4,899 research outputs found

    Tensor Computation: A New Framework for High-Dimensional Problems in EDA

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    Many critical EDA problems suffer from the curse of dimensionality, i.e. the very fast-scaling computational burden produced by large number of parameters and/or unknown variables. This phenomenon may be caused by multiple spatial or temporal factors (e.g. 3-D field solvers discretizations and multi-rate circuit simulation), nonlinearity of devices and circuits, large number of design or optimization parameters (e.g. full-chip routing/placement and circuit sizing), or extensive process variations (e.g. variability/reliability analysis and design for manufacturability). The computational challenges generated by such high dimensional problems are generally hard to handle efficiently with traditional EDA core algorithms that are based on matrix and vector computation. This paper presents "tensor computation" as an alternative general framework for the development of efficient EDA algorithms and tools. A tensor is a high-dimensional generalization of a matrix and a vector, and is a natural choice for both storing and solving efficiently high-dimensional EDA problems. This paper gives a basic tutorial on tensors, demonstrates some recent examples of EDA applications (e.g., nonlinear circuit modeling and high-dimensional uncertainty quantification), and suggests further open EDA problems where the use of tensor computation could be of advantage.Comment: 14 figures. Accepted by IEEE Trans. CAD of Integrated Circuits and System

    High performance algorithms for large scale placement problem

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    Placement is one of the most important problems in electronic design automation (EDA). An inferior placement solution will not only affect the chip’s performance but might also make it nonmanufacturable by producing excessive wirelength, which is beyond available routing resources. Although placement has been extensively investigated for several decades, it is still a very challenging problem mainly due to that design scale has been dramatically increased by order of magnitudes and the increasing trend seems unstoppable. In modern design, chips commonly integrate millions of gates that require over tens of metal routing layers. Besides, new manufacturing techniques bring out new requests leading to that multi-objectives should be optimized simultaneously during placement. Our research provides high performance algorithms for placement problem. We propose (i) a high performance global placement core engine POLAR; (ii) an efficient routability-driven placer POLAR 2.0, which is an extension of POLAR to deal with routing congestion; (iii) an ultrafast global placer POLAR 3.0, which explore parallelism on POLAR and can make full use of multi-core system; (iv) some efficient triple patterning lithography (TPL) aware detailed placement algorithms

    Custom Cell Placement Automation for Asynchronous VLSI

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    Asynchronous Very-Large-Scale-Integration (VLSI) integrated circuits have demonstrated many advantages over their synchronous counterparts, including low power consumption, elastic pipelining, robustness against manufacturing and temperature variations, etc. However, the lack of dedicated electronic design automation (EDA) tools, especially physical layout automation tools, largely limits the adoption of asynchronous circuits. Existing commercial placement tools are optimized for synchronous circuits, and require a standard cell library provided by semiconductor foundries to complete the physical design. The physical layouts of cells in this library have the same height to simplify the placement problem and the power distribution network. Although the standard cell methodology also works for asynchronous designs, the performance is inferior compared with counterparts designed using the full-custom design methodology. To tackle this challenge, we propose a gridded cell layout methodology for asynchronous circuits, in which the cell height and cell width can be any integer multiple of two grid values. The gridded cell approach combines the shape regularity of standard cells with the size flexibility of full-custom layouts. Therefore, this approach can achieve a better space utilization ratio and lower wire length for asynchronous designs. Experiments have shown that the gridded cell placement approach reduces area without impacting the routability. We have also used this placer to tape out a chip in a 65nm process technology, demonstrating that our placer generates design-rule clean results

    Concurrent optimization strategies for high-performance VLSI circuits

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    In the next generation of VLSI circuits, concurrent optimizations will be essential to achieve the performance challenges. In this dissertation, we present techniques for combining traditional timing optimization techniques to achieve a superior performance;The method of buffer insertion is used in timing optimization to either increase the driving power of a path in a circuit, or to isolate large capacitive loads that lie on noncritical or less critical paths. The procedure of transistor sizing selects the sizes of transistors within a circuit to achieve a given timing specification. Traditional design techniques perform these two optimizations as independent steps during synthesis, even though they are intimately linked and performing them in alternating steps is liable to lead to suboptimal solutions. The first part of this thesis presents a new approach for unifying transistor sizing with buffer insertion. Our algorithm achieve from 5% to 49% area reduction compared with the results of a standard transistor sizing algorithm;The next part of the thesis deals with the problem of collapsing gates for technology mapping. Two new techniques are proposed. The first method, the odd-level transistor replacement (OTR) method, performs technology mapping without the restriction of a fixed library size, and maps a circuit to a virtual library of complex static CMOS gates. The second technique, the Static CMOS/PTL method, uses a mix of static CMOS and pass transistor logic (PTL) to realize the circuit, using the relation between PTL and binary decision diagrams. The methods are very efficient and can handle all ISCAS\u2785 benchmark circuits in minutes. On average, it was found that the OTR method gave 40%, and the Static/PTL gave 50% delay reductions over SIS, with substantial area savings;Finally, we extend the technology mapping work to interleave it with placement in a single optimization. Conventional methods that perform these steps separately will not be adequate for next-generation circuits. Our approach presents an integrated solution to this problem, and shows an average of 28.19%, and a maximum of 78.42% improvement in the delay over a method that performs the two optimizations in separate steps

    GORDIAN: VLSI placement by quadratic programming and slicing optimization

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