. In this dissertation, a register based testing method and X prevention logic are presented to tackle these problems. An important design stage for scan based testing with memory subsystems is the step to create a gate level model and verify with this model. The flow needs to provide a robust ATPG netlist model. Most industry standard CAD tools used to analyze fault coverage and generate test vectors require gate level models. However, custom embedded memories are typically designed using a transistor-level flow, there is a need for an abstraction step to generate the gate models, which must be equivalent to the actual design (transistor level). The contribution of the research is a framework to verify that the gate level representation of custom designs is equivalent to the transistor-level design. Compared to basic stuck-at fault testing, the number of patterns for at-speed testing is much larger than for basic stuck-at fault testing. So reducing test and data volume are important. In this desertion, a new scan reordering method is introduced to reduce test data with an optimal routing solution. With in depth understanding of embedded memories and flows developed during the study of custom memory DFT, a custom embedded memory Bit Mapping method using a symbolic simulator is presented in the last chapter to achieve high yield for memories.Electrical and Computer Engineerin

NEW ALGORITHM FOR BEHAVIOURAL TEST GENERATION

Significant efforts of the test design community have addressed the development of high level test generation algorithms in the last decade. The main problem originates in the insufficiently low gate level fault coverage of test sets generated at the behavioural or functional levels due to oversimplifications which result from the application of highly abstract and technology-independent fault models. In this paper a novel behavioural level test generation algorithm is presented effectively utilizing information on the circuit structure, which is extracted from the high level synthesis process. Experimental results show that the gate level fault coverage of the test sets generated by the new algorithm is similar to those assured by the gate level test generation algorithms

Mixed-level identification of fault redundancy in microprocessors

A new high-level implementation independent functional fault model for control faults in microprocessors is introduced. The fault model is based on the instruction set, and is specified as a set of data constraints to be satisfied by test data generation. We show that the high-level test, which satisfies these data constraints, will be sufficient to guarantee the detection of all non-redundant low level faults. The paper proposes a simple and fast simulation based method of generating test data, which satisfy the constraints prescribed by the proposed fault model, and a method of evaluating the high-level control fault coverage for the proposed fault model and for the given test. A method is presented for identification of the high-level redundant faults, and it is shown that a test, which provides 100% coverage of non-redundant high-level faults, will also guarantee 100% non-redundant SAF coverage, whereas all gate-level SAF not covered by the test are identified as redundant. Experimental results of test generation for the execution part of a microprocessor support the results presented in the paper.Comment: 2019 IEEE Latin American Test Symposium (LATS