Measuring the Thermal Conductivity of Flowing Liquid Samples Using the Three Omega Method

The thermal conductivity of a liquid is generally measured under conditions that suppress bulk flow in the sample. However, in situ measurement of the thermal conductivity of a flowing liquid would be useful in various scientific and engineering applications. This work demonstrates that a thermal wave technique, such as the three omega method, can effectively measure the thermal conductivity of flowing liquid if the frequency range is adjusted such that the thermal boundary layer is sufficiently thinner than the momentum boundary layer. A new dimensionless number was defined to assess the convection effects, and a criterion for thermal conductivity measurements was obtained for water flowing in a circular tube

The 1992 Shuttle Small Payloads Symposium

The 1992 Shuttle Small Payloads Symposium is a continuation of the Get Away Special Symposium convened from 1984 through 1988, and is proposed to continue as an annual conference. The focus of this conference is to educate potential Space Shuttle Payload Bay users as to the types of carrier systems provided and for current users to share experiment concepts

Traverse gravimeter experiment

A semiautomatic self-leveling lunar gravimeter has been designed for the Apollo 17 mission. This traverse gravimeter, which is completely self-contained and powered by an internal battery, was used to measure gravity at predetermined stops along the route of the Lunar Rover Vehicle. The gravity sensor is a vibrating string accelerometer (VSA) enclosed in a temperature-controlled oven and gimballed leveling assembly. This instrument is capable of resolving gravity differences as small as 0.035 milligal (1 mgal = 0.001 cm/s) on the moon and yet also is able to measure the earth's gravity field of 980,000 milligals. Twenty-two measurements were taken on the moon during the Apollo 17 mission, during which the VSA temperature never varied more than 0.005 C. The flight results indicate an instrument accuracy of better than 2 mgal

The 1986 Get Away Special Experimenter's Symposium

The 1986 Get Away Special (GAS) Experimenter's Symposium will provide a formal opportunity for GAS Experimenter's to share the results of their projects. The focus of this symposium is on payloads that will be flown in the future

Optimisation of the bolometric performances of the CUORE-0/CUORE and LUCIFER detectors for the neutrinoless double beta decay search.

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Advanced instrumentation: Technology database enhancement, volume 4, appendix G

The purpose of this task was to add to the McDonnell Douglas Space Systems Company's Sensors Database, including providing additional information on the instruments and sensors applicable to physical/chemical Environmental Control and Life Support System (P/C ECLSS) or Closed Ecological Life Support System (CELSS) which were not previously included. The Sensors Database was reviewed in order to determine the types of data required, define the data categories, and develop an understanding of the data record structure. An assessment of the MDSSC Sensors Database identified limitations and problems in the database. Guidelines and solutions were developed to address these limitations and problems in order that the requirements of the task could be fulfilled

TOWARDS INTEGRATION OF GRAPHENE IN ADVANCED CMOS INTERCONNECT TECHNOLOGY

The integration of graphene into existing state-of-the-art semiconductor manufacturing is a topic of worldwide interest. With its unprecedented electrical, thermal and mechanical properties, graphene is ideally suited for back-end of line (BEOL) technology to boost the performance of on-chip copper (Cu) interconnects. However, the lack of BEOL compatible methods has stymied the true evaluation of Cu/graphene hybrid (Cu-G) technology. The objectives of this thesis proposal are to demonstrate BEOL-compatible graphene growth techniques, and explore various avenues for practical integration of graphene in order to achieve better electrical, thermal and reliability metrics than traditional interconnect technology

Conceptual design for the Space Station Freedom fluid physics/dynamics facility

A study team at NASA's Lewis Research Center has been working on a definition study and conceptual design for a fluid physics and dynamics science facility that will be located in the Space Station Freedom's baseline U.S. Laboratory module. This modular, user-friendly facility, called the Fluid Physics/Dynamics Facility, will be available for use by industry, academic, and government research communities in the late 1990's. The Facility will support research experiments dealing with the study of fluid physics and dynamics phenomena. Because of the lack of gravity-induced convection, research into the mechanisms of fluids in the absence of gravity will help to provide a better understanding of the fundamentals of fluid processes. This document has been prepared as a final version of the handout for reviewers at the Fluid Physics/Dynamics Facility Assessment Workshop held at Lewis on January 24 and 25, 1990. It covers the background, current status, and future activities of the Lewis Project Study Team effort. It is a revised and updated version of a document entitled 'Status Report on the Conceptual Design for the Space Station Fluid Physics/Dynamics Facility', dated January 1990

3D Structuration Techniques of LTCC for Microsystems Applications

This thesis aimed at developing new 3D structuration techniques for a relatively recent new ceramic technology called LTCC, which stands for Low Temperature, Co-fired Ceramic. It is a material originally developed for the microelectronic packaging industry; its chemical and thermal stabilities make it suitable to military-grade and automotive applications, such as car ignition systems and Wi-Fi antennae (GHz frequencies). In recent years however, the research in ceramic microsystems has seen a growing interest for microfluidics, packaging, MEMS and sensors. Positioned at the crossing of classical thick-film technology on alumina substrate and of high temperature ceramics, this new kind of easily structurable ceramic is filling the technological and dimensional gap between microsystems in Silicon and classical "macro microsystems", in the sense that we can now structure microdevices in the range from 150 mm to 150 mm. In effect, LTCC technology allows printing conductors and other inks from 30 mm to many mm, structuration from 150 mm to 150 mm, and suspended structures with gaps down to 30 mm thanks to sacrificial materials. Sensors and their packaging are now merged in what we can call "functional packaging". The contributions of this thesis lie both in the technological aspects we brought, and in the innovative microfluidic sensors and devices created using our developed methods. These realizations would not have been possible with the standard lamination and firing techniques used so far. Hence, we allow circumventing the problems related to microfluidics circuitry: for instance, the difficulty to control final fired dimensions, the burden to produce cavities or open structures and the associated delaminations of tapes, and the absence of "recipe" for the industrialization of fluidic devices. The achievements of the presented research can be summarized as follows: The control of final dimensions is mastered after having studied the influence of lamination parameters, proving they have a considerable impact. It is now possible to have a set of design rules for a given material, deviating from suppliers' recommendations for the manufacture of slender structures requiring reduced lamination. A new lamination method was set up, permitting the assembly of complex microfluidic circuits that would normally not sustain standard lamination. The method is based on partial pseudo-isostatic sub-laminations, with the help of a constrained rubber, subsequently consolidated together with a final standard uniaxial lamination. The conflict between well bonded tapes and acceptable output geometry is greatly attenuated. We achieved the formulation of a new class of Sacrificial Volume Materials (SVM) to allow the fabrication of open structures on LTCC and on standard alumina substrates; these are indeed screen-printable inks made by mixing together mineral compounds, a glassy phase and experimental organic binders. This is an appreciable improvement over the so-far existing SVMs for LTCC, limited to closed structures such as thin membranes. An innovative industrial-grade potentially low-cost diagnostics multisensor for the pneumatic industry was developed, allowing the measurement of compressed air pressure, flow and temperature. The device is entirely mounted by soldering onto an electro-fluidic platform, de facto making it a true electro-fluidic SMD component in itself. It comprises additionally its own integrated SMD electronics, and thanks to standard hybrid assembly techniques, gets rid of external wires and tubings – this prowess was never achieved before. This opens the way for in situ diagnostics of industrial systems through the use of low-cost integrated sensors that directly output conditioned signals. In addition to the abovementioned developments, we propose an extensive review of existing Sacrificial Volume Materials, and we present numerous applications of LTCC to sensors and microsystems, such as capacitive microforce sensors, a chemical microreactor and microthrusters. In conclusion, LTCC is a technology adapted to the industrial production of microfluidic sensors and devices: the fabrication steps are all industrializable, with an easy transition from prototyping to mass production. Nonetheless, the structuration of channels, cavities and membranes obey complex rules; it is for the moment not yet possible to choose with accuracy the right manufacturing parameters without testing. Consequently, thorough engineering and mastering of the know-how of the whole manufacturing process is still necessary to produce efficient LTCC electro-fluidic circuits, in contrast with older techniques such as classical thick-film technology on alumina substrates or PCBs in FR-4. Notwithstanding its lack of maturity, the still young LTCC technology is promising in both the microelectronics and microfluidics domains. Engineers have a better understanding of the structuration possibilities, of the implications of lamination, and of the most common problems; they have now all the tools in hand to create complex microfluidics circuits